Intel

EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel

Name: EP4CE10E22C8 - 10K LE Cyclone IV E FPGA, 144-LQFP | Intel
Brand: Intel
SKU: EP4CE10E22C8

MPN： EP4CE10E22C8 ✓ 啟用中

1.2 V Vdss 144-pin EQFP (E22), exposed pad, 22x22 mm Package C8 (commercial) Speed 414 Kbits (M9K blocks) Memory

索取報價

MOQ： 1 |

查看資料表 (PDF) 查看替代品

數量

EP4CE10E22C8 概覽

The Intel (Altera) EP4CE10E22C8 is a low-power, low-cost Cyclone IV E FPGA featuring 10,320 logic elements housed in a 144-pin EQFP (E22) exposed-pad LQFP package. Built on a 60 nm process node, it integrates 414 Kbits of embedded RAM, 23 embedded 18x18 multipliers, two PLLs, and 91 user I/O pins, making it a versatile general-purpose logic device for cost-sensitive and power-constrained designs.

A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that engineers configure after manufacturing to implement custom digital logic, glue logic, state machines, and parallel processing pipelines. Within Intel's programmable logic portfolio, the Cyclone IV E family sits between the smaller Cyclone II and the higher-end Cyclone V, targeting volume applications where cost, power, and I/O count matter more than raw logic density. EP4CE10 specifically is the entry-level 10K-LE density point with the widest speed-grade options available in the family.

Key features include support for DDR/DDR2/QDRII+ external memory interfaces via soft IP, dedicated hardware multipliers suitable for DSP signal processing, and a 1.2 V core supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V standards. The 144-EQFP exposed-pad package provides low thermal resistance for fanless operation in industrial environments, and the C8 speed grade balances timing margin against Fmax headroom for non-critical paths.

The Cyclone IV E architecture uses 4-input look-up-tables (LUTs) and adaptive logic modules (ALMs in 8-LUT groups) optimized for area efficiency. Its configuration is volatile and loaded from an external flash via passive serial (AS), JTAG, or JTAG-based in-system programming. Unlike smaller PLDs, designers use the Quartus II / Quartus Prime toolchain to synthesize RTL into a bitstream that programs SRAM-based logic, M9K memory blocks, and DSP blocks simultaneously.

Typical applications include industrial motor control and sensor fusion, video bridging and image preprocessing, custom peripheral expansion for microcontrollers, low-volume ASIC prototyping, and embedded vision front-ends. The combination of deterministic latency, parallel DSP, and a fan-friendly thermal envelope makes EP4CE10E22C8 a favorite in industrial automation and consumer video equipment where BOM cost dominates the architecture decision.

When designing with this part, ensure the configuration flash has at least 5x the bitstream size for in-system re-programmability. Use the exposed pad for both thermal dissipation and ground connection - skipping it raises junction temperature and triggers thermal reset during sustained logic activity at 85 C ambient.

This page synthesizes distributor pricing, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet alone.

直接替換替代品，適用於 EP4CE10E22C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP4CE10E22C8 （相同外形與佔位） — 差異在於 Configuration Mode, Family, Operating Temperature, Package, RoHS Status.

EP4CE10E22C8N

Intel

Configuration Mode: JTAG / AS / AP / PS

Family: EP4CE10

Operating Temperature: 0C to +85C

比較對象 EP4CE10E22C8 →

EP4CE10E22C8N

✅ 直接替換 ⚠️ 規格未經驗證

Intel

📦 144-EQFP (E22)

Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✗ 缺貨

$11.1 / 單位

查看資料表 →

EP4CE10E22I7N

✅ 直接替換 ⚠️ 規格未經驗證

📦 144-EQFP (E22)

industrial grade -40C to +100C (vs 0C/+85C) and speed grade 7 (slower than 8); pin-to-pin compatible, same 10,320 LEs

📋 參考替代品（不在目錄中）

EP4CE10E22A7N

✅ 直接替換 ⚠️ 規格未經驗證

Altera

📦 144-EQFP (E22)

