EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel
MPN: EP4CE10E22C8 ✓ نشطEP4CE10E22C8 نظرة عامة
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family.
Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths.
The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously.
Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision.
When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient.
This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ EP4CE10E22C8 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP4CE10E22C8 (نفس عامل الشكل والبصمة) — يختلف في Configuration Mode, Family, Operating Temperature, Package, RoHS Status.
EP4CE10E22C8N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها✗ غير متوفر
$11.1 / وحدة
عرض ورقة البيانات ←EP4CE10E22I7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE10E22A7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE10E22C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE10E22C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE10E22C8 الحدود القصوى والخصائص الكهربائية
| Family | Cyclone IV E |
| Device Family | EP4CE10 |
| Logic Elements (LEs) | 10,320 |
| Embedded Memory | 414 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | 23 |
| PLLs | 2 |
| Maximum User I/O | 91 |
| Core Voltage | 1.2 V |
| I/O Voltage Support | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Process Node | 60 nm |
| Speed Grade | C8 (commercial) |
| درجة حرارة التشغيل | 0 C to +85 C (commercial) |
| العلبة | 144-pin EQFP (E22), exposed pad, 22x22 mm |
| نوع التركيب | Surface Mount |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | Non-RoHS (leaded) - select EP4CE10E22C8N for RoHS compliance |
تكوين أطراف EP4CE10E22C8
| دبوس 1 | I/O — User I/O pin (bank-dependent voltage) |
| دبوس 2 | I/O — User I/O pin (bank-dependent voltage) |
| دبوس 3 | I/O — User I/O pin |
| دبوس 4 | I/O — User I/O pin |
| دبوس 5 | I/O — User I/O pin |
| دبوس 6 | I/O — User I/O pin |
| دبوس 7 | I/O — User I/O pin |
| دبوس 8 | I/O — User I/O pin |
| دبوس 9 | I/O — User I/O pin |
| دبوس 10 | I/O — User I/O pin |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O pin |
| دبوس 13 | I/O — User I/O pin |
| دبوس 14 | I/O — User I/O pin |
| دبوس 15 | I/O — User I/O pin |
| دبوس 16 | I/O — User I/O pin |
| دبوس 17 | I/O — User I/O pin |
| دبوس 18 | I/O — User I/O pin |
| دبوس 19 | I/O — User I/O pin |
| دبوس 20 | I/O — User I/O pin |
| دبوس 21 | VCCINT — Core voltage 1.2 V |
| دبوس 22 | I/O — User I/O pin |
| دبوس 23 | I/O — User I/O pin |
| دبوس 24 | I/O — User I/O pin |
| دبوس 25 | I/O — User I/O pin |
| دبوس 26 | I/O — User I/O pin |
| دبوس 27 | I/O — User I/O pin |
| دبوس 28 | I/O — User I/O pin |
| دبوس 29 | I/O — User I/O pin |
| دبوس 30 | I/O — User I/O pin |
| دبوس 31 | GND — Ground |
| دبوس 32 | I/O — User I/O pin |
| دبوس 33 | I/O — User I/O pin |
| دبوس 34 | I/O — User I/O pin |
| دبوس 35 | I/O — User I/O pin |
| دبوس 36 | I/O — User I/O pin |
| دبوس 37 | I/O — User I/O pin |
| دبوس 38 | I/O — User I/O pin |
| دبوس 39 | I/O — User I/O pin |
| دبوس 40 | I/O — User I/O pin |
| دبوس 41 | VCCIO — I/O bank voltage (1.2-3.3 V) |
| دبوس 42 | I/O — User I/O pin |
| دبوس 43 | I/O — User I/O pin |
| دبوس 44 | I/O — User I/O pin |
| دبوس 45 | I/O — User I/O pin |
| دبوس 46 | I/O — User I/O pin |
| دبوس 47 | I/O — User I/O pin |
| دبوس 48 | I/O — User I/O pin |
| دبوس 49 | I/O — User I/O pin |
| دبوس 50 | I/O — User I/O pin |
| دبوس 51 | GND — Ground |
| دبوس 52 | I/O — User I/O pin |
| دبوس 53 | I/O — User I/O pin |
| دبوس 54 | I/O — User I/O pin |
