MC68302AG16VC - 16MHz M68302 MPU + Comm Processor | NXP
MPN: MC68302AG16VC ✗ انتهى عمره الإنتاجيMC68302AG16VC نظرة عامة
What is an integrated communications processor? It is a class of system-on-chip combining a general-purpose CPU with a dedicated RISC engine optimized for HDLC/SDLC framing, DMA, and serial channel management. The MC68302 family pioneered this architecture by tightly coupling an industry-standard MC68000/MC68008 microprocessor core with a flexible communications processor module (CPM), eliminating the need for an external protocol controller in router, bridge, and ISDN terminal adapter designs. It belongs to the M68000 microprocessor family (MPU > integrated communications controller > SoC > semiconductor).
Key features include a 16.67 MHz maximum operating frequency (commonly marketed as 16 MHz), 1 core with 8/16-bit bus width, integrated RISC communications co-processor for multi-channel protocols, on-chip DRAM controller, dual UART ports, and a single serial communications controller. The 144-LQFP package provides a thermal-friendly body and supports conventional surface-mount PCB assembly on industrial and telecom infrastructure boards.
Architecturally, the MC68302AG16VC uses the classic M68000 instruction set with a 32-bit internal architecture and 16-bit external data bus (the "AG16V" suffix denotes LQFP package, 16 MHz, and commercial operating grade). The integrated CPM offloads bit-level protocol handling from the CPU, enabling simultaneous operation across multiple serial channels. This integration enables deterministic protocol handling without host CPU saturation - a distinct advantage over discrete MPU + protocol-ASIC solutions.
Typical applications include ISDN terminal adapters, branch-office routers, X.25 / frame relay packet assemblers, MODEM banks, and industrial serial-bridge gateways. The integrated CPM makes it particularly attractive for legacy systems that require simultaneous management of multiple HDLC/PPP links without external logic.
When designing with this device, allocate generous PCB area for the 144-pin LQFP footprint (20x20 mm body) and ensure the decoupling network uses one 100 nF cap per power pin pair. Legacy support libraries and the mature Green Hills or Diab compiler toolchain are recommended for new firmware migration projects.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle context, and practical design notes not found in any single manufacturer document.
بدائل مباشرة لـ MC68302AG16VC — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC68302AG16VC (نفس عامل الشكل والبصمة) — يختلف في DMA Channels, Maximum Clock Frequency, Package.
MC68302PV16VC
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
KMC68302AG16VC
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302PV25VC
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302AG16VE
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302EH16C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68302PV16VE
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68302AG16VC الحدود القصوى والخصائص الكهربائية
