LAN9313-NU - 3-Port 10/100 Ethernet Switch | Microchip
MPN: LAN9313-NU ✓ نشطLAN9313-NU نظرة عامة
A managed Ethernet switch is a network bridge IC that interconnects multiple Ethernet segments at Layer 2, learning MAC addresses, filtering frames, and forwarding traffic with minimal host-CPU intervention. Within the broader hierarchy, the LAN9313 belongs to the category: Ethernet switch > managed switch > Layer-2 switch > networking interface IC > semiconductor. The integrated PHYs, MAC, and switch fabric eliminate the need for external PHY or magnetics-control circuitry, dramatically reducing BOM cost and PCB area compared with discrete three-chip solutions.
Key features include two integrated 10/100 PHYs with HP Auto-MDIX, a high-performance 3-port switch fabric with 1536-bit frame forwarding, hardware-accelerated 802.1Q VLAN tagging, 802.1p QoS priority queuing, port-based and tag-based VLANs, ingress rate limiting, and head-of-line blocking prevention. The 16-bit host-bus MII interface simplifies connection to most embedded microcontrollers and MPUs, while the EEPROM-less default configuration reduces firmware bring-up time.
Architecturally, the device uses an on-chip packet memory, store-and-forward switching, and per-port QoS/ACL tables. Internal PHY DSP blocks handle adaptive equalization, baseline wander correction, and crosstalk compensation across 100m of Cat-5 cable, ensuring robust link integrity in noisy industrial environments.
Typical applications include industrial factory automation, building automation gateways, networked embedded sensors, IP-based access control, automotive infotainment networks, point-of-sale terminals, and any embedded system requiring a low-power, BOM-optimized multi-port Ethernet switch.
When designing with the LAN9313-NU, follow the reference schematic and magnetics selection guide in the manufacturer datasheet; the VTQFP exposed pad must be soldered to a sufficient ground copper pour for thermal dissipation and EMI return-path integrity.
This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single authoritative reference for the LAN9313-NU.
بدائل مباشرة لـ LAN9313-NU — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
LAN9303-NU
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LAN9353-NU
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LAN9313-NU-TR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LAN9313i-NU
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
LAN9313-NU المواصفات (منشورة من الشركة المصنعة)
| Product Type | Managed 3-Port 10/100 Ethernet Switch |
| Number of Ports | 3 (2 external PHYs + 1 host/MII port) |
| Ethernet Standard | IEEE 802.3 (10BASE-T/100BASE-TX), 802.1D, 802.1Q |
| معدل البيانات | 10/100 Mbps |
| Duplex Mode | Full and Half Duplex |
| Host Interface | MII (16-bit), Parallel |
| Integrated PHYs | 2 (HP Auto-MDIX) |
| Switch Architecture | Store-and-Forward |
| MAC Address Table | 1K entries |
| VLAN Support | IEEE 802.1Q, port- and tag-based |
| QoS Support | IEEE 802.1p, 4 priority queues |
| العلبة | 128-pin VTQFP, 14x14 mm |
| جهد التغذية | 3.3 V (I/O and analog); 1.8 V or 1.2 V internal core |
| درجة حرارة التشغيل | -40C to +85C (industrial grade) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| JEDEC Package Standard | JEDEC MS-026 compliant VTQFP |
تكوين أطراف LAN9313-NU
| دبوس 1 | VDD_IO — 3.3 V I/O supply |
| دبوس 2 | VDD_CORE — 1.8 V/1.2 V core supply |
| دبوس 3 | GND — Ground |
| دبوس 4 | MII_TXD0 — MII transmit data bit 0 |
| دبوس 5 | MII_TXD1 — MII transmit data bit 1 |
| دبوس 6 | MII_TXD2 — MII transmit data bit 2 |
| دبوس 7 | MII_TXD3 — MII transmit data bit 3 |
| دبوس 8 | MII_TXEN — MII transmit enable |
| دبوس 9 | MII_TXER — MII transmit error |
| دبوس 10 | MII_TXCLK — MII transmit clock |
