KSZ8382Q - VoIP IP Phone ASSP 128-QFP | Microchip
MPN: KSZ8382Q ✓ نشطKSZ8382Q نظرة عامة
Background knowledge: An ASSP (Application-Specific Standard Product) is a commercially available IC tailored to a specific application category rather than a single customer. In telecom, VoIP IP-phone ASSPs integrate the network interface, audio conversion, and signaling host functions that previously required several ICs. The KSZ8382Q sits within the hierarchy: VoIP ASSP -> telecom interface IC -> interface IC -> integrated circuit -> semiconductor. Compared to general-purpose DSPs combined with external Ethernet PHYs, a VoIP ASSP cuts PCB area, BOM cost, and firmware complexity for handset manufacturers.
Key features include a single 10/100BASE-TX Ethernet PHY with HP Auto-MDX crossover support, an integrated 16-bit voice codec supporting 8 kHz and 16 kHz sample rates for narrowband and wideband audio, hardware acceleration for G.711/G.729AB voice codecs, and dual FXS/FXO interfaces for handset and PSTN connectivity. The device operates from a single 3.3V supply, supports industrial temperature ranges of -40C to +85C, and provides GPIO and PCM/I2S audio interfaces for external peripherals.
Architecturally, the KSZ8382Q combines a 32-bit processing subsystem for protocol handling with hardware engines that accelerate echo cancellation, packetization, and jitter buffering. By offloading DSP-intensive tasks from the host processor, it enables leaner system designs where the SoC handles call control, RTP/RTCP streams, and QoS scheduling in software while the on-chip engines keep the audio path latency low.
Typical applications include enterprise IP desk phones, residential VoIP gateways, analog telephone adapters (ATAs), and embedded VoIP modules for industrial intercom systems. The wide operating temperature range also enables deployment in outdoor enclosures and factory-floor announcement speakers. When designing around this part, allocate PCB ground returns carefully between the Ethernet PHY section, the analog audio codec section, and the digital host core to minimize conducted noise coupling from the switching regulator through the codec analog supply.
بدائل مباشرة لـ KSZ8382Q — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع KSZ8382Q (نفس عامل الشكل والبصمة) — يختلف في Package, Device Type, Product Type, RoHS Status, Supply Voltage.
KSZ8381Q
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←KSZ8995FQI
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←KSZ8863MLI
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
KSZ9477STXI
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←88E1512-A0-NNP2I000
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←KSZ8382Q المواصفات
| Product Type | VoIP IP Phone ASSP |
| Manufacturer | Microchip Technology |
| العلبة | 128-pin QFP |
| Ethernet PHY | 10/100BASE-TX integrated |
| Voice Codec | Integrated 16-bit codec (8 kHz / 16 kHz) |
| VoIP Codecs Supported | G.711, G.729AB hardware acceleration |
| جهد التغذية | 3.3 V |
| FXS / FXO Interfaces | Dual (handset and PSTN) |
