EPM570GF256-5N - 570 LEs MAX II CPLD 256-FBGA | Intel / Altera
부품 번호: EPM570GF256-5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.07 | $38.07 |
| 10 | $36.55 | $365.50 |
| 100 | $35.08 | $3,508.00 |
| 500 | $33.68 | $16,840.00 |
| 1,000 | $31.2 | $31,200.00 |
EPM570GF256-5N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device sitting between simple PLDs and full FPGAs in the programmable-logic hierarchy. CPLD -> programmable logic -> logic IC -> integrated circuit -> semiconductor. MAX II CPLDs use a Look-Up Table (LUT) based architecture with non-volatile Flash configuration memory, giving them deterministic, instant-on behavior at power-up - ideal for system control, I/O expansion, and bus-interface glue logic.
Key features include 570 LEs, up to 160 user I/O, 8 Kbits of user Flash memory (UFM), 1.8 V core / 2.5 V-3.3 V multi-voltage I/O support, and an internal oscillator. The 'G' suffix indicates the green (Pb-free, RoHS-compliant) industrial-grade option, while the 'F' denotes the FineLine BGA package and '256' the ball count. The -5 speed grade provides the slowest fMAX of the family, trading speed for cost.
The MAX II architecture combines a 2-row LUT fabric with a continuous, non-volatile Flash configuration array. This dual advantage: instant-on at power-up and Flash-based storage that fits into a single chip. Unlike SRAM FPGAs that require boot PROMs and external configuration time, the EPM570GF256-5N is operational within microseconds of power-up.
Typical applications include I/O expansion, bus bridging, glue logic, power sequencing, LED control, industrial control, and portable/consumer electronics where non-volatile, instant-on behavior matters. The wide operating temperature range also suits factory automation and outdoor equipment.
When designing with the EPM570GF256-5N, use Quartus II Web Edition (legacy) or the newer Intel Quartus Prime Lite for design entry, synthesis, and place-and-route. Verify the PCB footprint matches the 256-ball FineLine BGA land pattern and route inner balls as needed to escape the dense array.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EPM570GF256-5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPM570GF256-5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Programming Interface, Process Technology, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPM570F256C5N
✅ 드롭인✓ 재고 있음
$17.03 / 개
데이터시트 보기 →EPM570F256I5N
✅ 드롭인✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EPM570GF100I5N
✅ 드롭인✓ 재고 있음
$10.35 / 개
데이터시트 보기 →EPM570GF100C5N
✅ 드롭인✓ 재고 있음
$11.65 / 개
데이터시트 보기 →EPM570GF256-5N 최대 정격 & 전기적 특성
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Typical Gates | 440 (manufacturer marketing count) |
| User I/O Pins (max) | 160 |
| User Flash Memory (UFM) | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | Non-volatile Flash (instant-on) |
| 패키지 | 256-ball FineLine BGA (GF) |
| Speed Grade | -5 (slowest in family) |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (Pb-free, 'G' suffix) |
| Internal Oscillator | Yes |
| Programming Interface | JTAG (IEEE 1149.1) |
EPM570GF256-5N 256-ball fineline bga (gf) 핀 구성 가이드
EPM570GF256-5N(256-ball fineline bga (gf) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPM570GF256-5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPM570GF256-5N 적합 용도: 6 애플리케이션s: Industrial Control & Factory Automation, I/O Expansion & Bus Bridging, Power Sequencing & Glue Logic, LED Display & Signage Controllers, Portable & Consumer Electronics, Automotive Body Electronics.
Industrial Control & Factory Automation
The EPM570GF256-5N's non-volatile instant-on behavior and 570 logic elements make it ideal for industrial control PLCs and factory automation modules where deterministic power-up is mandatory. With up to 160 user I/Os and multi-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V), it bridges legacy 5 V-tolerant signals to modern 3.3 V MCUs without external level shifters. The industrial temperature range (-40 °C to +100 °C) supports outdoor cabinets and harsh factory floors. Pair with the EPM570F256I5N for matched industrial variants and use Quartus Prime Lite for design entry.
추천
I/O Expansion & Bus Bridging
With 570 LEs and 160 I/Os, the EPM570GF256-5N serves as a flexible I/O expander bridging between microcontrollers and peripherals with mismatched bus widths or protocols. Designers can map 8-bit MCU ports to 16- or 32-bit parallel buses, implement custom peripherals (PWM, UART, SPI bridges), and reduce MCU pin count by offloading logic. The 8-Kbit user Flash memory stores configuration parameters or serial numbers, eliminating an external EEPROM. Same-family EPM570GF256C5N offers commercial-temp for non-industrial use.