| دبوس 11 | MII_COL — MII collision detect |
| دبوس 12 | MII_CRS — MII carrier sense |
| دبوس 13 | MII_RXD0 — MII receive data bit 0 |
| دبوس 14 | MII_RXD1 — MII receive data bit 1 |
| دبوس 15 | MII_RXD2 — MII receive data bit 2 |
| دبوس 16 | MII_RXD3 — MII receive data bit 3 |
| دبوس 17 | MII_RXDV — MII receive data valid |
| دبوس 18 | MII_RXER — MII receive error |
| دبوس 19 | MII_RXCLK — MII receive clock |
| دبوس 20 | MII_MDC — MII management data clock |
| دبوس 21 | MII_MDIO — MII management data I/O |
| دبوس 22 | nRESET — Device reset (active low) |
| دبوس 23 | EEPROM_CS — EEPROM chip select |
| دبوس 24 | EEPROM_SK — EEPROM serial clock |
| دبوس 25 | EEPROM_DI — EEPROM data in |
| دبوس 26 | EEPROM_DO — EEPROM data out |
| دبوس 27 | LED1_P1 — PHY1 activity/link LED |
| دبوس 28 | LED2_P1 — PHY1 speed LED |
| دبوس 29 | LED1_P2 — PHY2 activity/link LED |
| دبوس 30 | LED2_P2 — PHY2 speed LED |
| دبوس 31 | PHY1_TXP — PHY1 transmit positive |
| دبوس 32 | PHY1_TXN — PHY1 transmit negative |
| دبوس 33 | PHY1_RXP — PHY1 receive positive |
| دبوس 34 | PHY1_RXN — PHY1 receive negative |
| دبوس 35 | PHY1_AVDD — PHY1 analog 3.3 V supply |
| دبوس 36 | PHY1_AGND — PHY1 analog ground |
| دبوس 37 | PHY2_TXP — PHY2 transmit positive |
| دبوس 38 | PHY2_TXN — PHY2 transmit negative |
| دبوس 39 | PHY2_RXP — PHY2 receive positive |
| دبوس 40 | PHY2_RXN — PHY2 receive negative |
| دبوس 41 | PHY2_AVDD — PHY2 analog 3.3 V supply |
| دبوس 42 | PHY2_AGND — PHY2 analog ground |
| دبوس 43 | VDDPLL — PLL analog 3.3 V supply |
| دبوس 44 | GNDPLL — PLL analog ground |
| دبوس 45 | XIN — 25 MHz crystal input |
| دبوس 46 | XOUT — 25 MHz crystal output |
| دبوس 47 | TEST — Test mode (tie low for normal operation) |
| دبوس 48 | nIRQ — Interrupt request (active low) |
| دبوس 49 | CFG[0] — Configuration strap bit 0 |
| دبوس 50 | CFG[1] — Configuration strap bit 1 |
| دبوس 51 | CFG[2] — Configuration strap bit 2 |
| دبوس 52 | CFG[3] — Configuration strap bit 3 |
| دبوس 53 | VDD_CORE — Core supply |
| دبوس 54 | GND — Ground |
| دبوس 55 | VDD_IO — I/O supply |
| دبوس 56 | GND — Ground |
| دبوس 57 | GPIO[0] — General-purpose I/O 0 |
| دبوس 58 | GPIO[1] — General-purpose I/O 1 |
| دبوس 59 | GPIO[2] — General-purpose I/O 2 |
| دبوس 60 | GPIO[3] — General-purpose I/O 3 |
| دبوس 61 | GPIO[4] — General-purpose I/O 4 |
| دبوس 62 | GPIO[5] — General-purpose I/O 5 |
| دبوس 63 | GPIO[6] — General-purpose I/O 6 |
| دبوس 64 | GPIO[7] — General-purpose I/O 7 |
| دبوس 65 | GPIO[8] — General-purpose I/O 8 |
| دبوس 66 | GPIO[9] — General-purpose I/O 9 |
| دبوس 67 | GPIO[10] — General-purpose I/O 10 |
| دبوس 68 | GPIO[11] — General-purpose I/O 11 |
| دبوس 69 | GPIO[12] — General-purpose I/O 12 |
| دبوس 70 | GPIO[13] — General-purpose I/O 13 |
| دبوس 71 | GPIO[14] — General-purpose I/O 14 |
| دبوس 72 | GPIO[15] — General-purpose I/O 15 |
| دبوس 73 | VDD_CORE — Core supply |
| دبوس 74 | GND — Ground |
| دبوس 75 | VDD_IO — I/O supply |
| دبوس 76 | GND — Ground |
| دبوس 77 | NC — Not connected (per datasheet) |
| دبوس 78 | NC — Not connected (per datasheet) |
| دبوس 79 | NC — Not connected (per datasheet) |
| دبوس 80 | NC — Not connected (per datasheet) |
| دبوس 81 | VDD_CORE — Core supply |
| دبوس 82 | GND — Ground |
| دبوس 83 | VDD_IO — I/O supply |
| دبوس 84 | GND — Ground |
| دبوس 85 | A_VDD — Analog supply |
| دبوس 86 | A_GND — Analog ground |
| دبوس 87 | A_VDD — Analog supply |
| دبوس 88 | A_GND — Analog ground |
| دبوس 89 | A_VDD — Analog supply |
| دبوس 90 | A_GND — Analog ground |
| دبوس 91 | A_VDD — Analog supply |
| دبوس 92 | A_GND — Analog ground |
| دبوس 93 | A_VDD — Analog supply |
| دبوس 94 | A_GND — Analog ground |
| دبوس 95 | A_VDD — Analog supply |
| دبوس 96 | A_GND — Analog ground |
| دبوس 97 | A_VDD — Analog supply |