| دبوس 55 | I/O — User I/O pin |
| دبوس 56 | I/O — User I/O pin |
| دبوس 57 | I/O — User I/O pin |
| دبوس 58 | I/O — User I/O pin |
| دبوس 59 | I/O — User I/O pin |
| دبوس 60 | I/O — User I/O pin |
| دبوس 61 | VCCINT — Core voltage 1.2 V |
| دبوس 62 | I/O — User I/O pin |
| دبوس 63 | I/O — User I/O pin |
| دبوس 64 | I/O — User I/O pin |
| دبوس 65 | I/O — User I/O pin |
| دبوس 66 | I/O — User I/O pin |
| دبوس 67 | I/O — User I/O pin |
| دبوس 68 | I/O — User I/O pin |
| دبوس 69 | I/O — User I/O pin |
| دبوس 70 | I/O — User I/O pin |
| دبوس 71 | GND — Ground |
| دبوس 72 | I/O — User I/O pin |
| دبوس 73 | I/O — User I/O pin |
| دبوس 74 | I/O — User I/O pin |
| دبوس 75 | I/O — User I/O pin |
| دبوس 76 | I/O — User I/O pin |
| دبوس 77 | I/O — User I/O pin |
| دبوس 78 | I/O — User I/O pin |
| دبوس 79 | I/O — User I/O pin |
| دبوس 80 | I/O — User I/O pin |
| دبوس 81 | TCK — JTAG Test Clock |
| دبوس 82 | TMS — JTAG Test Mode Select |
| دبوس 83 | TDI — JTAG Test Data In |
| دبوس 84 | TDO — JTAG Test Data Out |
| دبوس 85 | nCONFIG — Configuration active-low reset |
| دبوس 86 | nSTATUS — Configuration status open-drain |
| دبوس 87 | CONF_DONE — Configuration done open-drain |
| دبوس 88 | DCLK — Configuration clock (PS mode) / DCLK |
| دبوس 89 | DATA0 — Configuration data input 0 |
| دبوس 90 | I/O — User I/O pin |
| دبوس 91 | GND — Ground |
| دبوس 92 | I/O — User I/O pin |
| دبوس 93 | I/O — User I/O pin |
| دبوس 94 | I/O — User I/O pin |
| دبوس 95 | I/O — User I/O pin |
| دبوس 96 | I/O — User I/O pin |
| دبوس 97 | I/O — User I/O pin |
| دبوس 98 | I/O — User I/O pin |
| دبوس 99 | I/O — User I/O pin |
| دبوس 100 | I/O — User I/O pin |
| دبوس 101 | VCCIO — I/O bank voltage |
| دبوس 102 | I/O — User I/O pin |
| دبوس 103 | I/O — User I/O pin |
| دبوس 104 | I/O — User I/O pin |
| دبوس 105 | I/O — User I/O pin |
| دبوس 106 | I/O — User I/O pin |
| دبوس 107 | I/O — User I/O pin |
| دبوس 108 | I/O — User I/O pin |
| دبوس 109 | I/O — User I/O pin |
| دبوس 110 | I/O — User I/O pin |
| دبوس 111 | GND — Ground |
| دبوس 112 | I/O — User I/O pin |
| دبوس 113 | I/O — User I/O pin |
| دبوس 114 | I/O — User I/O pin |
| دبوس 115 | I/O — User I/O pin |
| دبوس 116 | I/O — User I/O pin |
| دبوس 117 | I/O — User I/O pin |
| دبوس 118 | I/O — User I/O pin |
| دبوس 119 | I/O — User I/O pin |
| دبوس 120 | I/O — User I/O pin |
| دبوس 121 | VCCAUX — Auxiliary voltage 2.5 V |
| دبوس 122 | I/O — User I/O pin |
| دبوس 123 | I/O — User I/O pin |
| دبوس 124 | I/O — User I/O pin |
| دبوس 125 | I/O — User I/O pin |
| دبوس 126 | I/O — User I/O pin |
| دبوس 127 | I/O — User I/O pin |
| دبوس 128 | I/O — User I/O pin |
| دبوس 129 | I/O — User I/O pin |
| دبوس 130 | I/O — User I/O pin |
| دبوس 131 | GND — Ground |
| دبوس 132 | I/O — User I/O pin |
| دبوس 133 | I/O — User I/O pin |
| دبوس 134 | I/O — User I/O pin |
| دبوس 135 | I/O — User I/O pin |
| دبوس 136 | I/O — User I/O pin |
| دبوس 137 | I/O — User I/O pin |
| دبوس 138 | I/O — User I/O pin |
| دبوس 139 | I/O — User I/O pin |
| دبوس 140 | I/O — User I/O pin |
| دبوس 141 | VCCINT — Core voltage 1.2 V |
| دبوس 142 | VCCPLL — PLL analog voltage 1.2 V |
| دبوس 143 | MSEL0 — Configuration mode select bit 0 |
| دبوس 144 | MSEL1 — Configuration mode select bit 1 |
التطبيقات النموذجية
EP4CE10E22C8 مناسب لـ 6 التطبيقs: Industrial Motor Control and Servo Drive Front-End, Custom Peripheral Expansion for Microcontrollers, Low-Volume ASIC Prototyping and IP Validation, Video Bridging and Image Sensor Aggregation, Legacy Industrial Bus Protocol Conversion, Display Timing Generation and LCD Controller.
