MC68302AG16VC - 16MHz M68302 MPU + Comm Processor | NXP
MPN: MC68302AG16VC ✗ סוף ייצורMC68302AG16VC סקירה
What is an integrated communications processor? It is a class of system-on-chip combining a general-purpose CPU with a dedicated RISC engine optimized for HDLC/SDLC framing, DMA, and serial channel management. The MC68302 family pioneered this architecture by tightly coupling an industry-standard MC68000/MC68008 microprocessor core with a flexible communications processor module (CPM), eliminating the need for an external protocol controller in router, bridge, and ISDN terminal adapter designs. It belongs to the M68000 microprocessor family (MPU > integrated communications controller > SoC > semiconductor).
Key features include a 16.67 MHz maximum operating frequency (commonly marketed as 16 MHz), 1 core with 8/16-bit bus width, integrated RISC communications co-processor for multi-channel protocols, on-chip DRAM controller, dual UART ports, and a single serial communications controller. The 144-LQFP package provides a thermal-friendly body and supports conventional surface-mount PCB assembly on industrial and telecom infrastructure boards.
Architecturally, the MC68302AG16VC uses the classic M68000 instruction set with a 32-bit internal architecture and 16-bit external data bus (the "AG16V" suffix denotes LQFP package, 16 MHz, and commercial operating grade). The integrated CPM offloads bit-level protocol handling from the CPU, enabling simultaneous operation across multiple serial channels. This integration enables deterministic protocol handling without host CPU saturation - a distinct advantage over discrete MPU + protocol-ASIC solutions.
Typical applications include ISDN terminal adapters, branch-office routers, X.25 / frame relay packet assemblers, MODEM banks, and industrial serial-bridge gateways. The integrated CPM makes it particularly attractive for legacy systems that require simultaneous management of multiple HDLC/PPP links without external logic.
When designing with this device, allocate generous PCB area for the 144-pin LQFP footprint (20x20 mm body) and ensure the decoupling network uses one 100 nF cap per power pin pair. Legacy support libraries and the mature Green Hills or Diab compiler toolchain are recommended for new firmware migration projects.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle context, and practical design notes not found in any single manufacturer document.
חלופות תחליף ישיר עבור MC68302AG16VC — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MC68302AG16VC (אותו גורם צורה וטביעת רגל) — שונים ב DMA Channels, Maximum Clock Frequency, Package.
MC68302PV16VC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
KMC68302AG16VC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68302PV25VC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68302AG16VE
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68302EH16C
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MC68302PV16VE
