Intel

EP2AGZ225FF35I4G - Arria II GZ FPGA 225K LE 1152-FBGA | Intel

MPN: EP2AGZ225FF35I4G ✓ Aktif

1152-ball FineLine BGA (FBGA) Package I4 Speed Yes (per Arria II GZ family) Memory

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EP2AGZ225FF35I4G Ringkasan

The Intel (formerly Altera) EP2AGZ225FF35I4G is a high-density Arria II GZ field-programmable gate array (FPGA) built on a 40 nm low-power process, integrating approximately 224,000 logic elements with 554 user I/Os in a 1152-ball FineLine BGA (FBGA) package and rated for industrial (-40C to +100C) operation. The 'I4' speed/temperature grade, 'GZ' series designation, and 1152-FBGA package code 'FF35' together identify the largest-density member of the cost-optimized Arria II family, which pairs a programmable logic engine with embedded transceivers and DSP blocks for mid-range signal-processing designs.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O cells interconnected by a routing fabric that the designer configures after manufacture using a hardware-description language (HDL). FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (fixed architecture, software-defined) on the flexibility/performance continuum, occupying the programmable-logic layer of the broader integrated-circuit taxonomy: logic IC -> programmable logic -> FPGA. Arria II GZ specifically targets transceiver-rich applications needing multi-gigabit serial links at lower power than the Stratix family.

Key features of the EP2AGZ225FF35I4G include a 40 nm process node, a logic-element density in the ~225 K LE class, embedded transceiver channels supporting multi-gigabit serial protocols, dedicated DSP blocks for high-throughput fixed- and floating-point math, and on-chip memory blocks suitable for buffering and FIFO applications. The device integrates PCI Express hard IP and external memory interface controllers, allowing direct attachment of DDR3 memory and simplifying board-level design. The 1152-ball FineLine BGA package exposes 554 user I/Os, providing generous fan-out for high-pin-count peripherals.

Architecturally, the Arria II GZ uses an 8-input adaptive logic module (ALM), a hierarchical routing fabric with fractional paths to reduce congestion, and hard PCIe Gen1/Gen2 blocks; combined, these features deliver deterministic timing closure and lower dynamic power than the previous-generation Arria II GX at comparable logic density. Designers typically target this device with Quartus Prime software.

Typical applications include high-speed serial backplane bridging, wireless baseband preprocessing, video broadcast infrastructure, test-and-measurement equipment with custom trigger logic, and defense/aerospace signal processing. Industrial-grade temperature rating also suits outdoor or ruggedized deployments.

When designing with this device, pay close attention to power-rail sequencing (multiple VCC rails of different voltages), transceiver reference-clock jitter, and BGA breakout routing - the 1152-ball FBGA requires HDI PCB stack-ups with microvia-in-pad for escape. Reference Altera's Arria II GZ handbook for transceiver and memory-interface guidelines.

This page synthesizes distributor pricing, drop-in alternatives within the Arria II GZ family, and practical board-design considerations not consolidated in the manufacturer datasheet.

Pilihan pengganti yang segera untuk EP2AGZ225FF35I4G — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera EP2AGZ225FF35I4G (sama faktor bentuk dan kaki) — berbeza dalam Package, Speed Grade, RoHS Status, Embedded Memory, Transceivers.

EP2AGZ225FF35C3G

Altera

Package: 1152-ball Flip-Chip BGA (FF35)

Speed Grade: C3

RoHS Status: Compliant