Cyclone IV E FPGA · 10,320 elements · 645 CLBs · 472.5 MHz · 91 I/O · 1.2 V · 144-pin LQFP exposed pad · 144 leads

聯絡詢價

查看資料表 →

EP4CE10E22C7N

✅ 直接替換 ⚠️ 規格未經驗證

📦 144-EQFP (E22)

speed grade 7 (slightly slower) and lead-free; same 10,320 LEs, identical footprint

📋 參考替代品（不在目錄中）

EP4CE10E22C6N

✅ 直接替換 ⚠️ 規格未經驗證

Altera

📦 144-EQFP (E22)

Field Programmable Gate Array (FPGA) · Cyclone IV E · EP4CE10 (E22) · 10,320 · 91 · 1.2 V · 144-LQFP Exposed Pad · HLFQFP

聯絡詢價

查看資料表 →

EP4CE10E22C8 最大額定值與電氣特性

Family	Cyclone IV E
Device Family	EP4CE10
Logic Elements (LEs)	10,320
Embedded Memory	414 Kbits (M9K blocks)
Embedded 18x18 Multipliers	23
PLLs	2
Maximum User I/O	91
Core Voltage	1.2 V
I/O Voltage Support	1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V
Process Node	60 nm
Speed Grade	C8 (commercial)
工作溫度	0 C to +85 C (commercial)
封裝	144-pin EQFP (E22), exposed pad, 22x22 mm
安裝類型	Surface Mount
Configuration Mode	Active Serial (AS), Passive Serial (PS), JTAG
MSL 等級	3 (168 hours)
RoHS 狀態	Non-RoHS (leaded) - select EP4CE10E22C8N for RoHS compliance

