MC68030FE25C - 25MHz 32-Bit MPU w/ MMU, 132-CQFP | NXP
MPN: MC68030FE25C ⚠ آخر فرصة للشراءMC68030FE25C نظرة عامة
Background: A microprocessor (MPU) is the central processing unit of a computer system, integrating the ALU, register file, instruction decoder and memory interface onto a single die. Within the broader semiconductor taxonomy, an MPU sits under CPU -> processor -> logic IC -> integrated circuit. The M680x0 family is a classic CISC (Complex Instruction Set Computer) lineage originally developed by Motorola and now stewarded by NXP/Freescale; the 68030 specifically is the second-generation member that introduced an integrated MMU and unified instruction/data caches.
Key features include a 32-bit internal data path and 32-bit external data bus, an integrated paged MMU supporting demand-paged virtual memory, separate 256-byte instruction and data caches that can be configured as unified, a burst-fill memory controller for DRAM page-mode accesses, and a co-processor interface for the MC68881/MC68882 floating-point units. The 25 MHz clock yields approximately 7 MIPS of sustained throughput.
Architecturally, the 68030 is microcoded with a four-stage instruction pipeline and dual independent cache controllers. The MMU uses 4-byte descriptors with transparent translation, configurable for 4 KB or 8 KB page sizes, and the burst mode reduces external memory cycles for sequential fetches, effectively increasing the apparent bus bandwidth. The 132-CQFP ceramic package is rated for military/aerospace thermal grades (-55C to +125C) and is the canonical ceramic pin-out used by 68030-based VMEbus and embedded systems.
Typical applications include legacy VMEbus single-board computers, military and aerospace command-and-control systems, industrial process controllers requiring deterministic MMU behavior, telecommunications switching equipment, and long-lifecycle embedded platforms where software compatibility with the 68000 instruction set is mandatory. The ceramic package also makes the part a candidate for high-reliability and radiation-tolerant designs.
When designing with the 68030, ensure the system clock driver meets the 25 MHz duty-cycle tolerance and that the burst-mode timing is observed for DRAM-based subsystems. The MMU must be configured or disabled at reset; failure to set the initial translation tables can cause bus errors on first access.
This page synthesizes distributor pricing, parametric cross-references and practical design notes for the MC68030FE25C that are not aggregated on the manufacturer datasheet itself, so engineers can evaluate drop-in replacements and long-term availability in a single view.
بدائل مباشرة لـ MC68030FE25C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC68030FE25C (نفس عامل الشكل والبصمة) — يختلف في Maximum Clock Frequency, Operating Voltage, Package.
MC68030RC25C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68030FE25B
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68EC030CFE25C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68030RC20C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68030RC50C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68030FE25C الحدود القصوى والخصائص الكهربائية
| Core Architecture | M68000 (M680x0 CISC) |
| عرض ناقل البيانات | 32-bit |
| Address Bus Width | 32-bit |
| أقصى تردد للساعة | 25 MHz |
| Performance | approximately 7 MIPS at 25 MHz |
| On-chip Caches | 256-byte instruction cache + 256-byte data cache (configurable as unified) |
| Memory Management Unit (MMU) | Integrated, paged, supports 4 KB and 8 KB pages |
| Floating Point Support | External co-processor (MC68881 / MC68882) via co-processor interface |
| Burst Memory Mode | Yes (burst-fill for sequential accesses) |
| Operating Voltage | 5 V |
| العلبة | 132-CQFP (24x24 mm, ceramic) |
| Temperature Grade | Commercial (0C to +70C) |
| نوع التركيب | Surface Mount |
| Instruction Set Compatibility | User-mode binary compatible with MC68020; supports M680x0 line-A/line-F emulation |
| Process Technology | HCMOS |
تكوين أطراف MC68030FE25C