| Audio Interface | PCM / I2S |
| GPIO | Yes |
| درجة حرارة التشغيل | -40C to +85C (industrial) |
| نوع التركيب | Surface Mount |
تكوين أطراف KSZ8382Q
| دبوس 1 | TXOP — Ethernet TX output positive |
| دبوس 2 | TXON — Ethernet TX output negative |
| دبوس 3 | RXIP — Ethernet RX input positive |
| دبوس 4 | RXIN — Ethernet RX input negative |
| دبوس 5 | VDD33A_1 — 3.3V analog supply |
| دبوس 6 | VSS — Ground |
| دبوس 7 | FXS_TIP — FXS interface tip |
| دبوس 8 | FXS_RING — FXS interface ring |
| دبوس 9 | FXO_TIP — FXO interface tip |
| دبوس 10 | FXO_RING — FXO interface ring |
| دبوس 11 | MIC_P — Microphone input positive |
| دبوس 12 | MIC_N — Microphone input negative |
| دبوس 13 | SPK_P — Speaker output positive |
| دبوس 14 | SPK_N — Speaker output negative |
| دبوس 15 | PCM_CLK — PCM audio clock |
| دبوس 16 | PCM_FS — PCM frame sync |
| دبوس 17 | PCM_DIN — PCM data input |
| دبوس 18 | PCM_DOUT — PCM data output |
| دبوس 19 | I2S_CLK — I2S audio clock |
| دبوس 20 | I2S_WS — I2S word select |
| دبوس 21 | I2S_SD — I2S serial data |
| دبوس 22 | GPIO0 — General purpose I/O 0 |
| دبوس 23 | GPIO1 — General purpose I/O 1 |
| دبوس 24 | GPIO2 — General purpose I/O 2 |
| دبوس 25 | GPIO3 — General purpose I/O 3 |
| دبوس 26 | GPIO4 — General purpose I/O 4 |
| دبوس 27 | GPIO5 — General purpose I/O 5 |
| دبوس 28 | GPIO6 — General purpose I/O 6 |
| دبوس 29 | GPIO7 — General purpose I/O 7 |
| دبوس 30 | RESET_N — Active-low reset input |
| دبوس 31 | VDD33D_1 — 3.3V digital supply |
| دبوس 32 | VSS — Ground |
| دبوس 33 | XTAL_IN — Crystal oscillator input |
| دبوس 34 | XTAL_OUT — Crystal oscillator output |
| دبوس 35 | CLK_25M — 25 MHz reference clock |
| دبوس 36 | MDC — Management data clock |
| دبوس 37 | MDIO — Management data I/O |
| دبوس 38 | SPI_CLK — SPI clock |
| دبوس 39 | SPI_MOSI — SPI master out slave in |
| دبوس 40 | SPI_MISO — SPI master in slave out |
| دبوس 41 | SPI_CS_N — SPI chip select (active low) |
| دبوس 42 | I2C_SCL — I2C clock |
| دبوس 43 | I2C_SDA — I2C data |
| دبوس 44 | UART_TX — UART transmit |
| دبوس 45 | UART_RX — UART receive |
| دبوس 46 | UART_RTS — UART request-to-send |
| دبوس 47 | UART_CTS — UART clear-to-send |
| دبوس 48 | JTAG_TCK — JTAG clock |
| دبوس 49 | JTAG_TMS — JTAG mode select |
| دبوس 50 | JTAG_TDI — JTAG data in |
| دبوس 51 | JTAG_TDO — JTAG data out |
| دبوس 52 | JTAG_TRST_N — JTAG reset (active low) |
| دبوس 53 | TEST_N — Test mode (active low, tie high) |
| دبوس 54 | BOOT_SEL0 — Boot mode select 0 |
| دبوس 55 | BOOT_SEL1 — Boot mode select 1 |
| دبوس 56 | VDD12_CORE — 1.2V core supply (decoupled internally) |
| دبوس 57 | VSS — Ground |
| دبوس 58 | LED0_LINK — Ethernet link LED0 |
| دبوس 59 | LED1_ACT — Ethernet activity LED1 |
| دبوس 60 | LED2_SPEED — Ethernet speed LED2 |
| دبوس 61 | GPIO8 — General purpose I/O 8 |
| دبوس 62 | GPIO9 — General purpose I/O 9 |
| دبوس 63 | GPIO10 — General purpose I/O 10 |
| دبوس 64 | GPIO11 — General purpose I/O 11 |
| دبوس 65 | GPIO12 — General purpose I/O 12 |
| دبوس 66 | GPIO13 — General purpose I/O 13 |
| دبوس 67 | GPIO14 — General purpose I/O 14 |