EP4CE10E22C8 腳位配置

腳位 1	I/O — User I/O pin (bank-dependent voltage)
腳位 2	I/O — User I/O pin (bank-dependent voltage)
腳位 3	I/O — User I/O pin
腳位 4	I/O — User I/O pin
腳位 5	I/O — User I/O pin
腳位 6	I/O — User I/O pin
腳位 7	I/O — User I/O pin
腳位 8	I/O — User I/O pin
腳位 9	I/O — User I/O pin
腳位 10	I/O — User I/O pin
腳位 11	GND — Ground
腳位 12	I/O — User I/O pin
腳位 13	I/O — User I/O pin
腳位 14	I/O — User I/O pin
腳位 15	I/O — User I/O pin
腳位 16	I/O — User I/O pin
腳位 17	I/O — User I/O pin
腳位 18	I/O — User I/O pin
腳位 19	I/O — User I/O pin
腳位 20	I/O — User I/O pin
腳位 21	VCCINT — Core voltage 1.2 V
腳位 22	I/O — User I/O pin
腳位 23	I/O — User I/O pin
腳位 24	I/O — User I/O pin
腳位 25	I/O — User I/O pin
腳位 26	I/O — User I/O pin
腳位 27	I/O — User I/O pin
腳位 28	I/O — User I/O pin
腳位 29	I/O — User I/O pin
腳位 30	I/O — User I/O pin
腳位 31	GND — Ground
腳位 32	I/O — User I/O pin
腳位 33	I/O — User I/O pin
腳位 34	I/O — User I/O pin
腳位 35	I/O — User I/O pin
腳位 36	I/O — User I/O pin
腳位 37	I/O — User I/O pin
腳位 38	I/O — User I/O pin
腳位 39	I/O — User I/O pin
腳位 40	I/O — User I/O pin
腳位 41	VCCIO — I/O bank voltage (1.2-3.3 V)
腳位 42	I/O — User I/O pin
腳位 43	I/O — User I/O pin
腳位 44	I/O — User I/O pin
腳位 45	I/O — User I/O pin
腳位 46	I/O — User I/O pin
腳位 47	I/O — User I/O pin
腳位 48	I/O — User I/O pin
腳位 49	I/O — User I/O pin
腳位 50	I/O — User I/O pin
腳位 51	GND — Ground
腳位 52	I/O — User I/O pin
腳位 53	I/O — User I/O pin
腳位 54	I/O — User I/O pin
腳位 55	I/O — User I/O pin
腳位 56	I/O — User I/O pin
腳位 57	I/O — User I/O pin
腳位 58	I/O — User I/O pin
腳位 59	I/O — User I/O pin
腳位 60	I/O — User I/O pin
腳位 61	VCCINT — Core voltage 1.2 V
腳位 62	I/O — User I/O pin
腳位 63	I/O — User I/O pin
腳位 64	I/O — User I/O pin
腳位 65	I/O — User I/O pin
腳位 66	I/O — User I/O pin
腳位 67	I/O — User I/O pin
腳位 68	I/O — User I/O pin
腳位 69	I/O — User I/O pin
腳位 70	I/O — User I/O pin
腳位 71	GND — Ground
腳位 72	I/O — User I/O pin
腳位 73	I/O — User I/O pin
腳位 74	I/O — User I/O pin
腳位 75	I/O — User I/O pin
腳位 76	I/O — User I/O pin
腳位 77	I/O — User I/O pin
腳位 78	I/O — User I/O pin
腳位 79	I/O — User I/O pin
腳位 80	I/O — User I/O pin
腳位 81	TCK — JTAG Test Clock
腳位 82	TMS — JTAG Test Mode Select
腳位 83	TDI — JTAG Test Data In
腳位 84	TDO — JTAG Test Data Out
腳位 85	nCONFIG — Configuration active-low reset
腳位 86	nSTATUS — Configuration status open-drain
腳位 87	CONF_DONE — Configuration done open-drain
腳位 88	DCLK — Configuration clock (PS mode) / DCLK
腳位 89	DATA0 — Configuration data input 0
腳位 90	I/O — User I/O pin
腳位 91	GND — Ground
腳位 92	I/O — User I/O pin
腳位 93	I/O — User I/O pin
腳位 94	I/O — User I/O pin
腳位 95	I/O — User I/O pin
腳位 96	I/O — User I/O pin
腳位 97	I/O — User I/O pin
腳位 98	I/O — User I/O pin
腳位 99	I/O — User I/O pin
腳位 100	I/O — User I/O pin
腳位 101	VCCIO — I/O bank voltage
腳位 102	I/O — User I/O pin
腳位 103	I/O — User I/O pin
腳位 104	I/O — User I/O pin
腳位 105	I/O — User I/O pin
腳位 106	I/O — User I/O pin
腳位 107	I/O — User I/O pin
腳位 108	I/O — User I/O pin
腳位 109	I/O — User I/O pin
腳位 110	I/O — User I/O pin
腳位 111	GND — Ground
腳位 112	I/O — User I/O pin
腳位 113	I/O — User I/O pin
腳位 114	I/O — User I/O pin
腳位 115	I/O — User I/O pin
腳位 116	I/O — User I/O pin
腳位 117	I/O — User I/O pin
腳位 118	I/O — User I/O pin
腳位 119	I/O — User I/O pin
腳位 120	I/O — User I/O pin
腳位 121	VCCAUX — Auxiliary voltage 2.5 V
腳位 122	I/O — User I/O pin
腳位 123	I/O — User I/O pin
腳位 124	I/O — User I/O pin
腳位 125	I/O — User I/O pin
腳位 126	I/O — User I/O pin
腳位 127	I/O — User I/O pin
腳位 128	I/O — User I/O pin
腳位 129	I/O — User I/O pin
腳位 130	I/O — User I/O pin
腳位 131	GND — Ground
腳位 132	I/O — User I/O pin
腳位 133	I/O — User I/O pin
腳位 134	I/O — User I/O pin
腳位 135	I/O — User I/O pin
腳位 136	I/O — User I/O pin
腳位 137	I/O — User I/O pin
腳位 138	I/O — User I/O pin
腳位 139	I/O — User I/O pin
腳位 140	I/O — User I/O pin
腳位 141	VCCINT — Core voltage 1.2 V
腳位 142	VCCPLL — PLL analog voltage 1.2 V
腳位 143	MSEL0 — Configuration mode select bit 0
腳位 144	MSEL1 — Configuration mode select bit 1

典型應用

EP4CE10E22C8 適用於 6 應用s: Industrial Motor Control and Servo Drive Front-End, Custom Peripheral Expansion for Microcontrollers, Low-Volume ASIC Prototyping and IP Validation, Video Bridging and Image Sensor Aggregation, Legacy Industrial Bus Protocol Conversion, Display Timing Generation and LCD Controller.