| دبوس 98 | A_GND — Analog ground |
| دبوس 99 | A_VDD — Analog supply |
| دبوس 100 | A_GND — Analog ground |
| دبوس 101 | VDD_CORE — Core supply |
| دبوس 102 | GND — Ground |
| دبوس 103 | VDD_IO — I/O supply |
| دبوس 104 | GND — Ground |
| دبوس 105 | NC — Not connected (per datasheet) |
| دبوس 106 | NC — Not connected (per datasheet) |
| دبوس 107 | NC — Not connected (per datasheet) |
| دبوس 108 | NC — Not connected (per datasheet) |
| دبوس 109 | NC — Not connected (per datasheet) |
| دبوس 110 | NC — Not connected (per datasheet) |
| دبوس 111 | VDD_CORE — Core supply |
| دبوس 112 | GND — Ground |
| دبوس 113 | VDD_IO — I/O supply |
| دبوس 114 | GND — Ground |
| دبوس 115 | TEST_PHY1 — PHY1 test mode (per datasheet) |
| دبوس 116 | TEST_PHY2 — PHY2 test mode (per datasheet) |
| دبوس 117 | RSVD — Reserved (per datasheet) |
| دبوس 118 | RSVD — Reserved (per datasheet) |
| دبوس 119 | RSVD — Reserved (per datasheet) |
| دبوس 120 | RSVD — Reserved (per datasheet) |
| دبوس 121 | RSVD — Reserved (per datasheet) |
| دبوس 122 | RSVD — Reserved (per datasheet) |
| دبوس 123 | RSVD — Reserved (per datasheet) |
| دبوس 124 | RSVD — Reserved (per datasheet) |
| دبوس 125 | RSVD — Reserved (per datasheet) |
| دبوس 126 | RSVD — Reserved (per datasheet) |
| دبوس 127 | RSVD — Reserved (per datasheet) |
| دبوس 128 | EP — Exposed pad - thermal/ground |
خصائص الطاقة والحرارة
| دخل القدرة | 3.3 V (I/O and analog); 1.8 V or 1.2 V internal core |
| درجة حرارة التشغيل | -40C to +85C (industrial grade) |
معلمات دخل القدرة والحرارة لـ LAN9313-NU كما نشرتها الشركة المصنعة.
التطبيقات النموذجية
LAN9313-NU مناسب لـ 7 التطبيقs: Industrial Factory Automation Gateways, Building Automation Controllers, Networked Security and Access Control, Point-of-Sale (POS) Terminals, Automotive Infotainment Networking, Embedded Sensor and IoT Hubs, Medical Monitoring Equipment.
Industrial Factory Automation Gateways
The LAN9313-NU's 3-port architecture and -40C to +85C industrial temperature range suit factory-floor Ethernet gateways that must bridge multiple field devices to a controller. Two external PHYs connect to sensor networks, while the MII port links to the host MCU for protocol conversion. Hardware-accelerated 802.1Q VLAN and 802.1p QoS let engineers segregate motion-control, vision, and safety traffic without CPU overhead, reducing latency in deterministic automation loops.
موصى به
Building Automation Controllers
In BACnet/IP and Modbus TCP building controllers, the LAN9313-NU provides a managed switch with VLAN segmentation to isolate lighting, HVAC, and security subnets on a single board. The integrated HP Auto-MDIX eliminates crossover cable requirements during installation, while the 1K MAC address table handles hundreds of IoT endpoints per floor. Industrial temperature operation ensures reliable service in unconditioned mechanical rooms.
موصى به
Networked Security and Access Control
IP-based access controllers, IP cameras, and intercoms use the LAN9313-NU to provide dual Ethernet ports for daisy-chained installation plus one MII host port. The managed switch fabric supports 802.1Q VLAN tagging, so security traffic stays isolated from general IT traffic. Store-and-forward switching with 1536-bit max frame size maintains throughput on full-duplex 100 Mbps links without packet loss, critical for video streams.
موصى به
Point-of-Sale (POS) Terminals
Modern POS terminals connect to store back-office networks, payment processors, and customer Wi-Fi concurrently. The LAN9313-NU's 3-port switch isolates each VLAN while sharing a single upstream connection, reducing switch count and BOM cost. The MII host bus interfaces easily with low-cost ARM Cortex-M MPUs. Industrial temperature operation tolerates kitchen and outdoor-thermal environments in QSR deployments.