추천
Power Sequencing & Glue Logic
The EPM570GF256-5N excels at power-sequencing logic in multi-rail systems: a single chip can sequence core, I/O, and analog rails with programmable delays using its internal oscillator. Compared to a discrete sequencer IC, the CPLD lets designers customize timing, fault response, and reset behavior in firmware, avoiding NRE charges. The non-volatile instant-on ensures rails come up in the correct order even after brown-outs. Use the EPM570F256I5N for industrial power-supply designs.
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LED Display & Signage Controllers
The EPM570GF256-5N drives multi-channel LED panels and scrolling-signage controllers with deterministic timing. With 160 I/Os and high-fanout per LE, a single chip can multiplex 16x32 or larger LED matrices while generating refresh, blanking, and PWM dimming in hardware - offloading the host MCU. The internal 8-Kbit Flash stores frame data and animation sequences. The 256-ball BGA footprint fits into compact PCB designs for indoor signage; for higher-density outdoor LED walls, migrate to MAX V 5M570ZF256.
추천
Portable & Consumer Electronics
Low standby current and instant-on Flash-based configuration suit the EPM570GF256-5N for battery-powered portable devices, wearables, and consumer electronics. The device wakes in microseconds - no boot PROM delay - making it ideal for always-on glue logic, button debouncing, and low-power state machines. The 1.8 V core plus multi-voltage I/O reduces regulator count; 0.18-µm process keeps dynamic power low. The Pb-free 'G' suffix is mandatory for consumer RoHS compliance.
추천
Automotive Body Electronics
Although not AEC-Q100 qualified, the EPM570GF256-5N is widely used in non-safety automotive body electronics - dashboard controllers, lighting modules, infotainment glue logic, and CAN/LIN bus bridges. Its 570 LEs, 160 I/Os, and industrial temperature rating cover most cabin environments. Designers should validate against AEC-Q100 requirements for safety-critical subsystems; for safety-rated designs, migrate to AEC-Q100-qualified MAX V or Cyclone devices.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPM570GF256-5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPM570F256C5N | EPM570F256I5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (GF) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 100-pin FineLine BGA - smaller | 100-pin FineLine BGA - smaller |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 (same die) | 570 (same die) |
| Speed Grade | -5 | -5 (same) | -5 (same) | -5 (same) | -5 (same) |
| Temperature Range | Industrial (per 'N' suffix) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) |
| User I/O (max) | 160 | 160 | 160 | 76 (fewer due to smaller package) | 76 (fewer due to smaller package) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| RoHS / Pb-free | Yes ('G' suffix) | Varies by sub-suffix | Varies by sub-suffix | Yes ('G' suffix) | Yes ('G' suffix) |
주요 차별점
- Non-volatile Flash configuration for instant-on (vs SRAM-based FPGAs (e.g., Cyclone))
- 160 user I/Os in compact 256-ball BGA (vs MAX II EPM240 / EPM127 (smaller density))
- Pb-free / RoHS compliant 'G' package (vs Legacy non-green MAX II variants)
- Internal 8-Kbit user Flash memory (vs Discrete EEPROM for non-volatile storage)
설계 노트
Estimated: the 256-ball FineLine BGA uses 1.0 mm ball pitch. Recommended PCB design rules: 0.6 mm pad diameter, 0.4 mm solder mask opening, microvia-in-pad for inner balls, and at least 4 routing layers to escape the dense BGA grid. Use a daisy-chain or breakout routing pattern to verify manufacturing yield before committing to production. The MAX II device handbook provides a reference PCB footprint in Allegro and DXF formats.
The EPM570GF256-5N requires a stable 1.8 V core supply and separate VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place 100 nF decoupling caps adjacent to each power pin and a 10 µF bulk cap near the regulator. Power-up sequencing between VCCINT and VCCIO is not strictly required by MAX II but following core-first then I/O avoids latch-up. The internal oscillator eliminates the need for an external clock source for simple glue-logic designs.
Critical: the 'G' suffix indicates Pb-free / RoHS - verify this matches your assembly process before reflow. Do not mix 'G' (green) and non-'G' variants on the same panel as the peak reflow profile differs (245 °C vs 220 °C). Also note the -5 speed grade is the slowest in the family; if timing closure fails, migrate to -4 or -3 variants (fewer hold-time violations, higher fMAX) without changing the BGA footprint.
Estimated: MAX II I/O pins are organized into banks. Place all 3.3 V signals in one bank, 1.8 V in another, to avoid voltage conflicts. The 256-ball GF package exposes dedicated JTAG pins (TCK, TMS, TDI, TDO) - route these to a 2x5 or 1x10 header for ByteBlaster / USB-Blaster programming. Reserve a 4-pin header footprint even if programming is done at board test only, to allow field re-programming.
규정 준수 정보
RoHS compliant per 'G' suffix in part number. Lead-free reflow per JEDEC J-STD-020 up to 245 °C peak. Not AEC-Q100 qualified - use MAX V or Cyclone for safety-critical automotive.