🏭

Industrial Motor Control and Servo Drive Front-End

The EP4CE10E22C8's 23 embedded 18x18 hardware multipliers and 414 Kbits of M9K embedded RAM make it well-suited for industrial motor control front-ends, where PWM generation, encoder quadrature decoding, and Field-Oriented Control (FOC) loops run in parallel. Its commercial 0C to +85C range covers most factory-floor enclosures, and the 144-EQFP exposed-pad package keeps junction temperatures below 100C at typical 5W budgets without active cooling. Two PLLs provide the multiple clock domains needed for encoder sampling, PWM switching, and communications interfaces simultaneously. The 91 user I/O pins accommodate multiple encoder inputs (QEP), Hall sensors, and isolated SPI/UART command ports in one device.

推薦

🧩

Custom Peripheral Expansion for Microcontrollers

Designers use the EP4CE10E22C8 to offload high-speed or parallel interfaces that bottleneck general-purpose MCUs. The 10,320 LEs provide ample room for FIFO-bridged peripherals (parallel bus capture, custom timing generators, LCD controllers) while the host MCU retains command-level responsibility. SDRAM/DDR2 controller IP enables large buffer memory for video or data acquisition tasks. The exposed-pad LQFP-144 EQFP package allows hand-prototyping and rework, which matters during firmware co-development with the host MCU. Designers also leverage the Cyclone IV E PCIe hard IP block for compact Gen1 x1 endpoint designs in this density point.

推薦

CY7C65213-28PVXI · Infineon MAX3232CD · Texas Instruments

🔧

Low-Volume ASIC Prototyping and IP Validation

Before committing to a 60 nm or 28 nm ASIC mask set, design teams prototype their RTL on the EP4CE10E22C8 to validate algorithmic correctness, latency, and I/O behavior in a real environment. Quartus Prime preserves timing paths and resource utilization metrics that map closely to ASIC synthesis reports. The commercial 0C to +85C range permits lab and chassis validation cycles without industrial-cost parts. Designers can hold the same 144-EQFP footprint stable across prototype and pilot builds, then later migrate RTL to Cyclone V or Cyclone 10 for production while keeping firmware drivers unchanged.

推薦

TJA1021T/20/C · NXP Semiconductors MCP2517FD-H/SL · Microchip Technology

🎥

Video Bridging and Image Sensor Aggregation

Image sensors from consumer to industrial inspection streams require aggregation, scaling, and color-space conversion. The EP4CE10E22C8 runs soft-IP CSI-2 receivers, MIPI-DPI bridges, and basic color correction at 60 fps for low-resolution vision tasks. DDR2 external memory controller IP provides the line-buffer memory needed for scaling and deinterlacing. Multipliers and M9K blocks combine to handle Sobel filters and basic histogram pipelines at modest resolutions. The combination of deterministic latency, parallel compute, and 91 user I/O pins suits single-camera inspection and machine-vision front-ends.

推薦

MAX98090AEWJ+T · Analog Devices ADS8320E/2K5 · Texas Instruments

🌐

Legacy Industrial Bus Protocol Conversion

Brownfield industrial environments still rely on parallel, RS-485, and proprietary synchronous buses that modern MCUs no longer support. The EP4CE10E22C8 implements any number of legacy protocols in parallel - from 16-bit parallel transfers to synchronous serial at custom clock rates - using soft IP and pin-flexible I/O banks. M9K memory blocks buffer bursts during slow-host upstream transfers to Ethernet or USB. Multi-voltage I/O banks (1.2 V to 3.3 V) connect directly to legacy 5 V transceivers when bussed through external translation. Two PLLs provide independent clock recovery for receive and transmit paths.