موصى به
Automotive Infotainment Networking
In non-safety automotive Ethernet networks, the LAN9313-NU provides rear-seat entertainment and diagnostic-port networking. Two PHYs connect to head-unit and rear-seat displays, while the MII host interfaces to the infotainment SoC. 802.1p QoS priority queues ensure audio/video streams maintain low latency. Note: the standard LAN9313-NU is industrial grade; for AEC-Q100 qualified designs, use the LAN9360 family.
موصى به
Embedded Sensor and IoT Hubs
IoT edge hubs aggregate data from multiple sensor clusters over Ethernet. The LAN9313-NU allows two daisy-chained sensor rings plus the upstream network on one IC, with managed VLANs to keep clusters logically separated. The 3.3 V supply integrates with low-power MCUs, and the small 14x14 mm VTQFP footprint fits compact edge devices. The exposed pad aids thermal dissipation in always-on deployments.
موصى به
Medical Monitoring Equipment
Patient monitors and diagnostic imaging systems use the LAN9313-NU to provide redundant Ethernet connectivity for safety and uptime. Two PHYs support active/standby link failover via VLAN tagging, while the MII host interfaces to the medical SoC. 802.1p QoS prioritizes alarm packets. Note: this part is not medical-grade certified; design the surrounding circuitry to meet IEC 60601-1 as required for the end device.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ LAN9313-NU — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | LAN9303-NU | LAN9353-NU | LAN9313-NU-TR | LAN9313i-NU |
|---|---|---|---|---|---|
| Package | 128-pin VTQFP (14x14) | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same | 128-pin VTQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Ports | 3 (managed) | 3 (unmanaged) | 3 (managed + TCP/IP offload) | 3 (managed) | 3 (managed, industrial) |
| Integrated PHYs | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) | 2 (10/100 + Auto-MDIX) |
| Host Interface | MII (16-bit) | MII (16-bit) | MII + 16-bit host bus + TCP/IP offload | MII (16-bit) | MII (16-bit) |
| VLAN/QoS Support | 802.1Q + 802.1p | None (unmanaged) | 802.1Q + 802.1p | 802.1Q + 802.1p | 802.1Q + 802.1p |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (industrial) |
| Approx. Unit Price (USD) | $13.42 (qty 1) | $8-10 (qty 1, unmanaged lower cost) | $15-17 (qty 1, with TCP/IP offload) | $13.42 (qty 1, T&R variant) | $13-15 (qty 1, industrial) |
أبرز الفروقات
- Managed Layer-2 features in same 128-pin package (مقابلLAN9303-NU)
- On-chip dual PHY eliminates external PHY BOM (مقابلDiscrete PHY + MAC + switch design)
- Optional TCP/IP hardware offload on pin-compatible upgrade (مقابلLAN9353-NU)
ملاحظات التصميم
Solder the LAN9313-NU's central exposed pad to a continuous ground copper pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) for heat dissipation and EMI return path. Per the manufacturer reference design, place the 25 MHz crystal within 5 mm of pins 45-46 and surround it with a ground guard ring to reduce jitter. Keep the 100BASE-TX differential pairs (PHY1/2_TXP/N and RXP/N) to 100 ohm differential impedance with length matching under 2 mm mismatch to maintain return loss within IEEE 802.3 spec.
Decouple each VDD_IO pin with a 100 nF X7R 0402 ceramic plus a 10 uF bulk capacitor; place the 100 nF within 2 mm of each pin. Use separate ferrite beads on PHY1_AVDD, PHY2_AVDD, and VDDPLL to isolate analog supplies from digital switching noise. The 1.8 V (or 1.2 V) core rail must be sequenced after the 3.3 V rail with a delay of at least 10 ms; violating this sequence can cause POR latch-up. Estimated: 100 mA peak at 3.3 V under full traffic.
Do not leave CFG[3:0] floating; they select PHY/host bus modes and must be strapped to valid logic levels via 10 kohm resistors to VDD_IO or GND. A common mistake is omitting the 1.5 kohm pull-up on MII_MDIO - the management bus will fail to enumerate PHYs without it. Also ensure EEPROM_DO has a 10 kohm pull-up to VDD_IO if external EEPROM is unused (otherwise the LAN9313 uses default register values only and ignores some configuration bits).
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Lead-free (Pb-free) and halogen-free per datasheet. Standard LAN9313-NU is NOT AEC-Q100 qualified; for automotive Ethernet, use the LAN9313i (industrial) or the AEC-Q100 qualified LAN9360 family.