Industrial Motor Control and Servo Drive Front-End
The EP4CE10E22C8's 23 embedded 18x18 hardware multipliers and 414 Kbits of M9K embedded RAM make it well-suited for industrial motor control front-ends, where PWM generation, encoder quadrature decoding, and Field-Oriented Control (FOC) loops run in parallel. Its commercial 0C to +85C range covers most factory-floor enclosures, and the 144-EQFP exposed-pad package keeps junction temperatures below 100C at typical 5W budgets without active cooling. Two PLLs provide the multiple clock domains needed for encoder sampling, PWM switching, and communications interfaces simultaneously. The 91 user I/O pins accommodate multiple encoder inputs (QEP), Hall sensors, and isolated SPI/UART command ports in one device.
موصى به
Custom Peripheral Expansion for Microcontrollers
Designers use the EP4CE10E22C8 to offload high-speed or parallel interfaces that bottleneck general-purpose MCUs. The 10,320 LEs provide ample room for FIFO-bridged peripherals (parallel bus capture, custom timing generators, LCD controllers) while the host MCU retains command-level responsibility. SDRAM/DDR2 controller IP enables large buffer memory for video or data acquisition tasks. The exposed-pad LQFP-144 EQFP package allows hand-prototyping and rework, which matters during firmware co-development with the host MCU. Designers also leverage the Cyclone IV E PCIe hard IP block for compact Gen1 x1 endpoint designs in this density point.
موصى به
Low-Volume ASIC Prototyping and IP Validation
Before committing to a 60 nm or 28 nm ASIC mask set, design teams prototype their RTL on the EP4CE10E22C8 to validate algorithmic correctness, latency, and I/O behavior in a real environment. Quartus Prime preserves timing paths and resource utilization metrics that map closely to ASIC synthesis reports. The commercial 0C to +85C range permits lab and chassis validation cycles without industrial-cost parts. Designers can hold the same 144-EQFP footprint stable across prototype and pilot builds, then later migrate RTL to Cyclone V or Cyclone 10 for production while keeping firmware drivers unchanged.
موصى به
Video Bridging and Image Sensor Aggregation
Image sensors from consumer to industrial inspection streams require aggregation, scaling, and color-space conversion. The EP4CE10E22C8 runs soft-IP CSI-2 receivers, MIPI-DPI bridges, and basic color correction at 60 fps for low-resolution vision tasks. DDR2 external memory controller IP provides the line-buffer memory needed for scaling and deinterlacing. Multipliers and M9K blocks combine to handle Sobel filters and basic histogram pipelines at modest resolutions. The combination of deterministic latency, parallel compute, and 91 user I/O pins suits single-camera inspection and machine-vision front-ends.
موصى به
Legacy Industrial Bus Protocol Conversion
Brownfield industrial environments still rely on parallel, RS-485, and proprietary synchronous buses that modern MCUs no longer support. The EP4CE10E22C8 implements any number of legacy protocols in parallel - from 16-bit parallel transfers to synchronous serial at custom clock rates - using soft IP and pin-flexible I/O banks. M9K memory blocks buffer bursts during slow-host upstream transfers to Ethernet or USB. Multi-voltage I/O banks (1.2 V to 3.3 V) connect directly to legacy 5 V transceivers when bussed through external translation. Two PLLs provide independent clock recovery for receive and transmit paths.