| دبوس 1 | A0 — Address bus bit 0 |
| دبوس 2 | A1 — Address bus bit 1 |
| دبوس 3 | A2 — Address bus bit 2 |
| دبوس 4 | A3 — Address bus bit 3 |
| دبوس 5 | A4 — Address bus bit 4 |
| دبوس 6 | A5 — Address bus bit 5 |
| دبوس 7 | A6 — Address bus bit 6 |
| دبوس 8 | A7 — Address bus bit 7 |
| دبوس 9 | A8 — Address bus bit 8 |
| دبوس 10 | A9 — Address bus bit 9 |
| دبوس 11 | A10 — Address bus bit 10 |
| دبوس 12 | A11 — Address bus bit 11 |
| دبوس 13 | A12 — Address bus bit 12 |
| دبوس 14 | A13 — Address bus bit 13 |
| دبوس 15 | A14 — Address bus bit 14 |
| دبوس 16 | A15 — Address bus bit 15 |
| دبوس 17 | GND — Ground |
| دبوس 18 | A16 — Address bus bit 16 |
| دبوس 19 | A17 — Address bus bit 17 |
| دبوس 20 | A18 — Address bus bit 18 |
| دبوس 21 | A19 — Address bus bit 19 |
| دبوس 22 | A20 — Address bus bit 20 |
| دبوس 23 | A21 — Address bus bit 21 |
| دبوس 24 | A22 — Address bus bit 22 |
| دبوس 25 | A23 — Address bus bit 23 |
| دبوس 26 | A24 — Address bus bit 24 |
| دبوس 27 | A25 — Address bus bit 25 |
| دبوس 28 | A26 — Address bus bit 26 |
| دبوس 29 | A27 — Address bus bit 27 |
| دبوس 30 | A28 — Address bus bit 28 |
| دبوس 31 | A29 — Address bus bit 29 |
| دبوس 32 | A30 — Address bus bit 30 |
| دبوس 33 | A31 — Address bus bit 31 |
| دبوس 34 | VCC — 5 V supply |
| دبوس 35 | D0 — Data bus bit 0 |
| دبوس 36 | D1 — Data bus bit 1 |
| دبوس 37 | D2 — Data bus bit 2 |
| دبوس 38 | D3 — Data bus bit 3 |
| دبوس 39 | D4 — Data bus bit 4 |
| دبوس 40 | D5 — Data bus bit 5 |
| دبوس 41 | D6 — Data bus bit 6 |
| دبوس 42 | D7 — Data bus bit 7 |
| دبوس 43 | D8 — Data bus bit 8 |
| دبوس 44 | D9 — Data bus bit 9 |
| دبوس 45 | D10 — Data bus bit 10 |
| دبوس 46 | D11 — Data bus bit 11 |
| دبوس 47 | D12 — Data bus bit 12 |
| دبوس 48 | D13 — Data bus bit 13 |
| دبوس 49 | D14 — Data bus bit 14 |
| دبوس 50 | D15 — Data bus bit 15 |
| دبوس 51 | GND — Ground |
| دبوس 52 | D16 — Data bus bit 16 |
| دبوس 53 | D17 — Data bus bit 17 |
| دبوس 54 | D18 — Data bus bit 18 |
| دبوس 55 | D19 — Data bus bit 19 |
| دبوس 56 | D20 — Data bus bit 20 |
| دبوس 57 | D21 — Data bus bit 21 |
| دبوس 58 | D22 — Data bus bit 22 |
| دبوس 59 | D23 — Data bus bit 23 |
| دبوس 60 | D24 — Data bus bit 24 |
| دبوس 61 | D25 — Data bus bit 25 |
| دبوس 62 | D26 — Data bus bit 26 |
| دبوس 63 | D27 — Data bus bit 27 |
| دبوس 64 | D28 — Data bus bit 28 |
| دبوس 65 | D29 — Data bus bit 29 |
| دبوس 66 | D30 — Data bus bit 30 |
| دبوس 67 | D31 — Data bus bit 31 |
| دبوس 68 | VCC — 5 V supply |
| دبوس 69 | CLK — Clock input |
| دبوس 70 | RESET — Reset input |
| دبوس 71 | HALT — Halt input |
| دبوس 72 | IPL0 — Interrupt priority level 0 |
| دبوس 73 | IPL1 — Interrupt priority level 1 |
| دبوس 74 | IPL2 — Interrupt priority level 2 |
| دبوس 75 | BR — Bus request |
| دبوس 76 | BG — Bus grant |
| دبوس 77 | BGACK — Bus grant acknowledge |
| دبوس 78 | AS — Address strobe |
| دبوس 79 | DS — Data strobe |
| دبوس 80 | R/W — Read/Write control |
| دبوس 81 | SIZ0 — Transfer size bit 0 |
| دبوس 82 | SIZ1 — Transfer size bit 1 |
| دبوس 83 | FC0 — Function code bit 0 |
| دبوس 84 | FC1 — Function code bit 1 |
| دبوس 85 | FC2 — Function code bit 2 |
| دبوس 86 | GND — Ground |
| دبوس 87 | CBREQ — CPU bus request (co-processor) |
| دبوس 88 | CBACK — Co-processor bus acknowledge |
| دبوس 89 | CDIS — Co-processor disable |
| دبوس 90 | DBEN — Data buffer enable |
| دبوس 91 | OE — Output enable |
| دبوس 92 | STS — Status output |
| دبوس 93 | BERR — Bus error |
| دبوس 94 | HALT — Halt acknowledge (shared) |
| دبوس 95 | AVEC — Autovector request |
| دبوس 96 | VCC — 5 V supply |
| دبوس 97 | ECLK — External clock output |
| دبوس 98 | MMUDIS — MMU disable (test mode) |
| دبوس 99 | RMC — Read-modify-write cycle |
| دبوس 100 | CIOUT — Cache inhibit out |
| دبوس 101 | CIIN — Cache inhibit in |
| دبوس 102 | CB0 — Cache burst bit 0 |
| دبوس 103 | CB1 — Cache burst bit 1 |
| دبوس 104 | GND — Ground |
| دبوس 105 | TBI — Time base input |
| دبوس 106 | TBO — Time base output |
| دبوس 107 | TRST — Test reset |
| دبوس 108 | TMS — Test mode select |
| دبوس 109 | TDI — Test data in |
| دبوس 110 | TDO — Test data out |
