EPM570GF256-5N - 570 LEs MAX II CPLD 256-FBGA | Intel / Altera
MPN: EPM570GF256-5N ✓ نشطEPM570GF256-5N نظرة عامة
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device sitting between simple PLDs and full FPGAs in the programmable-logic hierarchy. CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX II CPLDs use a Look-Up Table (LUT) based architecture with non-volatile Flash configuration memory, giving them deterministic, instant-on behavior at power-up - ideal for system control, I/O expansion, and bus-interface glue logic.
Key features include 570 LEs, up to 160 user I/O, 8 Kbits of user Flash memory (UFM), 1.8 V core / 2.5 V-3.3 V multi-voltage I/O support, and an internal oscillator. The 'G' suffix indicates the green (Pb-free, RoHS-compliant) industrial-grade option, while the 'F' denotes the FineLine BGA package and '256' the ball count. The -5 speed grade provides the slowest fMAX of the family, trading speed for cost.
The MAX II architecture combines a 2-row LUT fabric with a continuous, non-volatile Flash configuration array. This dual advantage: instant-on at power-up and Flash-based storage that fits into a single chip. Unlike SRAM FPGAs that require boot PROMs and external configuration time, the EPM570GF256-5N is operational within microseconds of power-up.
Typical applications include I/O expansion, bus bridging, glue logic, power sequencing, LED control, industrial control, and portable/consumer electronics where non-volatile, instant-on behavior matters. The wide operating temperature range also suits factory automation and outdoor equipment.
When designing with the EPM570GF256-5N, use Quartus II Web Edition (legacy) or the newer Intel Quartus Prime Lite for design entry, synthesis, and place-and-route. Verify the PCB footprint matches the 256-ball FineLine BGA land pattern and route inner balls as needed to escape the dense array.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ EPM570GF256-5N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPM570GF256-5N (نفس عامل الشكل والبصمة) — يختلف في Package, RoHS Status, Programming Interface, Process Technology, Operating Temperature.
EPM570F256C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570F256I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570GF100I5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570GF100C5N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM570GF256-5N الحدود القصوى والخصائص الكهربائية
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Typical Gates | 440 (manufacturer marketing count) |
| User I/O Pins (max) | 160 |
| User Flash Memory (UFM) | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | Non-volatile Flash (instant-on) |
| العلبة | 256-ball FineLine BGA (GF) |
| Speed Grade | -5 (slowest in family) |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Compliant (Pb-free, 'G' suffix) |
| Internal Oscillator | Yes |
| Programming Interface | JTAG (IEEE 1149.1) |
دليل تكوين أطراف EPM570GF256-5N 256-ball fineline bga (gf)
تكوين الأطراف لـ EPM570GF256-5N (حزمة 256-ball fineline bga (gf)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EPM570GF256-5N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EPM570GF256-5N مناسب لـ 6 التطبيقs: Industrial Control & Factory Automation, I/O Expansion & Bus Bridging, Power Sequencing & Glue Logic, LED Display & Signage Controllers, Portable & Consumer Electronics, Automotive Body Electronics.
Industrial Control & Factory Automation
The EPM570GF256-5N's non-volatile instant-on behavior and 570 logic elements make it ideal for industrial control PLCs and factory automation modules where deterministic power-up is mandatory. With up to 160 user I/Os and multi-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V), it bridges legacy 5 V-tolerant signals to modern 3.3 V MCUs without external level shifters. The industrial temperature range (-40 °C to +100 °C) supports outdoor cabinets and harsh factory floors. Pair with the EPM570F256I5N for matched industrial variants and use Quartus Prime Lite for design entry.
موصى به
I/O Expansion & Bus Bridging
With 570 LEs and 160 I/Os, the EPM570GF256-5N serves as a flexible I/O expander bridging between microcontrollers and peripherals with mismatched bus widths or protocols. Designers can map 8-bit MCU ports to 16- or 32-bit parallel buses, implement custom peripherals (PWM, UART, SPI bridges), and reduce MCU pin count by offloading logic. The 8-Kbit user Flash memory stores configuration parameters or serial numbers, eliminating an external EEPROM. Same-family EPM570GF256C5N offers commercial-temp for non-industrial use.
موصى به
Power Sequencing & Glue Logic
The EPM570GF256-5N excels at power-sequencing logic in multi-rail systems: a single chip can sequence core, I/O, and analog rails with programmable delays using its internal oscillator. Compared to a discrete sequencer IC, the CPLD lets designers customize timing, fault response, and reset behavior in firmware, avoiding NRE charges. The non-volatile instant-on ensures rails come up in the correct order even after brown-outs. Use the EPM570F256I5N for industrial power-supply designs.