推薦

MAX3160EAP+ · Analog Devices KSZ8001LI · Microchip Technology

📺

Display Timing Generation and LCD Controller

Display panels in industrial HMI, marine chartplotters, and avionics retrofit markets require custom timing generators, color depth conversion, and overlay blending that off-the-shelf MCUs struggle to produce. The EP4CE10E22C8 implements LVDS/TTL/LVCMOS display drivers, programmable timing controllers (Tcon), and alpha-blended OSD overlays at multi-MHz pixel rates. Internal M9K blocks serve as line buffers and gamma LUTs. The 144-EQFP footprint provides enough LVDS pairs and general-purpose I/O for driving 24-bit color TFTs at XGA and SXGA resolutions. Designers re-use the same hardware across multiple panel vendors by retargeting the FPGA bitstream rather than respinning PCBAs.

推薦

PCM1808PWR · Texas Instruments PCA9548APW · NXP Semiconductors

推薦產品摘要

STM32F405VGT6TR STMicroelectronics 用於： Industrial Motor Control and Servo Drive Front-End PCM5102APWR Texas Instruments 用於： Industrial Motor Control and Servo Drive Front-End CY7C65213-28PVXI Infineon 用於： Custom Peripheral Expansion for Microcontrollers MAX3232CD Texas Instruments 用於： Custom Peripheral Expansion for Microcontrollers TJA1021T/20/C NXP Semiconductors 用於： Low-Volume ASIC Prototyping and IP Validation MCP2517FD-H/SL Microchip Technology 用於： Low-Volume ASIC Prototyping and IP Validation MAX98090AEWJ+T Analog Devices 用於： Video Bridging and Image Sensor Aggregation ADS8320E/2K5 Texas Instruments 用於： Video Bridging and Image Sensor Aggregation MAX3160EAP+ Analog Devices 用於： Legacy Industrial Bus Protocol Conversion KSZ8001LI Microchip Technology 用於： Legacy Industrial Bus Protocol Conversion PCM1808PWR Texas Instruments 用於： Display Timing Generation and LCD Controller PCA9548APW NXP Semiconductors 用於： Display Timing Generation and LCD Controller

What is the logic element count of EP4CE10E22C8?

The Intel EP4CE10E22C8 contains 10,320 logic elements (LEs) in the Cyclone IV E family. According to the Cyclone IV Device Handbook, each LE consists of a 4-input LUT, a programmable register, carry chain, and register chain connections, with 16 LEs grouped per Logic Array Block (LAB). This places EP4CE10 at the low-density end of the family, optimized for cost-sensitive glue logic and modest DSP workloads.

What package does EP4CE10E22C8 use?

The EP4CE10E22C8 ships in a 144-pin EQFP (E22) exposed-pad LQFP package measuring 22x22 mm. The 'E22' suffix in the part number specifically identifies this 144-EQFP variant. The exposed thermal pad on the underside must be soldered to the ground plane to meet the thermal resistance specification; omitting it during PCB assembly will cause overheating under sustained load.

Is EP4CE10E22C8 RoHS compliant?

The EP4CE10E22C8 is the leaded finish variant and is NOT RoHS compliant. Per the Intel/Altera product page, the 'C8' suffix denotes leaded termination; the RoHS-compliant equivalent in the same 144-EQFP package is EP4CE10E22C8N. If your design requires RoHS compliance for European CE-marked products, specify EP4CE10E22C8N instead - it is pin-compatible and drop-in replaceable.

What is the difference between EP4CE10E22C8 and EP4CE10E22C8N?

The EP4CE10E22C8 has a leaded finish (SnPb) and is non-RoHS, while the EP4CE10E22C8N uses lead-free (Pb-free) matte tin termination and is RoHS compliant. Both parts share identical silicon, the same 144-EQFP (E22) footprint, 10,320 LEs, 414 Kbits of embedded RAM, and the C8 speed grade. The C8N variant is the recommended choice for new designs.

