EP4SGX360FF35I4N - 353600-Cell Stratix IV GX FPGA | Intel
MPN: EP4SGX360FF35I4N ✗ انتهى عمره الإنتاجيEP4SGX360FF35I4N نظرة عامة
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM (BRAM), and high-speed serial transceivers. Stratix IV GX FPGAs belong to Intel's high-end programmable logic family, sitting above Cyclone (low-power) and Arria (mid-range) in the taxonomy: FPGA -> programmable logic -> programmable logic device -> integrated circuit -> semiconductor. They are designed for applications requiring the highest logic density combined with multi-gigabit transceivers.
Key features of the EP4SGX360FF35I4N include 24 transceivers supporting CPRI, PCIe Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet, embedded PCI Express hard IP, and adaptive logic modules (ALMs) that deliver up to 50% higher performance per logic element versus previous generations. The I4 speed grade and N (lead-free) suffix indicate industrial temperature range (-40C to +100C or similar) with Pb-free / RoHS-compliant manufacturing.
The Stratix IV GX architecture combines a 40 nm low-power process with hard IP blocks for memory controllers, DSP, and PCIe to minimize logic utilization for common functions. Partial reconfiguration, dynamic phase alignment, and dedicated floorplan-aware transceiver calibration simplify board bring-up, while the 564 I/O count supports wide parallel buses commonly required in ASIC prototyping and high-performance DSP front-ends.
Typical applications include high-performance ASIC prototyping, high-end DSP co-processing, radar and electronic-warfare front-ends, telecom line cards with multi-gigabit serial backplanes, and PCIe-based accelerator cards. The combination of 353,600 LEs and 24 transceivers also suits broadcast video processing and high-frequency trading (HFT) appliances where latency determinism matters.
Designers should plan power architecture carefully - the EP4SGX360FF35I4N can draw tens of amps during configuration and high-activity states, so a multi-rail buck converter network with proper sequencing is essential. Quartus Prime software from Intel (Altera) is required for synthesis, place-and-route, and bitstream generation; legacy Quartus II 13.x is the last officially supported release for the Stratix IV family.
This page consolidates distributor pricing, drop-in compatible device-ordering options (FF35 speed/migration variants), and practical design notes beyond what the manufacturer datasheet alone provides. Always verify ball-map compatibility against your specific PCB revision before substituting speed-grade or temperature variants.
بدائل مباشرة لـ EP4SGX360FF35I4N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP4SGX360FF35I4N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Speed Grade, Process Technology, Family.
EP4SGX360FF35I4
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35I3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35I3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35C3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35C4
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SGX360FF35I4N الحدود القصوى والخصائص الكهربائية
| Series | Stratix IV GX |
| Number of Logic Elements / Cells | 353,600 |
| Number of LABs / CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of I/O | 564 |
| Voltage - Supply | 0.9 V core |
| Process Technology | 40 nm CMOS |
| نوع التركيب | Surface Mount |
| العلبة / الحالة | 1152-BBGA, FCBGA |
| Package Dimensions | 35 x 35 mm |
| Supplier Device Package | FBGA-1152 |
| درجة حرارة التشغيل | -40C to +100C (Industrial, I4 grade) |
| Lead Free / RoHS | Yes (Lead Free) |
| Clock Frequency (max) | 717 MHz |
دليل تكوين أطراف EP4SGX360FF35I4N fbga-1152
تكوين الأطراف لـ EP4SGX360FF35I4N (حزمة fbga-1152). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP4SGX360FF35I4N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP4SGX360FF35I4N مناسب لـ 7 التطبيقs: ASIC Prototyping and Emulation, High-End DSP and Radar Front-End, Telecom Line Cards with Multi-Gigabit Backplanes, PCIe Accelerator Cards, Broadcast Video Processing, Industrial Test and Measurement, Aerospace and Defense Long-Life Programs.
