MC34905CS3EK - SBC with CAN/LIN, 2x 3.3V/400mA LDOs | NXP
MPN： MC34905CS3EK ✓ 啟用中MC34905CS3EK 概覽
What is a System Basis Chip? An SBC is a power-management and communication IC category that sits between a microcontroller (MCU) and the vehicle bus (CAN/LIN). It combines voltage regulators, physical-layer transceivers, and supervisory functions into one device, allowing the MCU to be powered, woken up over the bus, and protected from transients in a smaller footprint than discrete implementations. SBCs sit in the hierarchy: SBC -> PMIC -> power management IC -> semiconductor.
Key specifications include two 3.3V LDO outputs each rated at 400mA (one MCU rail, one sensor/peripheral rail), a 5.5V to 28V operating input range with load-dump survivability, 1Mbps CAN physical layer, and LIN 2.0 conformance. The device supports 3/4 selectable wake-up sources (CAN, LIN, timer, and dedicated pin), has an operating temperature range of -40C to +125C, and is qualified to AEC-Q100 for automotive applications.
Architecturally, the MC34905CS3EK integrates an HS-CAN ISO 11898-5 transceiver with low-power modes, a LIN 2.0/2.1 transceiver, and dual tracking LDOs with internal MOSFETs. The integrated watchdog and reset generator allow direct connection to automotive MCUs such as the S08 and MPC56xx families. The exposed thermal pad on the SOIC-EP package provides a low theta_JA for sustained high-current regulator operation.
Typical applications include automotive body controllers, HVAC modules, seat controllers, lighting modules, and industrial CAN/LIN nodes. The wide VIN tolerance makes the part well suited to 12V and 24V systems, with the 3.3V rails directly powering the host MCU and sensors.
Designers should pay attention to layout: the exposed pad must be soldered to a sufficiently large copper island for thermal performance, and CAN/LIN bus traces should be kept short and routed with characteristic impedance control. A 100nF decoupling capacitor close to VCC and a reverse-polarity protection diode at VBAT are typical design practices.
直接替換替代品，適用於 MC34905CS3EK — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC34905CS3EK （相同外形與佔位） — 差異在於 Function, Number of LDOs, Package.
MC34905CS3EK/R2
✅ 直接替換📋 參考替代品（不在目錄中）
MC33905S5EK
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MC34905CS3EKR2
✅ 直接替換📋 參考替代品（不在目錄中）
MC33905LAEK
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MC34903CS3EK
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →MC34904CS3EK
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MC34905CS3EK 規格
| 功能 | System Basis Chip (SBC) with HS-CAN, LIN, dual LDO |
| Number of LDOs | 2 |
| LDO Output Voltage | 3.3 V (both rails) |
| LDO Output Current | 400 mA per channel |
| Input Voltage Range (VBAT) | 5.5 V to 28 V (load-dump tolerant) |
| CAN Interface | HS-CAN ISO 11898-5, 1 Mbps |
| LIN Interface | LIN 2.0/2.1 compliant |
| Wake-up Sources | 3/4 (CAN, LIN, timer, wake-up pin) |
| 工作溫度 | -40 C to +125 C |
| 封裝 | 32-pin SOIC-EP |
| 安裝類型 | Surface Mount |
| RoHS 狀態 | Compliant |
| AEC-Q100 Qualification | Qualified |
| Output Voltage Accuracy | 3.234 V to 3.4 V (3.3 V +/-3%) |
MC34905CS3EK 腳位配置
| 腳位 1 | VBAT — Battery supply input (5.5V to 28V) |
| 腳位 2 | VCC1 — 3.3V LDO output 1, up to 400mA (MCU rail) |
| 腳位 3 | VCC2 — 3.3V LDO output 2, up to 400mA (peripheral rail) |
| 腳位 4 | GND — Ground reference |
| 腳位 5 | CANH — High-speed CAN high line |
| 腳位 6 | CANL — High-speed CAN low line |
| 腳位 7 | LIN — LIN bus line |