موصى به
LED Display & Signage Controllers
The EPM570GF256-5N drives multi-channel LED panels and scrolling-signage controllers with deterministic timing. With 160 I/Os and high-fanout per LE, a single chip can multiplex 16x32 or larger LED matrices while generating refresh, blanking, and PWM dimming in hardware - offloading the host MCU. The internal 8-Kbit Flash stores frame data and animation sequences. The 256-ball BGA footprint fits into compact PCB designs for indoor signage; for higher-density outdoor LED walls, migrate to MAX V 5M570ZF256.
موصى به
Portable & Consumer Electronics
Low standby current and instant-on Flash-based configuration suit the EPM570GF256-5N for battery-powered portable devices, wearables, and consumer electronics. The device wakes in microseconds - no boot PROM delay - making it ideal for always-on glue logic, button debouncing, and low-power state machines. The 1.8 V core plus multi-voltage I/O reduces regulator count; 0.18-µm process keeps dynamic power low. The Pb-free 'G' suffix is mandatory for consumer RoHS compliance.
موصى به
Automotive Body Electronics
Although not AEC-Q100 qualified, the EPM570GF256-5N is widely used in non-safety automotive body electronics - dashboard controllers, lighting modules, infotainment glue logic, and CAN/LIN bus bridges. Its 570 LEs, 160 I/Os, and industrial temperature rating cover most cabin environments. Designers should validate against AEC-Q100 requirements for safety-critical subsystems; for safety-rated designs, migrate to AEC-Q100-qualified MAX V or Cyclone devices.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPM570GF256-5N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPM570F256C5N | EPM570F256I5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (GF) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 100-pin FineLine BGA - smaller | 100-pin FineLine BGA - smaller |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 (same die) | 570 (same die) |
| Speed Grade | -5 | -5 (same) | -5 (same) | -5 (same) | -5 (same) |
| Temperature Range | Industrial (per 'N' suffix) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) |
| User I/O (max) | 160 | 160 | 160 | 76 (fewer due to smaller package) | 76 (fewer due to smaller package) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| RoHS / Pb-free | Yes ('G' suffix) | Varies by sub-suffix | Varies by sub-suffix | Yes ('G' suffix) | Yes ('G' suffix) |
أبرز الفروقات
- Non-volatile Flash configuration for instant-on (مقابلSRAM-based FPGAs (e.g., Cyclone))
- 160 user I/Os in compact 256-ball BGA (مقابلMAX II EPM240 / EPM127 (smaller density))
- Pb-free / RoHS compliant 'G' package (مقابلLegacy non-green MAX II variants)
- Internal 8-Kbit user Flash memory (مقابلDiscrete EEPROM for non-volatile storage)
ملاحظات التصميم
Estimated: the 256-ball FineLine BGA uses 1.0 mm ball pitch. Recommended PCB design rules: 0.6 mm pad diameter, 0.4 mm solder mask opening, microvia-in-pad for inner balls, and at least 4 routing layers to escape the dense BGA grid. Use a daisy-chain or breakout routing pattern to verify manufacturing yield before committing to production. The MAX II device handbook provides a reference PCB footprint in Allegro and DXF formats.
The EPM570GF256-5N requires a stable 1.8 V core supply and separate VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place 100 nF decoupling caps adjacent to each power pin and a 10 µF bulk cap near the regulator. Power-up sequencing between VCCINT and VCCIO is not strictly required by MAX II but following core-first then I/O avoids latch-up. The internal oscillator eliminates the need for an external clock source for simple glue-logic designs.
Critical: the 'G' suffix indicates Pb-free / RoHS - verify this matches your assembly process before reflow. Do not mix 'G' (green) and non-'G' variants on the same panel as the peak reflow profile differs (245 °C vs 220 °C). Also note the -5 speed grade is the slowest in the family; if timing closure fails, migrate to -4 or -3 variants (fewer hold-time violations, higher fMAX) without changing the BGA footprint.
Estimated: MAX II I/O pins are organized into banks. Place all 3.3 V signals in one bank, 1.8 V in another, to avoid voltage conflicts. The 256-ball GF package exposes dedicated JTAG pins (TCK, TMS, TDI, TDO) - route these to a 2x5 or 1x10 header for ByteBlaster / USB-Blaster programming. Reserve a 4-pin header footprint even if programming is done at board test only, to allow field re-programming.
معلومات الامتثال
RoHS compliant per 'G' suffix in part number. Lead-free reflow per JEDEC J-STD-020 up to 245 °C peak. Not AEC-Q100 qualified - use MAX V or Cyclone for safety-critical automotive.
