EPM570GF256-5N - 570 LEs MAX II CPLD 256-FBGA | Intel / Altera
MPN: EPM570GF256-5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.07 | $38.07 |
| 10 | $36.55 | $365.50 |
| 100 | $35.08 | $3,508.00 |
| 500 | $33.68 | $16,840.00 |
| 1,000 | $31.2 | $31,200.00 |
Drop-in alternatives for EPM570GF256-5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570F256C5N
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View Datasheet →EPM570GF100I5N
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View Datasheet →EPM570GF100C5N
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View Datasheet →EPM570GF256-5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Typical Gates | 440 (manufacturer marketing count) |
| User I/O Pins (max) | 160 |
| User Flash Memory (UFM) | 8 Kbits |
| Number of Logic Array Blocks (LABs) | 57 |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | Non-volatile Flash (instant-on) |
| Package | 256-ball FineLine BGA (GF) |
| Speed Grade | -5 (slowest in family) |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (Pb-free, 'G' suffix) |
| Internal Oscillator | Yes |
| Programming Interface | JTAG (IEEE 1149.1) |
EPM570GF256-5N 256-ball fineline bga (gf) Pin Configuration Guide
Complete pinout information for EPM570GF256-5N (256-ball fineline bga (gf) package) with 160 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GF256-5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 160 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF256-5N is suitable for 6 applications: Industrial Control & Factory Automation, I/O Expansion & Bus Bridging, Power Sequencing & Glue Logic, LED Display & Signage Controllers, Portable & Consumer Electronics, Automotive Body Electronics.
Industrial Control & Factory Automation
The EPM570GF256-5N's non-volatile instant-on behavior and 570 logic elements make it ideal for industrial control PLCs and factory automation modules where deterministic power-up is mandatory. With up to 160 user I/Os and multi-voltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V), it bridges legacy 5 V-tolerant signals to modern 3.3 V MCUs without external level shifters. The industrial temperature range (-40 °C to +100 °C) supports outdoor cabinets and harsh factory floors. Pair with the EPM570F256I5N for matched industrial variants and use Quartus Prime Lite for design entry.
Recommended
I/O Expansion & Bus Bridging
With 570 LEs and 160 I/Os, the EPM570GF256-5N serves as a flexible I/O expander bridging between microcontrollers and peripherals with mismatched bus widths or protocols. Designers can map 8-bit MCU ports to 16- or 32-bit parallel buses, implement custom peripherals (PWM, UART, SPI bridges), and reduce MCU pin count by offloading logic. The 8-Kbit user Flash memory stores configuration parameters or serial numbers, eliminating an external EEPROM. Same-family EPM570GF256C5N offers commercial-temp for non-industrial use.
Recommended
Power Sequencing & Glue Logic
The EPM570GF256-5N excels at power-sequencing logic in multi-rail systems: a single chip can sequence core, I/O, and analog rails with programmable delays using its internal oscillator. Compared to a discrete sequencer IC, the CPLD lets designers customize timing, fault response, and reset behavior in firmware, avoiding NRE charges. The non-volatile instant-on ensures rails come up in the correct order even after brown-outs. Use the EPM570F256I5N for industrial power-supply designs.
Recommended
LED Display & Signage Controllers
The EPM570GF256-5N drives multi-channel LED panels and scrolling-signage controllers with deterministic timing. With 160 I/Os and high-fanout per LE, a single chip can multiplex 16x32 or larger LED matrices while generating refresh, blanking, and PWM dimming in hardware - offloading the host MCU. The internal 8-Kbit Flash stores frame data and animation sequences. The 256-ball BGA footprint fits into compact PCB designs for indoor signage; for higher-density outdoor LED walls, migrate to MAX V 5M570ZF256.
Recommended
Portable & Consumer Electronics
Low standby current and instant-on Flash-based configuration suit the EPM570GF256-5N for battery-powered portable devices, wearables, and consumer electronics. The device wakes in microseconds - no boot PROM delay - making it ideal for always-on glue logic, button debouncing, and low-power state machines. The 1.8 V core plus multi-voltage I/O reduces regulator count; 0.18-µm process keeps dynamic power low. The Pb-free 'G' suffix is mandatory for consumer RoHS compliance.
Recommended
Automotive Body Electronics
Although not AEC-Q100 qualified, the EPM570GF256-5N is widely used in non-safety automotive body electronics - dashboard controllers, lighting modules, infotainment glue logic, and CAN/LIN bus bridges. Its 570 LEs, 160 I/Os, and industrial temperature rating cover most cabin environments. Designers should validate against AEC-Q100 requirements for safety-critical subsystems; for safety-rated designs, migrate to AEC-Q100-qualified MAX V or Cyclone devices.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF256-5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256C5N | EPM570F256I5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (GF) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 100-pin FineLine BGA - smaller | 100-pin FineLine BGA - smaller |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 (same die) | 570 (same die) |
| Speed Grade | -5 | -5 (same) | -5 (same) | -5 (same) | -5 (same) |
| Temperature Range | Industrial (per 'N' suffix) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) |
| User I/O (max) | 160 | 160 | 160 | 76 (fewer due to smaller package) | 76 (fewer due to smaller package) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| RoHS / Pb-free | Yes ('G' suffix) | Varies by sub-suffix | Varies by sub-suffix | Yes ('G' suffix) | Yes ('G' suffix) |
| Reference 1k Price | $31.20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile Flash configuration for instant-on (vs SRAM-based FPGAs (e.g., Cyclone))
- 160 user I/Os in compact 256-ball BGA (vs MAX II EPM240 / EPM127 (smaller density))
- Pb-free / RoHS compliant 'G' package (vs Legacy non-green MAX II variants)
- Internal 8-Kbit user Flash memory (vs Discrete EEPROM for non-volatile storage)
Design Notes
Estimated: the 256-ball FineLine BGA uses 1.0 mm ball pitch. Recommended PCB design rules: 0.6 mm pad diameter, 0.4 mm solder mask opening, microvia-in-pad for inner balls, and at least 4 routing layers to escape the dense BGA grid. Use a daisy-chain or breakout routing pattern to verify manufacturing yield before committing to production. The MAX II device handbook provides a reference PCB footprint in Allegro and DXF formats.
The EPM570GF256-5N requires a stable 1.8 V core supply and separate VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V). Place 100 nF decoupling caps adjacent to each power pin and a 10 µF bulk cap near the regulator. Power-up sequencing between VCCINT and VCCIO is not strictly required by MAX II but following core-first then I/O avoids latch-up. The internal oscillator eliminates the need for an external clock source for simple glue-logic designs.
Critical: the 'G' suffix indicates Pb-free / RoHS - verify this matches your assembly process before reflow. Do not mix 'G' (green) and non-'G' variants on the same panel as the peak reflow profile differs (245 °C vs 220 °C). Also note the -5 speed grade is the slowest in the family; if timing closure fails, migrate to -4 or -3 variants (fewer hold-time violations, higher fMAX) without changing the BGA footprint.
Estimated: MAX II I/O pins are organized into banks. Place all 3.3 V signals in one bank, 1.8 V in another, to avoid voltage conflicts. The 256-ball GF package exposes dedicated JTAG pins (TCK, TMS, TDI, TDO) - route these to a 2x5 or 1x10 header for ByteBlaster / USB-Blaster programming. Reserve a 4-pin header footprint even if programming is done at board test only, to allow field re-programming.
Compliance Information
RoHS compliant per 'G' suffix in part number. Lead-free reflow per JEDEC J-STD-020 up to 245 °C peak. Not AEC-Q100 qualified - use MAX V or Cyclone for safety-critical automotive.