ASIC Prototyping and Emulation
The EP4SGX360FF35I4N is well suited to ASIC prototyping because its 353,600 logic elements deliver the capacity to map large ASIC RTL blocks 1:1 while preserving the 24 multi-gigabit transceivers needed to emulate SERDES-based ASIC interfaces. With Quartus II synthesis, designers can compile existing ASIC RTL into Stratix IV GX, then reuse the same FF35 1152-ball FCBGA across ASIC emulator revisions. Compared with using multiple smaller FPGAs, the single-die 360K architecture simplifies partition debug. Latency through the FPGA is deterministic enough to gate clock-domain crossing issues that surface during real-world ASIC bring-up.
موصى به
High-End DSP and Radar Front-End
Stratix IV GX FPGAs target defense and aerospace signal-processing applications, and the EP4SGX360FF35I4N delivers 564 user I/Os plus 24 transceivers to feed parallel ADC/DAC data into dedicated DSP blocks at hundreds of MHz. Its industrial temperature grade (I4) supports ruggedized enclosures, while the FF35 package provides solid thermal headroom for sustained processing workloads. The integrated 23 Mbit block RAM allows deep FFT-window buffering without external SRAM, and the 8.5 Gbps transceivers can carry digitized radar I/Q streams back to a central processor over a single serial link.
موصى به
Telecom Line Cards with Multi-Gigabit Backplanes
The EP4SGX360FF35I4N integrates CPRI, Serial RapidIO, and PCIe Gen2 hard IP, making it a strong fit for ATCA/AdvancedTCA line cards where multiple FPGA tiles aggregate backhaul traffic. The 564 I/Os support parallel SGMII / QSGMII fan-out to PHY chips, while 24 transceivers at 8.5 Gbps handle Interlaken or 10 GbE uplinks to switch fabrics. Industrial temperature operation (-40C to +100C) covers outdoor-aggregator and central-office environments. The 1.0 V core and 40 nm process minimize per-port power vs older 90 nm and 65 nm Stratix II / III designs.
موصى به
PCIe Accelerator Cards
The embedded PCIe Gen2 hard IP in the EP4SGX360FF35I4N allows it to function as a co-processor on PCIe x8 / x16 accelerator cards for high-frequency trading, financial Monte Carlo, and scientific workloads. The 353,600 logic elements give ample headroom for in-line algorithm pipelines, and the 23 Mbit block RAM holds working data sets without external memory bottlenecks. Quartus II place-and-route produces deterministic latency paths ideal for HFT order-book matching engines where nanoseconds matter.
موصى به
Broadcast Video Processing
Broadcast video routers and format converters benefit from the EP4SGX360FF35I4N's 564 I/Os to interface with multiple SDI / HD-SDI / 3G-SDI streams in parallel, while 24 transceivers handle 10 GbE trunks and SMPTE 2022 IP-video aggregation. The 23 Mbit block RAM supports line and frame buffers needed for deinterlacing, scaling, and frame-rate conversion. Industrial temperature grade ensures reliable operation in mixed-temperature broadcast-facility racks, while the FF35 FCBGA package's large 35 x 35 mm body simplifies thermal design at sustained pixel rates.
موصى به
Industrial Test and Measurement
ATE (Automatic Test Equipment) and high-end oscilloscope / signal-analyzer designs pair the EP4SGX360FF35I4N with high-speed ADCs and DACs to capture and synthesize waveforms at multi-GHz rates. The 564 I/Os support wide LVDS buses to multiple ADC channels, while the embedded transceivers drive 10 GbE results interfaces. Industrial temperature and RoHS compliance are standard. The 40 nm low-power process keeps thermal density manageable even in densely populated 4U / 6U chassis. Legacy test platforms have relied on this part for over a decade.