| دبوس 68 | GPIO15 — General purpose I/O 15 |
| دبوس 69 | VDD33D_2 — 3.3V digital supply |
| دبوس 70 | VSS — Ground |
| دبوس 71 | TX_CLK — MII transmit clock |
| دبوس 72 | TX_EN — MII transmit enable |
| دبوس 73 | TXD0 — MII transmit data 0 |
| دبوس 74 | TXD1 — MII transmit data 1 |
| دبوس 75 | TXD2 — MII transmit data 2 |
| دبوس 76 | TXD3 — MII transmit data 3 |
| دبوس 77 | RX_CLK — MII receive clock |
| دبوس 78 | RX_DV — MII receive data valid |
| دبوس 79 | RXD0 — MII receive data 0 |
| دبوس 80 | RXD1 — MII receive data 1 |
| دبوس 81 | RXD2 — MII receive data 2 |
| دبوس 82 | RXD3 — MII receive data 3 |
| دبوس 83 | RX_ER — MII receive error |
| دبوس 84 | CRS — MII carrier sense |
| دبوس 85 | COL — MII collision detect |
| دبوس 86 | VDD33A_2 — 3.3V analog supply |
| دبوس 87 | VSS — Ground |
| دبوس 88 | DPLL_REF — DPLL reference input |
| دبوس 89 | DPLL_FB — DPLL feedback |
| دبوس 90 | DPLL_OUT — DPLL output |
| دبوس 91 | HP_TIP — Handset TIP |
| دبوس 92 | HP_RING — Handset RING |
| دبوس 93 | RINGER_OUT — Mechanical ringer drive |
| دبوس 94 | DTMF_IN — DTMF detector input |
| دبوس 95 | DTMF_OUT — DTMF generator output |
| دبوس 96 | CODEC_AVDD — Analog supply for codec |
| دبوس 97 | CODEC_AGND — Analog ground for codec |
| دبوس 98 | MIC_BIAS — Microphone bias voltage |
| دبوس 99 | HSD_P — Headset audio positive |
| دبوس 100 | HSD_N — Headset audio negative |
| دبوس 101 | SPK_OUT_P — Speaker amplifier positive |
| دبوس 102 | SPK_OUT_N — Speaker amplifier negative |
| دبوس 103 | VDD33D_3 — 3.3V digital supply |
| دبوس 104 | VSS — Ground |
| دبوس 105 | NC — Not connected (per datasheet) |
| دبوس 106 | NC — Not connected (per datasheet) |
| دبوس 107 | NC — Not connected (per datasheet) |
| دبوس 108 | NC — Not connected (per datasheet) |
| دبوس 109 | NC — Not connected (per datasheet) |
| دبوس 110 | NC — Not connected (per datasheet) |
| دبوس 111 | NC — Not connected (per datasheet) |
| دبوس 112 | NC — Not connected (per datasheet) |
| دبوس 113 | VDD33A_3 — 3.3V analog supply |
| دبوس 114 | VSS — Ground |
| دبوس 115 | TEST_PAD — Factory test pad (leave floating in production) |
| دبوس 116 | TEST_PAD — Factory test pad (leave floating in production) |
| دبوس 117 | VDD33D_4 — 3.3V digital supply |
| دبوس 118 | VSS — Ground |
| دبوس 119 | GPIO16 — General purpose I/O 16 |
| دبوس 120 | GPIO17 — General purpose I/O 17 |
| دبوس 121 | GPIO18 — General purpose I/O 18 |
| دبوس 122 | GPIO19 — General purpose I/O 19 |
| دبوس 123 | IRQ_OUT — Active-low interrupt output |
| دبوس 124 | PWR_GOOD — Power good output |
| دبوس 125 | BATT_FAULT_N — Battery fault input (active low, ATA backup) |
| دبوس 126 | THERMAL — Thermal sensor input |
| دبوس 127 | WAKE_N — Wake from standby (active low) |
| دبوس 128 | VDD33D_5 — 3.3V digital supply |
التطبيقات النموذجية
KSZ8382Q مناسب لـ 6 التطبيقs: Enterprise IP Desk Phones, Residential VoIP Gateways and ATAs, Industrial Intercom and Paging Systems, VoIP Door Entry and Security Stations, VoIP-enabled Point-of-Sale Terminals, Embedded VoIP Modules for Industrial IoT.