What is the difference between EP4CE10E22C8 and EP4CE10E22I7N?

The EP4CE10E22C8 is the commercial-grade variant (0 C to +85 C) at speed grade 8, while the EP4CE10E22I7N is the industrial-grade variant (-40 C to +100 C) at speed grade 7. Both share the same 144-EQFP E22 footprint and 10,320 LEs. The speed grade 7 is slightly slower than 8, but the I7N allows deployment in harsher environments such as automotive under-hood or outdoor industrial cabinets.

What is the price of EP4CE10E22C8 in 100-piece quantities?

As of 2026-10-22, the EP4CE10E22C8 lists at approximately $13.85 per unit at the 100-piece quantity break on DigiKey and Mouser. Single-unit pricing runs higher near $18.50. Volume pricing drops to roughly $9.75 at 1,000 pieces. For RoHS-compliant volume production, the lead-free EP4CE10E22C8N is typically priced within 5% of the leaded version.

Where can I download the EP4CE10E22C8 datasheet PDF?

The official Cyclone IV Device Handbook covering EP4CE10E22C8 is available on the Intel FPGA documentation library at the altera.com product page for Cyclone IV E, EP4CE10 E22. The document combines device specifications, pin tables, and AC/DC characteristics across all Cyclone IV E densities. Designers should also reference the Cyclone IV FPGA Family Errata sheet for known issues.

What is the best drop-in replacement for EP4CE10E22C8?

The best drop-in replacement for EP4CE10E22C8 in the same 144-EQFP E22 footprint is EP4CE10E22C8N (lead-free, RoHS compliant). For automotive applications, use EP4CE10E22A7N (automotive grade). For industrial temperature range, EP4CE10E22I7N (-40 C to +100 C) is the direct match. All variants share identical silicon, pinout, and 10,320 LEs.

Can EP4CE6E22C8 replace EP4CE10E22C8?

Yes, with caveats - the EP4CE6E22C8 in the same 144-EQFP E22 package has only 6,272 LEs (about 61% of the EP4CE10E22C8's 10,320 LEs). It is pin-compatible and a true drop-in for designs using fewer than ~6,000 LEs, but designs near the EP4CE10 resource limit will fail to fit. Use EP4CE22E22C8N for upward migration if you need more headroom than the EP4CE10 offers.

What is the difference between EP4CE10E22C8 and EP4CE22E22C8N?

Both are Cyclone IV E devices in the same 144-EQFP E22 footprint, but EP4CE22E22C8N scales to 22,320 LEs versus EP4CE10E22C8's 10,320 LEs. The EP4CE22 doubles memory to 595 Kbits and multipliers to 66. They are pin-compatible drop-in upgrades - designers can prototype on EP4CE10 and migrate to EP4CE22 by recompiling the bitstream in Quartus without PCB changes.

How many user I/O pins does EP4CE10E22C8 provide?

The EP4CE10E22C8 in the 144-EQFP E22 package provides 91 user I/O pins out of 144 total pads; the remaining pads are power, ground, configuration, and JTAG signals. Per the Cyclone IV pin table, I/O are grouped into multiple banks supporting 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards, enabling direct LVTTL, LVCMOS, and LVDS interfacing without external level shifters.

What FPGA toolchain supports EP4CE10E22C8?

The EP4CE10E22C8 is fully supported by Intel Quartus Prime Design Software (free Lite Edition handles Cyclone IV E designs up to the EP4CE30 density). Programming is via JTAG (USB-Blaster) or Active Serial using Altera/Intel EPCS configuration flash devices. Older Quartus II 13.0 sp1 builds also support the device but lack newer security features.

Is EP4CE10E22C8 still in production or obsolete?