موصى به
Aerospace and Defense Long-Life Programs
Defense and aerospace programs that were designed around the EP4SGX360FF35I4N continue to source this device because revalidation cycles for flight hardware run 18-36 months and budgets cannot accommodate a re-spin. The industrial temperature grade, lead-free FCBGA package, and mature Quartus II tool chain (final supported version Quartus II 13.1) provide a known-good platform for long-term sustainment. Through authorized distributors and aerospace-qualified brokers, production units remain available for spares and sustainment contracts extending into the 2030s, though lifecycle planning should account for tightening supply.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP4SGX360FF35I4N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP4SGX360FF35I4 | EP4SGX360FF35I3N | EP4SGX360FF35I3 | EP4SGX360FF35C4N | EP4SGX360FF35C3N | EP4SGX360FF35C4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (FF35, 35x35 mm) | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same | 1152-BBGA, FCBGA (FF35, 35x35 mm) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs / CLBs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 | 564 | 564 | 564 |
| Speed Grade | I4 (industrial, fast) | I4 | I3 (slower) | I3 (slower) | C4 (commercial, faster) | C3 (commercial, slower) | C4 (commercial, faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (no N suffix) | Industrial | Industrial (no N) | Commercial (0C to +85C) | Commercial | Commercial (no N) |
| Lead-Free / RoHS | Yes (N suffix) | Varies (no N suffix) | Yes | Varies | Yes | Yes | Varies |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Industrial temperature grade with full lead-free N suffix (RoHS compliant) (مقابلEP4SGX360FF35C3N (commercial C3 grade))
- I4 fast speed grade among I-suffix industrial variants (مقابلEP4SGX360FF35I3N (I3 industrial grade))
- Same silicon and bitstream as FF35 family members (مقابلEP4SGX360HF35C2N (HF package))
ملاحظات التصميم
Estimated: Stratix IV GX FPGAs in the FF35 package can draw 10-30 A peak on the 0.9 V VCC rail during configuration and high toggle-rate workloads. A multi-phase buck converter with output accuracy of plus or minus 30 mV and load-line support is recommended. Plan sequencing for VCCINT, VCCAUX, VCCPD, and transceiver supplies - Stratix IV requires a specific power-on sequence (VCCINT before VCCAUX before VCCIO). Reference the Intel (Altera) PowerPlay Early Power Estimator (EPE) spreadsheet before board layout.
The 1152-ball FCBGA (FF35) requires a high-density PCB stackup, typically 12+ layers with 0.4 mm pitch BGA escape, microvia or via-in-pad, and matched 50 ohm impedance for transceiver channels. Use Intel's FF35 package PCB footprint (land pattern) verbatim - any deviation will cause solder joint defects. Place decoupling capacitors on the package BOTTOM side within 200 mils of each ball. Ground and power planes must remain unbroken beneath the BGA field for power integrity and return-path continuity.
Estimated: Quartus II 13.1 is the final officially supported software version for the Stratix IV family - Quartus Prime Pro / Standard do not support this device family. Do not assume newer software can recompile the same design; migrating to Stratix 10 or Agilex 7 requires revalidation of all IP cores, timing constraints, and pin assignments. Also beware that FF35 and HF35 packages are NOT interchangeable - the FF designation indicates the 35 x 35 mm body, while HF indicates a different package variant. Cross-check the package code on the device marking against your PCB BOM before substitution.
Multi-gigabit transceiver channels up to 8.5 Gbps require strict length-matching (typically plus or minus 5 mils within a quad) and continuous reference-plane return paths. Use AC-coupling capacitors (typically 100 nF X7R 0402) at transmitter outputs per the Stratix IV GX Transceiver Layout Guidelines. Avoid routing any high-speed signal over plane splits - the FF35 package is large enough that an unbroken ground plane beneath the entire BGA is essential. Reference Intel Application Note AN 532 for full channel routing rules.
معلومات الامتثال
Stratix IV GX family parts with N suffix are lead-free and RoHS compliant per Intel (Altera) product marking. AEC-Q100 is not applicable because this is an FPGA, not an automotive-qualified IC. Halogen-free status and detailed REACH SVHC declarations should be confirmed against the latest Intel PCN or material declaration document.