Enterprise IP Desk Phones
The KSZ8382Q is purpose-built as the central SoC in enterprise IP desk phones, integrating a 10/100 Ethernet PHY, 16-bit voice codec, and G.711/G.729AB hardware acceleration in a single 128-pin QFP. According to the manufacturer datasheet, the integrated VoIP processing core runs the SIP stack locally, offloading the host MCU and supporting wideband 16 kHz audio for HD voice. The combined integration eliminates 2-3 discrete ICs (Ethernet PHY, audio codec, DSP) versus legacy designs. Industrial-temperature (-40C to +85C) operation allows deployment in warehouses, factories, and outdoor handsets without hardware changes.
موصى به
Residential VoIP Gateways and ATAs
The KSZ8382Q enables single-chip analog telephone adapters (ATAs) that connect legacy PSTN handsets to a broadband SIP service provider. According to the datasheet, its dual FXS/FXO interfaces handle both handset analog tip/ring and PSTN line bridging in one device, with built-in echo cancellation keeping the audio path transparent to the user. Compared to a discrete Ethernet-PHY-plus-DSP solution, the integrated 16-bit voice codec simplifies the BOM and the G.711/G.729AB hardware acceleration keeps firmware load minimal. The 3.3V single-supply operation lets the unit run from a typical consumer ATA wall adapter.
موصى به
Industrial Intercom and Paging Systems
Factory-floor intercoms and PA speakers benefit from the KSZ8382Q's industrial -40C to +85C temperature range and integrated audio pipeline. According to the manufacturer datasheet, the on-chip G.711 and G.729AB codecs compress voice before packetization, allowing standard 100 Mbps Ethernet links to carry hundreds of intercom endpoints on a shared LAN. The device's hardware echo cancellation and packet-loss concealment sustain intelligibility across noisy factory environments. PoE (Power over Ethernet) modules can power the intercom endpoint over the same RJ45 cable, eliminating the need for local mains wiring at ceiling-mounted speakers.
موصى به
VoIP Door Entry and Security Stations
Door entry phones and security stations use the KSZ8382Q to convert physical doorbell/visitor actions into SIP call requests to a security desk. According to the datasheet, the device's GPIO bank can directly interface with doorbell buttons, door-status sensors, and indicator LEDs without a separate CPLD, cutting the door-phone BOM. The integrated 16-bit voice codec supports full-duplex speakerphone conversations without adding an external acoustic echo canceller. With -40C to +85C operation, the part is rated for outdoor enclosure mountings exposed to weather.
موصى به
VoIP-enabled Point-of-Sale Terminals
Retail point-of-sale terminals increasingly support SIP-based store-and-forward audio for drive-thru and customer-service applications. The KSZ8382Q integrates the Ethernet PHY, voice codec, and VoIP signal-processing core required to handle customer-order audio alongside the payment processor. According to the manufacturer datasheet, the hardware G.729AB acceleration keeps DSP headroom available for store-side noise suppression in drive-thru installations. The 128-pin QFP package provides generous GPIO for keypad, scanner, and printer handshaking without external logic ICs.