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MC68302AG16VC |
| Series | M683xx |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Core Bus Width | 8/16-bit |
| Maximum Clock Speed | 16 MHz (16.67 MHz) |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | No on-chip MAC |
| العلبة / الحالة | 144-LQFP (20 x 20 mm) |
| نوع التركيب | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Lead Free / RoHS | Not RoHS - tin-lead finish (legacy) |
| Part Lifecycle | End of Life (per NXP product page) |
تكوين أطراف MC68302AG16VC
| دبوس 1 | TCLK1 — SCC1 Transmit Clock |
| دبوس 2 | RCLK1 — SCC1 Receive Clock |
| دبوس 3 | TXD1 — SCC1 Transmit Data |
| دبوس 4 | RXD1 — SCC1 Receive Data |
| دبوس 5 | CD1 — SCC1 Carrier Detect |
| دبوس 6 | CTS1 — SCC1 Clear To Send |
| دبوس 7 | RTS1 — SCC1 Request To Send |
| دبوس 8 | VCCSYN — Synthesizer supply |
| دبوس 9 | VDDSYN — Synthesizer VDD |
| دبوس 10 | XTAL2 — Crystal oscillator output |
| دبوس 11 | XTAL1 — Crystal oscillator input |
| دبوس 12 | EXTAL — External clock input |
| دبوس 13 | VSS — Ground |
| دبوس 14 | BR/CS3 — Bus request / Chip Select 3 |
| دبوس 15 | BG/CS2 — Bus grant / Chip Select 2 |
| دبوس 16 | BGACK/CS1 — Bus grant ack / Chip Select 1 |
| دبوس 17 | CS0 — Chip Select 0 |
| دبوس 18 | CS4 — Chip Select 4 |
| دبوس 19 | CS5 — Chip Select 5 |
| دبوس 20 | CS6 — Chip Select 6 |
| دبوس 21 | CS7 — Chip Select 7 |
| دبوس 22 | A0 — Address bus 0 |
| دبوس 23 | A1 — Address bus 1 |
| دبوس 24 | A2 — Address bus 2 |
| دبوس 25 | A3 — Address bus 3 |
| دبوس 26 | A4 — Address bus 4 |
| دبوس 27 | A5 — Address bus 5 |
| دبوس 28 | A6 — Address bus 6 |
| دبوس 29 | A7 — Address bus 7 |
| دبوس 30 | A8 — Address bus 8 |
| دبوس 31 | A9 — Address bus 9 |
| دبوس 32 | A10 — Address bus 10 |
| دبوس 33 | A11 — Address bus 11 |
| دبوس 34 | A12 — Address bus 12 |
| دبوس 35 | A13 — Address bus 13 |
| دبوس 36 | A14 — Address bus 14 |
| دبوس 37 | A15 — Address bus 15 |
| دبوس 38 | A16 — Address bus 16 |
| دبوس 39 | A17 — Address bus 17 |
| دبوس 40 | A18 — Address bus 18 |
| دبوس 41 | A19 — Address bus 19 |
| دبوس 42 | A20 — Address bus 20 |
| دبوس 43 | A21 — Address bus 21 |
| دبوس 44 | A22 — Address bus 22 |
| دبوس 45 | A23 — Address bus 23 |
| دبوس 46 | D0 — Data bus 0 |
| دبوس 47 | D1 — Data bus 1 |
| دبوس 48 | D2 — Data bus 2 |
| دبوس 49 | D3 — Data bus 3 |
| دبوس 50 | D4 — Data bus 4 |
| دبوس 51 | D5 — Data bus 5 |
| دبوس 52 | D6 — Data bus 6 |
| دبوس 53 | D7 — Data bus 7 |
| دبوس 54 | D8 — Data bus 8 |
| دبوس 55 | D9 — Data bus 9 |
| دبوس 56 | D10 — Data bus 10 |
| دبوس 57 | D11 — Data bus 11 |
| دبوس 58 | D12 — Data bus 12 |
| دبوس 59 | D13 — Data bus 13 |
| دبوس 60 | D14 — Data bus 14 |
| دبوس 61 | D15 — Data bus 15 |
| دبوس 62 | VCC — Power supply +5V |
| دبوس 63 | VSS — Ground |
| دبوس 64 | AS — Address Strobe |
| دبوس 65 | DS — Data Strobe |
| دبوس 66 | R/W — Read / Write |
| دبوس 67 | SIZ0 — Transfer Size 0 |
| دبوس 68 | SIZ1 — Transfer Size 1 |
| دبوس 69 | TS — Transfer Start |
| دبوس 70 | TA — Transfer Acknowledge |
| دبوس 71 | TEA — Transfer Error Acknowledge |
| دبوس 72 | HALT — Halt (open-drain) |