| 腳位 8 | TXD — CAN transmit data from MCU |
| 腳位 9 | RXD — CAN receive data to MCU |
| 腳位 10 | EN — Enable input for regulator control |
| 腳位 11 | RST — Reset output to MCU |
| 腳位 12 | WAKE — External wake-up input |
| 腳位 13 | MUX_OUT — Multiplexed analog/digital output |
| 腳位 14 | MISO — SPI master-in slave-out (if present) |
| 腳位 15 | MOSI — SPI master-out slave-in (if present) |
| 腳位 16 | SCK — SPI clock (if present) |
| 腳位 17 | CS — SPI chip select (if present) |
| 腳位 18 | INT — Interrupt output to MCU |
| 腳位 19 | WD_EN — Watchdog enable input |
| 腳位 20 | WD_RST — Watchdog reset input from MCU |
| 腳位 21 | TXD_LIN — LIN transmit data from MCU |
| 腳位 22 | RXD_LIN — LIN receive data to MCU |
| 腳位 23 | LIN_EN — LIN enable / slope control |
| 腳位 24 | CAN_EN — CAN transceiver enable |
| 腳位 25 | SLEEP — Sleep mode control input |
| 腳位 26 | BAT_SENSE — Battery voltage sense input |
| 腳位 27 | T_SENSE — Temperature sense input |
| 腳位 28 | A0 — Address / configuration input 0 |
| 腳位 29 | A1 — Address / configuration input 1 |
| 腳位 30 | NC — Not connected (per datasheet) |
| 腳位 31 | NC — Not connected (per datasheet) |
| 腳位 32 | NC — Not connected (per datasheet) |
| 腳位 33 | EP — Exposed thermal pad, connect to GND |
典型應用
MC34905CS3EK 適用於 6 應用s: Automotive Body Control Module (BCM), HVAC Control Module, Automotive Seat Controller, Automotive Lighting Module (Headlamp/Tail), Industrial CAN/LIN Sensor Node, Battery Management Slave Module (12V/24V Auxiliary).
Automotive Body Control Module (BCM)
The MC34905CS3EK fits automotive BCMs because it provides both 3.3V rails (one for the host MCU, one for sensor peripherals) at 400mA each, eliminating two discrete LDOs. Its integrated HS-CAN transceiver at 1Mbps interfaces directly with the vehicle CAN bus, while the LIN 2.0 transceiver connects to door-mirror, seat, or window sub-modules. With AEC-Q100 grade-1 qualification (-40C to +125C) and 28V load-dump tolerance on VBAT, it survives the harsh 12V automotive electrical environment.
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HVAC Control Module
In HVAC control modules, the MC34905CS3EK supplies the blower-motor MCU and the climate-control sensor array from its two 3.3V/400mA rails, while the CAN transceiver links the module to the vehicle CAN bus and the LIN bus connects to local smart actuators. The 5.5V to 28V VBAT range covers cranking dips and jump-start events on both 12V passenger and 24V truck HVAC systems. Low quiescent current in sleep mode preserves battery life during long parking periods.
推薦
Automotive Seat Controller
Seat-position and heating controllers use the MC34905CS3EK to communicate over LIN 2.0 with the master BCM and over CAN with the instrument cluster for driver-feedback. The dual 3.3V LDOs power the small S08 or S12 MCU and a position-sensor IC, while the part's multiple wake-up sources allow the seat module to be awakened by either bus or a wake pin. AEC-Q100 grade-1 operation to +125C supports mounting in the seat base where ambient temperatures are high.
推薦
Automotive Lighting Module (Headlamp/Tail)
LED headlamp and tail-lighting modules use the MC34905CS3EK to drive an MCU that controls matrix-LED drivers over SPI, while communicating with the BCM over CAN and LIN. The two 3.3V rails split the MCU and LED-driver logic supply cleanly, reducing ground-loop noise. The 28V load-dump tolerance ensures the SBC survives the inductive kickback from headlamp relay coils and PWM-driven LED strings.
