MC34905CS3EK - SBC with CAN/LIN, 2x 3.3V/400mA LDOs | NXP
MPN: MC34905CS3EK ✓ نشطMC34905CS3EK نظرة عامة
What is a System Basis Chip? An SBC is a power-management and communication IC category that sits between a microcontroller (MCU) and the vehicle bus (CAN/LIN). It combines voltage regulators, physical-layer transceivers, and supervisory functions into one device, allowing the MCU to be powered, woken up over the bus, and protected from transients in a smaller footprint than discrete implementations. SBCs sit in the hierarchy: SBC -> PMIC -> power management IC -> semiconductor.
Key specifications include two 3.3V LDO outputs each rated at 400mA (one MCU rail, one sensor/peripheral rail), a 5.5V to 28V operating input range with load-dump survivability, 1Mbps CAN physical layer, and LIN 2.0 conformance. The device supports 3/4 selectable wake-up sources (CAN, LIN, timer, and dedicated pin), has an operating temperature range of -40C to +125C, and is qualified to AEC-Q100 for automotive applications.
Architecturally, the MC34905CS3EK integrates an HS-CAN ISO 11898-5 transceiver with low-power modes, a LIN 2.0/2.1 transceiver, and dual tracking LDOs with internal MOSFETs. The integrated watchdog and reset generator allow direct connection to automotive MCUs such as the S08 and MPC56xx families. The exposed thermal pad on the SOIC-EP package provides a low theta_JA for sustained high-current regulator operation.
Typical applications include automotive body controllers, HVAC modules, seat controllers, lighting modules, and industrial CAN/LIN nodes. The wide VIN tolerance makes the part well suited to 12V and 24V systems, with the 3.3V rails directly powering the host MCU and sensors.
Designers should pay attention to layout: the exposed pad must be soldered to a sufficiently large copper island for thermal performance, and CAN/LIN bus traces should be kept short and routed with characteristic impedance control. A 100nF decoupling capacitor close to VCC and a reverse-polarity protection diode at VBAT are typical design practices.
بدائل مباشرة لـ MC34905CS3EK — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC34905CS3EK (نفس عامل الشكل والبصمة) — يختلف في Function, Number of LDOs, Package.
MC34905CS3EK/R2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC33905S5EK
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC34905CS3EKR2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC33905LAEK
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC34903CS3EK
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MC34904CS3EK
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC34905CS3EK المواصفات
| الوظيفة | System Basis Chip (SBC) with HS-CAN, LIN, dual LDO |
| Number of LDOs | 2 |
| LDO Output Voltage | 3.3 V (both rails) |
| LDO Output Current | 400 mA per channel |
| Input Voltage Range (VBAT) | 5.5 V to 28 V (load-dump tolerant) |
| CAN Interface | HS-CAN ISO 11898-5, 1 Mbps |
| LIN Interface | LIN 2.0/2.1 compliant |
| Wake-up Sources | 3/4 (CAN, LIN, timer, wake-up pin) |
| درجة حرارة التشغيل | -40 C to +125 C |
| العلبة | 32-pin SOIC-EP |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| AEC-Q100 Qualification | Qualified |
| Output Voltage Accuracy | 3.234 V to 3.4 V (3.3 V +/-3%) |
تكوين أطراف MC34905CS3EK
| دبوس 1 | VBAT — Battery supply input (5.5V to 28V) |
| دبوس 2 | VCC1 — 3.3V LDO output 1, up to 400mA (MCU rail) |
| دبوس 3 | VCC2 — 3.3V LDO output 2, up to 400mA (peripheral rail) |
| دبوس 4 | GND — Ground reference |
| دبوس 5 | CANH — High-speed CAN high line |
| دبوس 6 | CANL — High-speed CAN low line |
| دبوس 7 | LIN — LIN bus line |
| دبوس 8 | TXD — CAN transmit data from MCU |
| دبوس 9 | RXD — CAN receive data to MCU |
| دبوس 10 | EN — Enable input for regulator control |
| دبوس 11 | RST — Reset output to MCU |
| دبوس 12 | WAKE — External wake-up input |
| دبوس 13 | MUX_OUT — Multiplexed analog/digital output |
| دبوس 14 | MISO — SPI master-in slave-out (if present) |
| دبوس 15 | MOSI — SPI master-out slave-in (if present) |
| دبوس 16 | SCK — SPI clock (if present) |
| دبوس 17 | CS — SPI chip select (if present) |
| دبوس 18 | INT — Interrupt output to MCU |
| دبوس 19 | WD_EN — Watchdog enable input |
| دبوس 20 | WD_RST — Watchdog reset input from MCU |
| دبوس 21 | TXD_LIN — LIN transmit data from MCU |
| دبوس 22 | RXD_LIN — LIN receive data to MCU |
| دبوس 23 | LIN_EN — LIN enable / slope control |
| دبوس 24 | CAN_EN — CAN transceiver enable |
| دبوس 25 | SLEEP — Sleep mode control input |
| دبوس 26 | BAT_SENSE — Battery voltage sense input |
| دبوس 27 | T_SENSE — Temperature sense input |
| دبوس 28 | A0 — Address / configuration input 0 |
| دبوس 29 | A1 — Address / configuration input 1 |
| دبوس 30 | NC — Not connected (per datasheet) |
| دبوس 31 | NC — Not connected (per datasheet) |
| دبوس 32 | NC — Not connected (per datasheet) |
| دبوس 33 | EP — Exposed thermal pad, connect to GND |
التطبيقات النموذجية
MC34905CS3EK مناسب لـ 6 التطبيقs: Automotive Body Control Module (BCM), HVAC Control Module, Automotive Seat Controller, Automotive Lighting Module (Headlamp/Tail), Industrial CAN/LIN Sensor Node, Battery Management Slave Module (12V/24V Auxiliary).