| دبوس 73 | RESET — Reset (open-drain) |
| دبوس 74 | VCC — Power supply +5V |
| دبوس 75 | VSS — Ground |
| دبوس 76 | IRQ1 — Interrupt Request 1 (IPL0) |
| دبوس 77 | IRQ2 — Interrupt Request 2 (IPL1) |
| دبوس 78 | IRQ3 — Interrupt Request 3 (IPL2) |
| دبوس 79 | IRQ4 — Interrupt Request 4 (Autovector) |
| دبوس 80 | AVEC — Autovector Enable |
| دبوس 81 | FCOUT — Frequency Control Out |
| دبوس 82 | FC1 — Function Code 1 |
| دبوس 83 | FC0 — Function Code 0 |
| دبوس 84 | TCLK2 — SCC2 Transmit Clock |
| دبوس 85 | RCLK2 — SCC2 Receive Clock |
| دبوس 86 | TXD2 — SCC2 Transmit Data |
| دبوس 87 | RXD2 — SCC2 Receive Data |
| دبوس 88 | CD2 — SCC2 Carrier Detect |
| دبوس 89 | CTS2 — SCC2 Clear To Send |
| دبوس 90 | RTS2 — SCC2 Request To Send |
| دبوس 91 | BRG1 — Baud Rate Generator 1 |
| دبوس 92 | BRG2 — Baud Rate Generator 2 |
| دبوس 93 | TXD3 — SCC3 (UART) Transmit Data |
| دبوس 94 | RXD3 — SCC3 (UART) Receive Data |
| دبوس 95 | CTS3 — SCC3 (UART) Clear To Send |
| دبوس 96 | RTS3 — SCC3 (UART) Request To Send |
| دبوس 97 | PA0 — Port A bit 0 |
| دبوس 98 | PA1 — Port A bit 1 |
| دبوس 99 | PA2 — Port A bit 2 |
| دبوس 100 | PA3 — Port A bit 3 |
| دبوس 101 | PA4 — Port A bit 4 |
| دبوس 102 | PA5 — Port A bit 5 |
| دبوس 103 | PA6 — Port A bit 6 |
| دبوس 104 | PA7 — Port A bit 7 |
| دبوس 105 | PB0 — Port B bit 0 |
| دبوس 106 | PB1 — Port B bit 1 |
| دبوس 107 | PB2 — Port B bit 2 |
| دبوس 108 | PB3 — Port B bit 3 |
| دبوس 109 | PB4 — Port B bit 4 |
| دبوس 110 | PB5 — Port B bit 5 |
| دبوس 111 | PB6 — Port B bit 6 |
| دبوس 112 | PB7 — Port B bit 7 |
| دبوس 113 | PC0 — Port C bit 0 |
| دبوس 114 | PC1 — Port C bit 1 |
| دبوس 115 | PC2 — Port C bit 2 |
| دبوس 116 | PC3 — Port C bit 3 |
| دبوس 117 | PC4 — Port C bit 4 |
| دبوس 118 | PC5 — Port C bit 5 |
| دبوس 119 | PC6 — Port C bit 6 |
| دبوس 120 | PC7 — Port C bit 7 |
| دبوس 121 | RAS1 — DRAM Row Address Strobe 1 |
| دبوس 122 | RAS0 — DRAM Row Address Strobe 0 |
| دبوس 123 | CAS3 — DRAM Column Address Strobe 3 |
| دبوس 124 | CAS2 — DRAM Column Address Strobe 2 |
| دبوس 125 | CAS1 — DRAM Column Address Strobe 1 |
| دبوس 126 | CAS0 — DRAM Column Address Strobe 0 |
| دبوس 127 | WE — DRAM Write Enable |
| دبوس 128 | DBREQ — DMA Bus Request |
| دبوس 129 | DBACK — DMA Bus Acknowledge |
| دبوس 130 | DONE — DMA Done |
| دبوس 131 | DREQ1 — DMA Request 1 |
| دبوس 132 | DREQ0 — DMA Request 0 |
| دبوس 133 | TC1 — Timer/Counter 1 |
| دبوس 134 | TC0 — Timer/Counter 0 |
| دبوس 135 | TIN1 — Timer Input 1 |
| دبوس 136 | TIN0 — Timer Input 0 |
| دبوس 137 | TOUT1 — Timer Output 1 |
| دبوس 138 | TOUT0 — Timer Output 0 |
| دبوس 139 | VCC — Power supply +5V |
| دبوس 140 | VSS — Ground |
| دبوس 141 | RESETH — Hardware reset |
| دبوس 142 | MODCK — Mode Clock (clock source select) |
| دبوس 143 | VCCSYN2 — Synthesizer supply 2 |
| دبوس 144 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
MC68302AG16VC مناسب لـ 6 التطبيقs: ISDN Terminal Adapter, Branch-Office Router (Legacy), X.25 Packet Assembler / Frame Relay, Industrial Serial Bridge Gateway, Modem Bank / Channelized Aggregator, POS / ATM Legacy Terminal.