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MC68302AG16VC דירוגים מרביים ומאפיינים חשמליים
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MC68302AG16VC |
| Series | M683xx |
| Core Processor | M68000 |
| Number of Cores | 1 |
| Core Bus Width | 8/16-bit |
| Maximum Clock Speed | 16 MHz (16.67 MHz) |
| Co-Processors / DSP | Communications; RISC CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| Ethernet | No on-chip MAC |
| מארז / Case | 144-LQFP (20 x 20 mm) |
| סוג הרכבה | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Lead Free / RoHS | Not RoHS - tin-lead finish (legacy) |
| Part Lifecycle | End of Life (per NXP product page) |
תצורת פינים של MC68302AG16VC
| פין 1 | TCLK1 — SCC1 Transmit Clock |
| פין 2 | RCLK1 — SCC1 Receive Clock |
| פין 3 | TXD1 — SCC1 Transmit Data |
| פין 4 | RXD1 — SCC1 Receive Data |
| פין 5 | CD1 — SCC1 Carrier Detect |
| פין 6 | CTS1 — SCC1 Clear To Send |
| פין 7 | RTS1 — SCC1 Request To Send |
| פין 8 | VCCSYN — Synthesizer supply |
| פין 9 | VDDSYN — Synthesizer VDD |
| פין 10 | XTAL2 — Crystal oscillator output |
| פין 11 | XTAL1 — Crystal oscillator input |
| פין 12 | EXTAL — External clock input |
| פין 13 | VSS — Ground |
| פין 14 | BR/CS3 — Bus request / Chip Select 3 |
| פין 15 | BG/CS2 — Bus grant / Chip Select 2 |
| פין 16 | BGACK/CS1 — Bus grant ack / Chip Select 1 |
| פין 17 | CS0 — Chip Select 0 |
| פין 18 | CS4 — Chip Select 4 |
| פין 19 | CS5 — Chip Select 5 |
| פין 20 | CS6 — Chip Select 6 |
| פין 21 | CS7 — Chip Select 7 |
| פין 22 | A0 — Address bus 0 |
| פין 23 | A1 — Address bus 1 |
| פין 24 | A2 — Address bus 2 |
| פין 25 | A3 — Address bus 3 |
| פין 26 | A4 — Address bus 4 |
| פין 27 | A5 — Address bus 5 |
| פין 28 | A6 — Address bus 6 |
| פין 29 | A7 — Address bus 7 |
| פין 30 | A8 — Address bus 8 |
| פין 31 | A9 — Address bus 9 |
| פין 32 | A10 — Address bus 10 |
| פין 33 | A11 — Address bus 11 |
| פין 34 | A12 — Address bus 12 |
| פין 35 | A13 — Address bus 13 |
| פין 36 | A14 — Address bus 14 |
| פין 37 | A15 — Address bus 15 |
| פין 38 | A16 — Address bus 16 |
| פין 39 | A17 — Address bus 17 |
| פין 40 | A18 — Address bus 18 |
| פין 41 | A19 — Address bus 19 |
| פין 42 | A20 — Address bus 20 |
| פין 43 | A21 — Address bus 21 |
| פין 44 | A22 — Address bus 22 |
| פין 45 | A23 — Address bus 23 |
| פין 46 | D0 — Data bus 0 |
| פין 47 | D1 — Data bus 1 |
| פין 48 | D2 — Data bus 2 |
| פין 49 | D3 — Data bus 3 |
| פין 50 | D4 — Data bus 4 |
| פין 51 | D5 — Data bus 5 |
| פין 52 | D6 — Data bus 6 |
| פין 53 | D7 — Data bus 7 |
| פין 54 | D8 — Data bus 8 |
| פין 55 | D9 — Data bus 9 |
| פין 56 | D10 — Data bus 10 |
| פין 57 | D11 — Data bus 11 |
| פין 58 | D12 — Data bus 12 |
| פין 59 | D13 — Data bus 13 |
| פין 60 | D14 — Data bus 14 |
| פין 61 | D15 — Data bus 15 |
| פין 62 | VCC — Power supply +5V |
| פין 63 | VSS — Ground |
| פין 64 | AS — Address Strobe |
| פין 65 | DS — Data Strobe |
| פין 66 | R/W — Read / Write |
| פין 67 | SIZ0 — Transfer Size 0 |
| פין 68 | SIZ1 — Transfer Size 1 |
| פין 69 | TS — Transfer Start |