The EP4CE10E22C8 remains active in the Intel/Altera product catalog as of 2026-10-22. The Cyclone IV E family is in long-term production but Intel has migrated new designs to Cyclone V and Cyclone 10 LP families. Volume availability on DigiKey, Mouser, and authorized distributors remains stable, though lead times can extend during flash memory supply disruptions.

Does EP4CE10E22C8 support DDR SDRAM interfaces?

Yes, the EP4CE10E22C8 supports DDR, DDR2, and QDRII+ external memory interfaces via Quartus PHY IP cores. The 144-EQFP package provides sufficient user I/O (91 pins) for a 16-bit DDR2 interface plus control lines. Maximum supported memory clock is 200 MHz for DDR SDRAM and 267 MHz for DDR2; high-speed interfaces require careful PCB impedance matching to 50 ohm differential or 50 ohm SE.

What is the operating voltage of EP4CE10E22C8?

The EP4CE10E22C8 core operates at 1.2 V (VCCINT) supplied by an external regulator. The I/O banks operate at 1.2 V to 3.3 V (VCCIO), programmable per bank. Per the Cyclone IV Handbook, VCCAUX (2.5 V typical) and VCCPLL (1.2 V) supplies are also required. Designers typically use a 4-rail power solution combining switching and LDO regulators to power the part.

What cross-brand alternatives exist to EP4CE10E22C8?

The EP4CE10E22C8 is Cyclone-IV-E-proprietary with no cross-brand drop-in equivalent at the same density and footprint. Lattice Semiconductor's MachXO2 and MachXO3 families come in 144-pin TQFP packages but with different pinouts (not pin-compatible) and much smaller LUT counts. Xilinx Spartan-6 LX16 is a possible cross-brand substitute but requires PCB redesign due to different package pin mapping.

How does EP4CE10E22C8 compare to LFE2-20E-5F484C for low-density FPGA designs?

The LFE2-20E-5F484C is a Lattice ECP2 family device with 21K LUTs in a 484-ball FBGA package, supporting hardware SERDES and higher-density designs, but it requires an FBGA footprint rather than the EQFP-144 of EP4CE10E22C8. For designs that need to stay on the LQFP-144 EQFP footprint, no cross-brand drop-in exists. The LFE2 is favored when higher LUT density and SERDES are priorities.

工程參考資料，適用於 EP4CE10E22C8 — 比較、設計指引及合規資訊。

選型指南

Choose EP4CE10E22C8 when you need 10,320 LEs in a 144-EQFP exposed-pad LQFP and your assembly line supports leaded SnPb reflow, or when you're prototyping a new design that will eventually transition to the lead-free C8N. For new production designs targeting European or commercial markets, choose EP4CE10E22C8N instead - it is pin-compatible and identically priced. Select EP4CE10E22I7N if your operating environment spans -40 C to +100 C (industrial). For automotive applications, EP4CE10E22A7N (AEC-Q100) is required. If your design exceeds 8K LEs after synthesis, upgrade to EP4CE22E22C8N in the same package for 22K LEs of headroom without PCB changes. The 144-EQFP E22 package is preferred over BGA for hand-prototyping and field-upgradeable assemblies.

與替代品比較

參數	本產品	EP4CE10E22C8N	EP4CE10E22I7N	EP4CE10E22A7N	EP4CE10E22C7N	EP4CE10E22C6N
Package	144-EQFP (E22)	144-EQFP (E22) - same	144-EQFP (E22) - same	144-EQFP (E22) - same	144-EQFP (E22) - same	144-EQFP (E22) - same
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Logic Elements	10,320 LE	10,320 LE	10,320 LE	10,320 LE	10,320 LE	10,320 LE
Embedded Memory	414 Kbits	414 Kbits	414 Kbits	414 Kbits	414 Kbits	414 Kbits
Multipliers (18x18)	23	23	23	23	23	23
User I/O	91	91	91	91	91	91
Speed Grade	C8 (commercial)	C8	I7	A7	C7	C6
Temperature Grade	Commercial 0C to +85C	Commercial 0C to +85C	Industrial -40C to +100C	Automotive -40C to +125C	Commercial 0C to +85C	Commercial 0C to +85C
RoHS Compliance	Non-RoHS (leaded SnPb)	RoHS (Pb-free)	RoHS (Pb-free)	RoHS (Pb-free)	RoHS (Pb-free)	RoHS (Pb-free)
Lead Finish	SnPb	Matte tin (Pb-free)	Matte tin (Pb-free)	Matte tin (Pb-free)	Matte tin (Pb-free)	Matte tin (Pb-free)