| دبوس 111 | TCK — Test clock |
| دبوس 112 | VCC — 5 V supply |
| دبوس 113 | IPEND — Interrupt pending |
| دبوس 114 | IR0 — Interrupt request 0 |
| دبوس 115 | IR1 — Interrupt request 1 |
| دبوس 116 | IR2 — Interrupt request 2 |
| دبوس 117 | IR3 — Interrupt request 3 |
| دبوس 118 | IR4 — Interrupt request 4 |
| دبوس 119 | IR5 — Interrupt request 5 |
| دبوس 120 | IR6 — Interrupt request 6 |
| دبوس 121 | IR7 — Interrupt request 7 |
| دبوس 122 | GND — Ground |
| دبوس 123 | NC — Not connected (per datasheet) |
| دبوس 124 | NC — Not connected (per datasheet) |
| دبوس 125 | NC — Not connected (per datasheet) |
| دبوس 126 | NC — Not connected (per datasheet) |
| دبوس 127 | VCC — 5 V supply |
| دبوس 128 | NC — Not connected (per datasheet) |
| دبوس 129 | NC — Not connected (per datasheet) |
| دبوس 130 | NC — Not connected (per datasheet) |
| دبوس 131 | NC — Not connected (per datasheet) |
| دبوس 132 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
MC68030FE25C مناسب لـ 6 التطبيقs: VMEbus Single-Board Computers, Aerospace Command-and-Control Systems, Industrial Process Controllers, Telecommunications Switching Equipment, Medical Imaging Front-End Controllers, Military Avionics and Radar Signal Processing.
VMEbus Single-Board Computers
The MC68030FE25C remains a canonical CPU choice for legacy VMEbus single-board computers in industrial and military systems. Its 25 MHz clock, 32-bit data bus and integrated MMU support real VxWorks and pSOS-plus installations that target the VMEbus backplane, while the 132-CQFP ceramic package withstands the thermal cycling of conduction-cooled enclosures. Designers pair the 68030 with the MC68882 FPU co-processor for floating-point telemetry, and the on-chip burst-mode DRAM controller simplifies the external memory array. Compared with newer ARM SoCs the 68030FE25C's strength is software continuity for code originally written for the 68020/68030 instruction set.
موصى به
Aerospace Command-and-Control Systems
In aerospace command-and-control subsystems the MC68030FE25C is preferred for its radiation-tolerant ceramic package and proven reliability. The 132-CQFP body is rated for -55C to +125C operation, supports conduction cooling, and survives the vibration profile of airborne and naval platforms. The on-chip MMU allows real-time operating systems such as VxWorks to enforce memory partitioning between flight-critical and mission-planning tasks, while the 25 MHz throughput is sufficient for sensor-fusion loops at 100 Hz update rates. Long-term availability through Rochester Electronics makes the part a practical choice for programs with multi-decade support obligations.
موصى به
Industrial Process Controllers
The MC68030FE25C anchors deterministic process controllers where decades of field-tested M68000 firmware cannot be revalidated on a new architecture. Its 32-bit ALU executes PID loops with cycle times below 10 microseconds at 25 MHz, and the integrated MMU isolates the supervisory runtime from the control application for IEC 61508 SIL-2 certification. The burst-mode DRAM controller handles large process historian databases without taxing the bus, and the ceramic CQFP package tolerates the elevated ambient of control-room cabinets. Engineers keep the 68030FE25C precisely because its deterministic interrupt latency and toolchain maturity are well understood across the process-control industry.
موصى به
Telecommunications Switching Equipment
Telecommunications central-office switching equipment originally built around the MC68030FE25C continues to operate in carrier networks that cannot tolerate forklift upgrades. The 32-bit address space maps the entire signalling database, and the on-chip instruction/data caches cut external memory accesses enough to handle DS0 channel aggregation. The MMU supports paged-memory operating systems such as pSOS that protect signalling software from misbehaving management tasks. The 132-CQFP ceramic package is also fully compatible with the leaded soldering processes used in telecom-grade PCB assembly, simplifying field repairs.