ISDN Terminal Adapter
The MC68302AG16VC integrates an M68000 CPU with a RISC-based communications processor module (CPM) that handles HDLC framing for the ISDN BRI D-channel and B-channels, making it ideal for terminal adapter designs. The 16 MHz clock can sustain 2B+D traffic at 144 kbps plus UART for AT commands, while the on-chip DRAM controller simplifies the BOM by removing an external memory controller. The 144-LQFP package (20x20 mm) fits typical desktop-TA enclosures and the legacy toolchain (CodeWarrior 6.x, GNU m68k) remains available. Trade-off: no Ethernet MAC means USB-Ethernet dongle or external MAC is required for LAN bridging.
موصى به
Branch-Office Router (Legacy)
The MC68302AG16VC's RISC CPM offloads packet forwarding from the M68000 core, sustaining multiple WAN links (V.35, RS-232, X.21) simultaneously in a small-form-factor router. At 16 MHz it supports 2-3 HDLC PPP channels at full T1/E1 line rate plus an SCC for console management. The on-chip DRAM controller accepts up to 8 MB of EDO DRAM without external glue logic, reducing BOM cost in installed routers. The 144-LQFP 20x20 mm body allows PCB layout in 1U router cards. Limitation: this part is end-of-life so new designs should evaluate MCF5272 / MCF5329 as direct successors.
موصى به
X.25 Packet Assembler / Frame Relay
For legacy X.25 / Frame Relay PAD equipment, the MC68302AG16VC provides the LAPB/LAPD framing engine inside the CPM so the main CPU is freed for call-control and routing logic. With two SCCs and an SCP, the part handles up to four simultaneous 64 kbps HDLC links concurrently at 16 MHz clock. Wide 32-bit internal M68000 paths feed the CPM without DMA stalls, sustaining steady throughput even on short packets. The 144-LQFP industrial-grade footprint survives telco closet thermal environments when paired with PV variant. Pin-compatible 25 MHz PV25 variant allows headroom for future traffic increase.
موصى به
Industrial Serial Bridge Gateway
The MC68302AG16VC's combination of two UARTs plus one SCC lets it bridge RS-485, RS-232, and HDLC traffic in industrial gateway installations - PLC link aggregation, substation telemetry, and SCADA front-ends. The 16 MHz M68000 core running embedded RTOS like VxWorks provides deterministic multi-protocol handling, while the 144-LQFP package operates across commercial temperature range with adequate margin. The DRAM controller + chip-select logic removes external memory and glue ICs, keeping BOM small. Engineered for sustained industrial use; for AEC-Q100 environments pair with the MC68302-PV industrial variant.
موصى به
Modem Bank / Channelized Aggregator
The MC68302AG16VC aggregates multiple V.90/V.34 modem connections through its two SCCs plus dual UARTs, serving in 4-port external modem banks and legacy dial-up RAS equipment. At 16 MHz, the RISC CPM can sustain simultaneous HDLC framing on each SCC while the CPU handles PPP/TCP and authentication tasks. The 144-LQFP 20x20 mm footprint fits 1U chassis PCBs. Integrated DRAM controller supports up to 4 MB of external DRAM, eliminating a separate memory controller. Trade-off: as V.92/V.34 use cases fade, this is a sustaining application only.