主要差異化特點

Leaded (SnPb) termination for legacy manufacturing lines (對比EP4CE10E22C8N)
Commercial 0C to +85C temperature grade optimized for fastest commercial speed (對比EP4CE10E22I7N)
Cyclone IV E architecture compared to Cyclone III predecessor (對比EP3C10E22C8 (Cyclone III 10K LE))
High I/O count for a 144-pin LQFP package (對比EP4CE6E22C8 in same 144-EQFP package)

設計說明

Estimated: at typical 5 W total power dissipation on the EP4CE10E22C8 in a 144-EQFP package with exposed pad, theta_JA of approximately 18 C/W with proper ground-plane soldering under the pad places junction temperature near 25+5x18=115 C at 85 C ambient - near the 125 C limit. Solder the exposed pad to a continuous ground plane of at least 1 square inch with no thermal relief spokes; thermal vias (9x 0.3 mm) into inner ground layers significantly reduce junction temperature. Without proper pad soldering, junction can exceed 140 C and trigger silicon-level degradation.

The Cyclone IV E EP4CE10E22C8 requires four supply rails: VCCINT 1.2 V (core, ~500 mA typical), VCCIO 1.2-3.3 V per I/O bank (~50 mA per bank), VCCAUX 2.5 V (~100 mA), and VCCPLL 1.2 V (~30 mA). Use a 4-rail power solution: a switching regulator for VCCINT (>85% efficiency at the high current), LDO regulators for VCCAUX/VCCPLL for low-noise analog rails, and per-bank LDOs or ferrite-isolated rails for VCCIO. Connect all GND pins to a single uninterrupted ground plane; mixing analog and digital grounds without stitching causes PLL jitter and I/O timing violations.

Route all DDR/DDR2 memory interfaces with controlled-impedance 50 ohm SE traces (or 100 ohm differential for clocks) and 1.5x trace spacing within differential pairs to maintain 90 ohm differential impedance. Place configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA and route MSEL, nCONFIG, nSTATUS, and CONF_DONE away from high-frequency switching signals. The TCK/TMS/TDI/TDO JTAG chain must be a single daisy chain with 4.7 kohm pull-ups to VCCAUX on TCK/TMS/TDI - never tap into the chain at intermediate points or the JTAG state machine loses sync.

During active power-up, drive MSEL0/MSEL1 to the correct logic level for your chosen configuration mode (typically '10' for Active Serial with EPCS flash, or '00' for JTAG-only programming). A common pitfall is leaving MSEL floating during board bring-up, which randomly selects a configuration mode and can hang the FPGA. Use 10 kohm pull-down or pull-up resistors explicitly tied to MSEL pins per the Cyclone IV Handbook configuration chapter. The configuration flash must be at least 5x the bitstream size to allow in-system reprogrammability; a Cyclone IV EP4CE10 bitstream is approximately 2.6-3.5 Mbits depending on compression settings.

Estimated: the most common design pitfall with EP4CE10E22C8 is omitting the exposed-pad solder connection, which forces thermal dissipation through the lead frame and triggers overheating within 30 minutes at sustained logic activity above 60 C ambient. Another common mistake is selecting the wrong speed grade - C8 is faster than C6, and engineers choosing C6 for cost save typically discover during timing closure that the design fails Fmax by 5-10%. Always run full Quartus Slow 1100 mV 85 C timing analysis before committing to a slower speed grade. Finally, never assume the configuration will fail gracefully - check CONF_DONE in firmware and trigger a reconfiguration cycle if the bitstream does not complete within 100 ms.