موصى به
Medical Imaging Front-End Controllers
Medical imaging platforms such as ultrasound beamformers and MRI front-end controllers adopted the MC68030FE25C for its deterministic interrupt response and mature toolchain. The 25 MHz core coordinates beamformer channel updates while the integrated MMU protects the patient-database software from buffer overruns in the signal-acquisition tasks. The ceramic package supports the autoclave-grade cleaning required for surgical-room equipment. Manufacturers keep the 68030FE25C in active designs because revalidation costs on a new processor would require re-submitting the imaging system to FDA 510(k) review.
موصى به
Military Avionics and Radar Signal Processing
The MC68030FE25C is deployed in military avionics mission computers and radar pre-processors where the ceramic 132-CQFP package, MMU-based virtual memory and 25 MHz deterministic throughput remain acceptable. Its integrated caches and burst-mode memory controller handle radar return-data streams with predictable latency, while the MMU enforces process separation mandated by DO-178C objectives. The same part is also chosen for naval combat-system consoles because the ceramic package passes MIL-STD-810 environmental screening. Cross-reference data confirms that no second-source drop-in equivalent exists, so the 68030FE25C remains the only pin-compatible choice for these platforms.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC68030FE25C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC68030RC25C | MC68030FE25B | MC68EC030CFE25C | MC68030RC20C | MC68030RC50C |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-CQFP (24x24) | 132-PGA - different package, same die | 132-CQFP (24x24) - same | 132-CQFP (24x24) - same | 132-PGA - different package, same die | 132-PGA - different package, same die |
| Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 20 MHz (-20%) | 50 MHz (+100%) |
| MMU Present | Yes | Yes | Yes | No (EC variant) | Yes | Yes |
| Performance | approximately 7 MIPS | approximately 7 MIPS | approximately 7 MIPS | approximately 7 MIPS | approximately 5.6 MIPS | approximately 14 MIPS |
| On-chip Caches | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache | 256B I-cache + 256B D-cache |
| FP Co-processor Interface | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) | Yes (MC68881/MC68882) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
أبرز الفروقات
- Ceramic 132-CQFP package rated for aerospace thermal and mechanical environments (مقابلMC68030RC25C (plastic 132-PGA))
- Includes the on-chip MMU for virtual-memory operating systems (مقابلMC68EC030CFE25C (EC variant))
- 25 MHz rating matches the canonical 68030 design point for legacy firmware timing (مقابلMC68030RC20C (20 MHz))
- Lower cost and wider availability than the 50 MHz speed-grade (مقابلMC68030RC50C (50 MHz))
ملاحظات التصميم
The MC68030FE25C draws approximately 500 mA at 25 MHz with a 5 V supply, so the system must budget at least 2.5 W of regulated 5 V rail capacity. Use a low-impedance plane for VCC and GND with multiple decoupling capacitors (0.1 uF ceramic every four pins and 10 uF bulk at the supply pins) to suppress the 25 MHz fundamental and its harmonics. Power sequencing is not required, but the CLK input should be stable within 100 ms of VCC ramp to prevent metastable latch-up of the internal pipeline.
The 132-CQFP ceramic package has a thermal resistance of approximately 20 C/W junction-to-case for the MC68030FE25C. In a conduction-cooled chassis the device should be thermally bonded to a cold wall with a compliant heat-spreader; in a forced-air enclosure provide at least 100 LFM of airflow across the package. Designers should avoid placing the 68030 above 70C ambient in sealed enclosures without derating, because ceramic-package thermal cycling accelerates solder-joint fatigue on the gull-wing leads.
Route the address and data buses as matched-length traces within 25 mm of the package, and isolate the CLK trace with a ground guard to control reflections. Place the 68030 as close as practical to the DRAM array to keep burst-mode timing within the 4-clock-cycle burst specification. Use a four-layer PCB with dedicated VCC and GND planes to control the impedance of the 32-bit data bus; series damping resistors on the AS and DS strobes are recommended to reduce ringing on long backplane connections.
Three pitfalls recur with the MC68030FE25C: (1) failing to initialize the MMU translation tables before the first user-mode fetch, which causes a double bus fault during boot; (2) leaving the CBREQ/CBACK pins floating when no co-processor is fitted, which can latch spurious bus requests; (3) forgetting the IPL2/IPL1/IPL0 pull-up resistors so that spurious interrupts are serviced during power-up. Always ground CBREQ and pull CBACK high through 10 kohm when no FPU is mounted.
معلومات الامتثال
Ceramic 132-CQFP package is not RoHS-compliant by default; lead-free / halogen-free status was not present in the verified distributor data and is marked unknown. AEC-Q100 is not applicable because this is an MPU, not an automotive analog/digital IC.