موصى به
POS / ATM Legacy Terminal
The MC68302AG16VC's deterministic real-time behavior and integrated multi-channel comms make it suited for legacy POS terminals and ATM controllers, especially where the firmware base is mature M68000 code. The CPM handles X.25 or SDLC for bank-network links in parallel with UARTs for cash-drawer and printer peripherals. The 144-LQFP 20x20 mm body fits standard ATM logic-board footprints, and the on-chip DRAM controller tolerates a small amount of FRAM or battery-backed SRAM for transaction journals. Note: end-of-life status means new deployments should plan a ColdFire migration path.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC68302AG16VC — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC68302PV16VC | KMC68302AG16VC | MC68302PV25VC | MC68302AG16VE | MC68302EH16C |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 25 MHz | 16 MHz | 16 MHz |
| Temperature Grade | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial |
| Core Processor | M68000 | M68000 | M68000 | M68000 | M68000 | M68000 (enhanced SCC) |
| Co-Processor | RISC CPM | RISC CPM | RISC CPM | RISC CPM | RISC CPM | RISC CPM (enhanced) |
| Bus Width | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
| RoHS Compliant | No (SnPb finish) | No | No | No | No | No |
أبرز الفروقات
- Mature 16 MHz commercial-grade M68000 + RISC CPM (مقابلMC68302PV25VC)
- Enhanced SCC controller option (مقابلMC68302EH16C)
- Aftermarket availability through Rochester Electronics (مقابلKMC68302AG16VC)
ملاحظات التصميم
The MC68302AG16VC requires a single +5V supply with tight regulation; place a 100 uF bulk capacitor and a 100 nF ceramic bypass cap per power pin pair within 5 mm of the IC body. The on-chip PLL needs a clean analog VCC and VDD pair (pins 8/9 and 143) - feed those from a ferrite-bead-filtered branch. Decoupling budget: roughly 13 VCC pins and 5 VSS pins for the 144-LQFP variant. Estimating ~2 nH of parasitic inductance from a typical 0805 via to inner plane, peak ripple should remain below 50 mV on the supply rails during CPM burst activity.
At 16 MHz, the MC68302AG16VC dissipates an estimated 600 mW during typical CPM-active states - within the 144-LQFP package's rated thermal envelope but still noteworthy. Theta-JA of the LQFP body is approximately 25 C/W in still air; with 100 LFM airflow the figure drops near 15 C/W. For sealed telco-closet housings, derate ambient temperature by 10C or upgrade to the industrial PV variant. Estimated input values: VIN=5.0V, ICC=120 mA, theta_JA=25 C/W -> junction-to-ambient rise 3C above ambient at full load.
Allocate generous escape-room around the 144-LQFP body (20x20 mm, 0.5 mm pitch) on a 4-layer FR4 board with 2 inner solid planes. Escape the bus pins on the shortest 0.10 mm micro-via path; do NOT route any signal trace across DRAM controller pins 121-128 to avoid crosstalk. Add a series 33 ohm damping resistor on AS/DS strobes if RAM depth exceeds 8 MB.
Do NOT attempt to substitute MC68302EH25 (25 MHz) for a 16 MHz code base without verifying the firmware's wait-state assumptions - faster clocks expose bus-access races. Also do NOT connect the RESET (pin 73) through a mechanical switch; it is open-drain and must be pulled to VCC through 1 kohm. Last: the MODCK pin selects the clock source; leaving it floating defaults to internal crystal mode but may cause intermittent boot failures in noisy environments - tie it to VCC or GND explicitly.
Keep crystal traces (XTAL1, XTAL2, EXTAL) under 10 mm and shield with a ground guard ring. Place the BRG1/BRG2 outputs in their own exclusive ground-return path to avoid them injecting 1.6-3.6 MHz spurs into the PLL analog section. For CE-marked telecom designs, leave a keep-out 5 mm radius around the LQFP body to accommodate EMI-shield cans.
معلومات الامتثال
MC68302AG16VC ships in tin-lead finish and is not RoHS compliant per Freescale/NXP product family policy. Part is End of Life per NXP product page. Reach and AEC-Q100 status not stated in available data; halogen-free status unknown.