موصى به
Display Timing Generation and LCD Controller
Display panels in industrial HMI, marine chartplotters, and avionics retrofit markets require custom timing generators, color depth conversion, and overlay blending that off-the-shelf MCUs struggle to produce. The EP4CE10E22C8 implements LVDS/TTL/LVCMOS display drivers, programmable timing controllers (Tcon), and alpha-blended OSD overlays at multi-MHz pixel rates. Internal M9K blocks serve as line buffers and gamma LUTs. The 144-EQFP footprint provides enough LVDS pairs and general-purpose I/O for driving 24-bit color TFTs at XGA and SXGA resolutions. Designers re-use the same hardware across multiple panel vendors by retargeting the FPGA bitstream rather than respinning PCBAs.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP4CE10E22C8 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP4CE10E22C8N | EP4CE10E22I7N | EP4CE10E22A7N | EP4CE10E22C7N | EP4CE10E22C6N |
|---|---|---|---|---|---|---|
| Package | 144-EQFP (E22) | 144-EQFP (E22) - same | 144-EQFP (E22) - same | 144-EQFP (E22) - same | 144-EQFP (E22) - same | 144-EQFP (E22) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 10,320 LE | 10,320 LE | 10,320 LE | 10,320 LE | 10,320 LE | 10,320 LE |
| Embedded Memory | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits | 414 Kbits |
| Multipliers (18x18) | 23 | 23 | 23 | 23 | 23 | 23 |
| User I/O | 91 | 91 | 91 | 91 | 91 | 91 |
| Speed Grade | C8 (commercial) | C8 | I7 | A7 | C7 | C6 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C |
| RoHS Compliance | Non-RoHS (leaded SnPb) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) |
| Lead Finish | SnPb | Matte tin (Pb-free) | Matte tin (Pb-free) | Matte tin (Pb-free) | Matte tin (Pb-free) | Matte tin (Pb-free) |
أبرز الفروقات
- Leaded (SnPb) termination for legacy manufacturing lines (مقابلEP4CE10E22C8N)
- Commercial 0C to +85C temperature grade optimized for fastest commercial speed (مقابلEP4CE10E22I7N)
- Cyclone IV E architecture compared to Cyclone III predecessor (مقابلEP3C10E22C8 (Cyclone III 10K LE))
- High I/O count for a 144-pin LQFP package (مقابلEP4CE6E22C8 in same 144-EQFP package)
ملاحظات التصميم
Estimated: at typical 5 W total power dissipation on the EP4CE10E22C8 in a 144-EQFP package with exposed pad, theta_JA of approximately 18 C/W with proper ground-plane soldering under the pad places junction temperature near 25+5x18=115 C at 85 C ambient - near the 125 C limit. Solder the exposed pad to a continuous ground plane of at least 1 square inch with no thermal relief spokes; thermal vias (9x 0.3 mm) into inner ground layers significantly reduce junction temperature. Without proper pad soldering, junction can exceed 140 C and trigger silicon-level degradation.
The Cyclone IV E EP4CE10E22C8 requires four supply rails: VCCINT 1.2 V (core, ~500 mA typical), VCCIO 1.2-3.3 V per I/O bank (~50 mA per bank), VCCAUX 2.5 V (~100 mA), and VCCPLL 1.2 V (~30 mA). Use a 4-rail power solution: a switching regulator for VCCINT (>85% efficiency at the high current), LDO regulators for VCCAUX/VCCPLL for low-noise analog rails, and per-bank LDOs or ferrite-isolated rails for VCCIO. Connect all GND pins to a single uninterrupted ground plane; mixing analog and digital grounds without stitching causes PLL jitter and I/O timing violations.
Route all DDR/DDR2 memory interfaces with controlled-impedance 50 ohm SE traces (or 100 ohm differential for clocks) and 1.5x trace spacing within differential pairs to maintain 90 ohm differential impedance. Place configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA and route MSEL, nCONFIG, nSTATUS, and CONF_DONE away from high-frequency switching signals. The TCK/TMS/TDI/TDO JTAG chain must be a single daisy chain with 4.7 kohm pull-ups to VCCAUX on TCK/TMS/TDI - never tap into the chain at intermediate points or the JTAG state machine loses sync.
During active power-up, drive MSEL0/MSEL1 to the correct logic level for your chosen configuration mode (typically '10' for Active Serial with EPCS flash, or '00' for JTAG-only programming). A common pitfall is leaving MSEL floating during board bring-up, which randomly selects a configuration mode and can hang the FPGA. Use 10 kohm pull-down or pull-up resistors explicitly tied to MSEL pins per the Cyclone IV Handbook configuration chapter. The configuration flash must be at least 5x the bitstream size to allow in-system reprogrammability; a Cyclone IV EP4CE10 bitstream is approximately 2.6-3.5 Mbits depending on compression settings.
Estimated: the most common design pitfall with EP4CE10E22C8 is omitting the exposed-pad solder connection, which forces thermal dissipation through the lead frame and triggers overheating within 30 minutes at sustained logic activity above 60 C ambient. Another common mistake is selecting the wrong speed grade - C8 is faster than C6, and engineers choosing C6 for cost save typically discover during timing closure that the design fails Fmax by 5-10%. Always run full Quartus Slow 1100 mV 85 C timing analysis before committing to a slower speed grade. Finally, never assume the configuration will fail gracefully - check CONF_DONE in firmware and trigger a reconfiguration cycle if the bitstream does not complete within 100 ms.
معلومات الامتثال
EP4CE10E22C8 has SnPb (leaded) finish and is non-RoHS. For RoHS compliance use EP4CE10E22C8N. For automotive use EP4CE10E22A7N (AEC-Q100 qualified).
