EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera
MPN: EPF10K130EQC240-1 ⚠ آخر فرصة للشراءEPF10K130EQC240-1 نظرة عامة
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in-system. Within the broader taxonomy, the FLEX 10KE sits at the intersection of SRAM-based FPGA and embedded programmable logic, integrating dedicated Embedded Array Blocks (EABs) that provide true dual-port RAM and ROM functions alongside standard LEs - positioning it as one of the first devices to combine ASIC-density gate arrays with FPGA-style programmable interconnect in a single fabric.
Key features of the EPF10K130EQC240-1 include 4 Embedded Array Blocks delivering up to 65536 RAM bits, JTAG-compliant IEEE 1149.1 boundary-scan test support, MultiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and in-system programmability via the Altera EPC configuration devices. The PQFP-240 package uses a 32x32 mm body with gull-wing leads, suiting it for prototypes, industrial control cards, and legacy telecom infrastructure where surface-mount fine-pitch BGAs are not required.
Typical applications for this device include industrial machine control, telecommunications line cards, glue-logic integration, legacy ASIC replacement, and embedded DSP co-processing. Designers should pair it with Altera's MAX+PLUS II or Quartus design software for synthesis, place-and-route, and timing analysis. Note that this part is in lifecycle status considered Last Time Buy / Not Recommended for New Designs, so it is best suited for maintenance of existing production systems rather than new platforms.
بدائل مباشرة لـ EPF10K130EQC240-1 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPF10K130EQC240-1 (نفس عامل الشكل والبصمة) — يختلف في Total RAM Bits, Operating Temperature, Mounting Type, Family, Package.
EPF10K130EQC240-1N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K130EQC240-3
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K130EQC240-3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K130EQC240-2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EPF10K100EQC240-1
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPF10K130EQC240-1 الحدود القصوى والخصائص الكهربائية
| Series | FLEX 10KE |
| Typical Gates | 130,000 |
| Logic Elements (LEs) | 6,656 |
| Embedded Array Blocks (EABs) | 4 |
| Total RAM Bits | 65,536 |
| Maximum User I/O Pins | 186 |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| Maximum Internal Frequency | 333.33 MHz |
| درجة حرارة التشغيل | 0 C to +70 C (Commercial) |
| العلبة | 240-pin PQFP / BFQFP (32x32 mm) |
| نوع التركيب | Surface Mount (Gull-wing) |
| JTAG Support | Yes - IEEE 1149.1 boundary-scan |
| Configuration Method | Serial / Parallel via Altera EPC device |
| حالة RoHS | unknown |
| Lead-Free | unknown |
دليل تكوين أطراف EPF10K130EQC240-1 240-pin pqfp / bfqfp (32x32 mm)
تكوين الأطراف لـ EPF10K130EQC240-1 (حزمة 240-pin pqfp / bfqfp (32x32 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EPF10K130EQC240-1.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EPF10K130EQC240-1 مناسب لـ 6 التطبيقs: Industrial Machine Control, Telecommunications Line Cards, Legacy ASIC Replacement, Embedded DSP Co-Processing, Test & Measurement Instrumentation, Aerospace & Defense Avionics (legacy hardware only).
Industrial Machine Control
The EPF10K130EQC240-1 is well suited to industrial machine controllers where the 130K-gate capacity and 186 user I/O pins accommodate multi-axis motion logic, encoder interfaces, and fieldbus glue logic. Its 2.5 V core with MultiVolt I/O (2.5/3.3/5 V) lets it sit directly on legacy 5 V PLC backplanes without external level shifters, simplifying retrofit designs. The 6,656 LEs paired with 65,536 bits of EAB memory provide ample headroom for state machines, look-up tables, and protocol handling (Modbus, CANopen) on a single fabric. Although the part is rated 0 C to +70 C, the industrial-temperature sibling EPF10K130EQC240-3N drops into the same footprint for factory-floor deployments.
موصى به
Telecommunications Line Cards
In telecom line-card applications the EPF10K130EQC240-1 acts as a programmable glue layer between network processors, TDM framers, and SERDES devices, using its EAB RAM for elastic FIFOs and channel-lookup tables. The 333.33 MHz internal performance is adequate for 155 MHz Utopia / POS-PHY Level-2 interfacing and ATM segmentation-and-reassembly functions. MultiVolt I/O permits direct 3.3 V connection to contemporary framer ASICs without glue logic, while the JTAG 1149.1 boundary-scan interface supports in-system test on populated backplanes. The 240-PQFP package is favored over fine-pitch BGA in legacy systems that require through-hole-quality reworkability and AOI inspection.
موصى به
Legacy ASIC Replacement
Engineers use the EPF10K130EQC240-1 to replace obsolete gate-array ASICs in existing products, since the FLEX 10KE architecture delivers 130K usable gates with deterministic timing closure. Each Embedded Array Block (EAB) can be configured as dual-port RAM with widths from 8 to 32 bits, providing memory primitives that previously required separate SRAM chips. Compared to an ASIC NRE, the FPGA approach eliminates mask charges and reduces prototype cycles from months to days - critical when a discontinued gate-array device threatens to halt production. The 240-PQFP footprint also fits common 32x32 mm land patterns used by legacy 240-pin ASICs.