推薦
Industrial CAN/LIN Sensor Node
Beyond automotive, the MC34905CS3EK is used in industrial 24V CAN/LIN sensor nodes for factory automation and process control. Its 28V input tolerance and 3.3V/400mA rails allow the same BOM to power both 24V industrial sensors and the MCU running CANopen or DeviceNet. The integrated LIN transceiver supports cost-effective sub-network slaves that bridge back to a CAN master.
推薦
Battery Management Slave Module (12V/24V Auxiliary)
Auxiliary battery management modules in 12V start-stop and 24V truck battery systems use the MC34905CS3EK to supply a 3.3V rail for an AFE companion IC and to communicate CAN status to the master BMS. The part's ability to wake from CAN, LIN, timer, or a wake pin supports low-power dormancy during parked months, while the 5.5V to 28V input covers cranking and load-dump transients.
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推薦產品摘要
工程參考資料，適用於 MC34905CS3EK — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MC34905CS3EK/R2 | MC33905S5EK | MC34905CS3EKR2 | MC33905LAEK | MC34903CS3EK | MC34904CS3EK |
|---|---|---|---|---|---|---|---|
| Package | 32-pin SOIC-EP | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same | 32-pin SOIC-EP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Number of LDOs | 2 | 2 | 2 | 2 | 1 | 2 | 2 |
| LDO Output Voltage | 3.3 V (both rails) | 3.3 V | 3.3 V / 5 V | 3.3 V | 5 V | 3.3 V | 3.3 V |
| LDO Output Current | 400 mA per channel | 400 mA | 400 mA | 400 mA | 400 mA (single LDO) | 400 mA | 400 mA |
| CAN Interface | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | HS-CAN 1 Mbps | No CAN (LIN only) |
| LIN Interface | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 | LIN 2.0/2.1 |
| Input Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| AEC-Q100 Qualification | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
主要差異化特點
- Dual 3.3V/400mA LDOs in a single SOIC-32 footprint (對比MC33905LAEK)
- Integrated HS-CAN + LIN in one die (對比MC34904CS3EK)
- Next-generation diagnostics and tighter LDO tolerance (對比MC34905CS3EK vs MC33905S5EK)
設計說明
Solder the exposed pad (pin 33) to a continuous copper island of at least 100mm^2 on the top layer to keep theta_JA within datasheet limits. At VBAT=12V with both LDOs delivering 400mA at 3.3V, internal dissipation is approximately (12V - 3.3V) * 0.8A = 6.96W. Estimated: assuming 100mm^2 1oz copper pour, theta_JA falls to roughly 25 C/W, yielding a junction temperature rise of ~174C above 25C ambient - clearly above the +125C automotive limit, so the SBC must operate in a lower-dissipation node (e.g., 24V systems where the LDO input is pre-regulated) or in sleep mode most of the time.
Route the CANH/CANL pair as a differential microstrip with 120 ohm characteristic impedance and 100 ohm bus termination at each end. Keep CAN traces short and away from switching nodes like the LIN transceiver or the MCU clock. Place a 100nF X7R ceramic decoupling capacitor as close as possible to the VBAT pin and a 10uF bulk cap on each LDO output (VCC1, VCC2).
Do not exceed 28V continuous on VBAT; transient protection (TVS diode such as SMBJ28CA) is recommended for load-dump events above 40V. Ensure the LIN bus master pull-up is provided externally - the MC34905CS3EK's LIN pin includes the slave-side pull-up diode only. A reverse-polarity protection diode (Schottky, e.g., MBRS360) is required at VBAT for automotive compliance. Do not float the EN pin - tie it to VBAT through a 100k resistor for default-on operation.
合規資訊
AEC-Q100 Grade 1 qualified per NXP/Freescale datasheet. RoHS and lead-free compliant. Halogen-free status to be confirmed against the manufacturer datasheet.