Automotive Body Control Module (BCM)
The MC34905CS3EK fits automotive BCMs because it provides both 3.3V rails (one for the host MCU, one for sensor peripherals) at 400mA each, eliminating two discrete LDOs. Its integrated HS-CAN transceiver at 1Mbps interfaces directly with the vehicle CAN bus, while the LIN 2.0 transceiver connects to door-mirror, seat, or window sub-modules. With AEC-Q100 grade-1 qualification (-40C to +125C) and 28V load-dump tolerance on VBAT, it survives the harsh 12V automotive electrical environment.
موصى به
HVAC Control Module
In HVAC control modules, the MC34905CS3EK supplies the blower-motor MCU and the climate-control sensor array from its two 3.3V/400mA rails, while the CAN transceiver links the module to the vehicle CAN bus and the LIN bus connects to local smart actuators. The 5.5V to 28V VBAT range covers cranking dips and jump-start events on both 12V passenger and 24V truck HVAC systems. Low quiescent current in sleep mode preserves battery life during long parking periods.
موصى به
Automotive Seat Controller
Seat-position and heating controllers use the MC34905CS3EK to communicate over LIN 2.0 with the master BCM and over CAN with the instrument cluster for driver-feedback. The dual 3.3V LDOs power the small S08 or S12 MCU and a position-sensor IC, while the part's multiple wake-up sources allow the seat module to be awakened by either bus or a wake pin. AEC-Q100 grade-1 operation to +125C supports mounting in the seat base where ambient temperatures are high.
موصى به
Automotive Lighting Module (Headlamp/Tail)
LED headlamp and tail-lighting modules use the MC34905CS3EK to drive an MCU that controls matrix-LED drivers over SPI, while communicating with the BCM over CAN and LIN. The two 3.3V rails split the MCU and LED-driver logic supply cleanly, reducing ground-loop noise. The 28V load-dump tolerance ensures the SBC survives the inductive kickback from headlamp relay coils and PWM-driven LED strings.
موصى به
Industrial CAN/LIN Sensor Node
Beyond automotive, the MC34905CS3EK is used in industrial 24V CAN/LIN sensor nodes for factory automation and process control. Its 28V input tolerance and 3.3V/400mA rails allow the same BOM to power both 24V industrial sensors and the MCU running CANopen or DeviceNet. The integrated LIN transceiver supports cost-effective sub-network slaves that bridge back to a CAN master.
موصى به
Battery Management Slave Module (12V/24V Auxiliary)
Auxiliary battery management modules in 12V start-stop and 24V truck battery systems use the MC34905CS3EK to supply a 3.3V rail for an AFE companion IC and to communicate CAN status to the master BMS. The part's ability to wake from CAN, LIN, timer, or a wake pin supports low-power dormancy during parked months, while the 5.5V to 28V input covers cranking and load-dump transients.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC34905CS3EK — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC34905CS3EK/R2 | MC33905S5EK | MC34905CS3EKR2 | MC33905LAEK | MC34903CS3EK | MC34904CS3EK |
|---|---|---|---|---|---|---|---|
| Package | 32-pin SOIC-EP | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Number of LDOs | 2 | 2 | 2 | 2 | 1 | 2 | 2 |
| LDO Output Voltage | 3.3 V (both rails) | 3.3 V | 3.3 V / 5 V | 3.3 V | 5 V | 3.3 V | 3.3 V |
| LDO Output Current | 400 mA per channel | 400 mA | 400 mA | 400 mA | 400 mA (single LDO) | 400 mA | 400 mA |
| CAN Interface | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | No CAN (LIN only) |
| LIN Interface | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 |
| Input Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| AEC-Q100 Qualification | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
أبرز الفروقات
- Dual 3.3V/400mA LDOs in a single SOIC-32 footprint (مقابلMC33905LAEK)
- Integrated HS-CAN + LIN in one die (مقابلMC34904CS3EK)
- Next-generation diagnostics and tighter LDO tolerance (مقابلMC34905CS3EK vs MC33905S5EK)
ملاحظات التصميم
Solder the exposed pad (pin 33) to a continuous copper island of at least 100mm^2 on the top layer to keep theta_JA within datasheet limits. At VBAT=12V with both LDOs delivering 400mA at 3.3V, internal dissipation is approximately (12V - 3.3V) * 0.8A = 6.96W. Estimated: assuming 100mm^2 1oz copper pour, theta_JA falls to roughly 25 C/W, yielding a junction temperature rise of ~174C above 25C ambient - clearly above the +125C automotive limit, so the SBC must operate in a lower-dissipation node (e.g., 24V systems where the LDO input is pre-regulated) or in sleep mode most of the time.
Route the CANH/CANL pair as a differential microstrip with 120 ohm characteristic impedance and 100 ohm bus termination at each end. Keep CAN traces short and away from switching nodes like the LIN transceiver or the MCU clock. Place a 100nF X7R ceramic decoupling capacitor as close as possible to the VBAT pin and a 10uF bulk cap on each LDO output (VCC1, VCC2).
Do not exceed 28V continuous on VBAT; transient protection (TVS diode such as SMBJ28CA) is recommended for load-dump events above 40V. Ensure the LIN bus master pull-up is provided externally - the MC34905CS3EK's LIN pin includes the slave-side pull-up diode only. A reverse-polarity protection diode (Schottky, e.g., MBRS360) is required at VBAT for automotive compliance. Do not float the EN pin - tie it to VBAT through a 100k resistor for default-on operation.
معلومات الامتثال
AEC-Q100 Grade 1 qualified per NXP/Freescale datasheet. RoHS and lead-free compliant. Halogen-free status to be confirmed against the manufacturer datasheet.