موصى به
Embedded DSP Co-Processing
The EPF10K130EQC240-1 serves as a co-processor alongside a microcontroller or DSP, offloading FIR/IIR filters, FFT butterfly operations, and video scaling from the host CPU. With 65,536 bits of block memory (organized as 2048x8 / 1024x16 / 512x32 EABs), the device can hold coefficient tables and windowing data on-chip, eliminating external memory accesses and improving throughput. The 333.33 MHz fabric comfortably implements 16-bit MAC engines and small Viterbi decoders, while the 186 user I/O pins provide ample parallel host-side and external data paths. This makes the FPGA well matched to legacy audio processing, baseband modem, and machine-vision front-end cards.
موصى به
Test & Measurement Instrumentation
Test equipment manufacturers rely on the EPF10K130EQC240-1 for instrument-on-a-card designs where the FPGA implements custom trigger logic, protocol-aware pattern generation, and timing measurement. The 186 I/O pins provide direct fan-out to front-panel connectors, while 6,656 LEs implement deep counters and timing comparators that would otherwise require multiple PAL/GAL devices. JTAG 1149.1 boundary-scan simplifies board-level interconnect test, and the 240-PQFP gull-wing package is preferred for prototypes that need frequent socket swaps or hand rework. MultiVolt I/O lets the device directly interface with both 5 V analog front ends and 3.3 V digital sections of the same instrument.
موصى به
Aerospace & Defense Avionics (legacy hardware only)
Although not formally qualified to MIL-STD-883 or MIL-PRF-38535, the EPF10K130EQC240-1 and its FLEX 10KE siblings have been deployed in long-life avionics and military systems designed in the late 1990s and early 2000s. The device's SRAM-based fabric is suitable for read-only mission data paths where the bitstream is loaded once from a configuration PROM at power-up, while the 240-PQFP ceramic-compatible package survives the thermal cycling of military electronics bays. For new aerospace designs a radiation-hardened FPGA such as Microsemi/Microchip RTG4 or Xilinx Virtex-5QV is preferred; the EPF10K130EQC240-1 is mentioned here only for support of legacy systems already in service.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPF10K130EQC240-1 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPF10K130EQC240-1N | EPF10K130EQC240-3 | EPF10K130EQC240-3N | EPF10K130EQC240-2 | EPF10K100EQC240-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same |
| Speed Grade | -1 | -1 (same) | -3 (slower) | -3 (slower) | -2 (slower than -1) | -1 (same) |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
| Lead-Free | unknown | yes (Pb-free reflow) | unknown | yes (Pb-free) | unknown | unknown |
| Pin-to-Pin Compatible | n/a (reference part) | yes - drop-in | yes - drop-in | yes - drop-in | yes - drop-in | yes - drop-in (different bitstream) |
أبرز الفروقات
- Drop-in compatibility with multiple speed/temperature grades (مقابلEPF10K130EQC240-1N)
- Industrial-temperature drop-in option (مقابلEPF10K130EQC240-3 / -3N)
- Higher gate density in same package than FLEX 10KE 100K family (مقابلEPF10K100EQC240-1)
ملاحظات التصميم
The EPF10K130EQC240-1 core operates from a 2.5 V supply with tolerance 2.375 V to 2.625 V; generate this rail from a low-noise LDO such as the TPS7A4701 placed after a 3.3 V switching pre-regulator. MultiVolt I/O banks can be powered independently from 2.5 V, 3.3 V, or 5.0 V - add bulk decoupling of at least 10 uF plus a 0.1 uF high-frequency ceramic on each VCCINT and VCCIO pin, placed within 5 mm of the package lead. Estimate: ICCINT of a fully-utilized 130K-gate FLEX 10KE design ranges from 200 mA to 500 mA, depending on toggle rate, so a 1 A LDO headroom is recommended.
Although the EPF10K130EQC240-1 is commercial-grade (0 C to +70 C), the 240-pin PQFP package has limited thermal dissipation (theta-JA typically around 25 C/W for still air). For continuous operation above ~70% utilization, attach a small clip-on heatsink or provide forced-air cooling on the PQFP body. Estimated: at 0.5 W dissipation, junction-to-ambient rise is ~12.5 C - acceptable for office environments but warrants derating in enclosed cabinets.
PQFP-240 land patterns require gull-wing soldering with a recommended pad pitch of 0.5 mm (19.7 mil). Use a 4-layer PCB with a continuous ground plane on layer 2 directly under the FPGA to provide low-impedance return paths for the 186 I/O signals, and route all clocks (CLK0-CLK3, dedicated inputs) using length-matched traces with 50 ohm controlled impedance. Keep configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) within 25 mm of the EPC configuration PROM to minimize skew during bitstream load.
Common pitfalls when using the EPF10K130EQC240-1 include: (1) driving JTAG pins from a controller that does not match the VCCIO bank voltage - the 2.5 V core TCK/TMS/TDI/TDO lines must be level-shifted if the JTAG host is 3.3 V; (2) failing to provide a proper POR delay on nCONFIG before CONF_DONE goes high, which can lock the FPGA into a failed configuration state; (3) confusing the EPF10K130EQC240-1 with the FLEX 10KA EPF10K130EQC240-2N - the bitstreams are not interchangeable. Always re-synthesize with Quartus or MAX+PLUS II when swapping speed grades.
معلومات الامتثال
Compliance data not provided in the verified web snapshot. The -1N and -3N variants are explicitly lead-free per Altera-Micro and Arrow listings; the base -1 part is not annotated. AEC-Q100 qualification is not applicable because FPGAs are not qualified to that automotive standard.