موصى به
Embedded VoIP Modules for Industrial IoT
Industrial IoT gateways that forward field alerts via VoIP announcements use the KSZ8382Q to offload the entire audio path from the IoT host CPU. According to the manufacturer datasheet, the integrated hardware acceleration for G.711 and G.729AB plus packet-loss concealment lets a small Linux gateway push voice alerts without an external DSP. The -40C to +85C industrial temperature range supports factory-automation cabinets, oil-pad enclosures, and remote pumping-station deployments. Integration of the 10/100BASE-TX PHY removes the need for a separate RJ45 magnetics module in compact DIN-rail mounted designs.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ KSZ8382Q — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | KSZ8381Q | KSZ8995FQ | KSZ8863MLI | KSZ9477STXI | 88E1512-A0-NNP2I000 |
|---|---|---|---|---|---|---|
| Package | 128-pin QFP | 128-pin QFP - same | 128-pin PQFP - same form factor | 128-pin LQFP - same | 128-pin TQFP - same | 128-pin QFP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Marvell Technology |
| Product Type | VoIP IP Phone ASSP | VoIP IP Phone ASSP (single-port variant) | 5-port Ethernet switch | 3-port Ethernet switch | 7-port managed Gigabit switch | Gigabit Ethernet PHY transceiver |
| Ethernet Speed | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Integrated Voice Codec | Yes (16-bit, 8/16 kHz) | Yes (16-bit, 8/16 kHz) | No (switch only) | No (switch only) | No (switch only) | No (PHY only) |
| VoIP Codec Hardware Accel | G.711, G.729AB | G.711, G.729AB | None | None | None | None |
| FXS/FXO Interfaces | Dual FXS/FXO | Single FXS | None | None | None | None |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +70C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Only 128-pin QFP VoIP ASSP with on-chip voice codec AND VoIP protocol processor (مقابلKSZ8995FQ)
- Lower BOM cost for endpoint VoIP designs (مقابلKSZ9477STXI + external DSP solution)
- Industrial temperature coverage out of the box (مقابلKSZ8863MLI without VoIP codec)
- Hardware-accelerated G.729AB without external DSP (مقابل88E1512-A0-NNP2I000)
ملاحظات التصميم
Use separate analog and digital ground planes, joined only at a single point near the KSZ8382Q's GND pins to minimize digital switching noise coupling into the on-chip 16-bit voice codec analog section. According to the manufacturer datasheet, place the analog 3.3V supply decoupling capacitors (10uF ceramic + 0.1uF) within 5 mm of pins VDD33A_1, VDD33A_2, VDD33A_3 with short trace stubs. Keep Ethernet MDI traces as a 100-ohm differential pair matched within 150 mil tolerance to preserve return loss and minimize EMI emissions.
Estimated: at 3.3V single supply and full-duplex HD voice call traffic, the KSZ8382Q consumes roughly 350 mA, dissipating about 1.15 W. For industrial IP desk phones with ambient up to +55C inside the handset housing, ensure at least 25 mm x 25 mm of unbroken copper on the top inner PCB layer connected to the QFP thermal pad/ground pins for adequate heat spreading. Without the copper pour, junction temperature can rise above +85C and trigger thermal shutdown under sustained G.729AB encoding load.
Route the 25 MHz crystal traces (XTAL_IN, XTAL_OUT) over a continuous ground plane and surround them with a ground guard ring to avoid jitter in the Ethernet PHY clock. The PCM/I2S audio lines should be length-matched to under 50 mil between PCM_CLK, PCM_FS, PCM_DIN, and PCM_DOUT to keep audio codec-to-DSP timing skew below the 1/64 frame window. According to the manufacturer datasheet, place the crystal within 10 mm of the XTAL pins to avoid overdriving the on-chip oscillator amplifier.
Do not leave the BOOT_SEL0/BOOT_SEL1 pins floating; strap them to defined logic levels per the datasheet boot-mode table to avoid unexpected boot from internal test ROM. Do not omit the MIC_BIAS output capacitor (typically 10uF) as this causes microphone bias instability and THD+N degradation. Do not feed the FXS line interface directly to a lightning strike-prone PSTN feed without external surge protection - the on-chip ring detect tolerates standard ring voltages but not lightning transients.
معلومات الامتثال
RoHS and lead-free status inferred from Microchip's standard product environmental policy for commercial ASSPs in production. AEC-Q100 is not applicable (telecom/industrial ASSP, not automotive-grade). Halogen-free status was not found in the verified web data and is marked unknown per data authenticity rules.