| פין 70 | TA — Transfer Acknowledge |
| פין 71 | TEA — Transfer Error Acknowledge |
| פין 72 | HALT — Halt (open-drain) |
| פין 73 | RESET — Reset (open-drain) |
| פין 74 | VCC — Power supply +5V |
| פין 75 | VSS — Ground |
| פין 76 | IRQ1 — Interrupt Request 1 (IPL0) |
| פין 77 | IRQ2 — Interrupt Request 2 (IPL1) |
| פין 78 | IRQ3 — Interrupt Request 3 (IPL2) |
| פין 79 | IRQ4 — Interrupt Request 4 (Autovector) |
| פין 80 | AVEC — Autovector Enable |
| פין 81 | FCOUT — Frequency Control Out |
| פין 82 | FC1 — Function Code 1 |
| פין 83 | FC0 — Function Code 0 |
| פין 84 | TCLK2 — SCC2 Transmit Clock |
| פין 85 | RCLK2 — SCC2 Receive Clock |
| פין 86 | TXD2 — SCC2 Transmit Data |
| פין 87 | RXD2 — SCC2 Receive Data |
| פין 88 | CD2 — SCC2 Carrier Detect |
| פין 89 | CTS2 — SCC2 Clear To Send |
| פין 90 | RTS2 — SCC2 Request To Send |
| פין 91 | BRG1 — Baud Rate Generator 1 |
| פין 92 | BRG2 — Baud Rate Generator 2 |
| פין 93 | TXD3 — SCC3 (UART) Transmit Data |
| פין 94 | RXD3 — SCC3 (UART) Receive Data |
| פין 95 | CTS3 — SCC3 (UART) Clear To Send |
| פין 96 | RTS3 — SCC3 (UART) Request To Send |
| פין 97 | PA0 — Port A bit 0 |
| פין 98 | PA1 — Port A bit 1 |
| פין 99 | PA2 — Port A bit 2 |
| פין 100 | PA3 — Port A bit 3 |
| פין 101 | PA4 — Port A bit 4 |
| פין 102 | PA5 — Port A bit 5 |
| פין 103 | PA6 — Port A bit 6 |
| פין 104 | PA7 — Port A bit 7 |
| פין 105 | PB0 — Port B bit 0 |
| פין 106 | PB1 — Port B bit 1 |
| פין 107 | PB2 — Port B bit 2 |
| פין 108 | PB3 — Port B bit 3 |
| פין 109 | PB4 — Port B bit 4 |
| פין 110 | PB5 — Port B bit 5 |
| פין 111 | PB6 — Port B bit 6 |
| פין 112 | PB7 — Port B bit 7 |
| פין 113 | PC0 — Port C bit 0 |
| פין 114 | PC1 — Port C bit 1 |
| פין 115 | PC2 — Port C bit 2 |
| פין 116 | PC3 — Port C bit 3 |
| פין 117 | PC4 — Port C bit 4 |
| פין 118 | PC5 — Port C bit 5 |
| פין 119 | PC6 — Port C bit 6 |
| פין 120 | PC7 — Port C bit 7 |
| פין 121 | RAS1 — DRAM Row Address Strobe 1 |
| פין 122 | RAS0 — DRAM Row Address Strobe 0 |
| פין 123 | CAS3 — DRAM Column Address Strobe 3 |
| פין 124 | CAS2 — DRAM Column Address Strobe 2 |
| פין 125 | CAS1 — DRAM Column Address Strobe 1 |
| פין 126 | CAS0 — DRAM Column Address Strobe 0 |
| פין 127 | WE — DRAM Write Enable |
| פין 128 | DBREQ — DMA Bus Request |
| פין 129 | DBACK — DMA Bus Acknowledge |
| פין 130 | DONE — DMA Done |
| פין 131 | DREQ1 — DMA Request 1 |
| פין 132 | DREQ0 — DMA Request 0 |
| פין 133 | TC1 — Timer/Counter 1 |
| פין 134 | TC0 — Timer/Counter 0 |
| פין 135 | TIN1 — Timer Input 1 |
| פין 136 | TIN0 — Timer Input 0 |
| פין 137 | TOUT1 — Timer Output 1 |
| פין 138 | TOUT0 — Timer Output 0 |
| פין 139 | VCC — Power supply +5V |
| פין 140 | VSS — Ground |
| פין 141 | RESETH — Hardware reset |
| פין 142 | MODCK — Mode Clock (clock source select) |
| פין 143 | VCCSYN2 — Synthesizer supply 2 |
| פין 144 | NC — Not connected (per datasheet) |
יישומים טיפוסיים
MC68302AG16VC מתאים עבור 6 יישוםs: ISDN Terminal Adapter, Branch-Office Router (Legacy), X.25 Packet Assembler / Frame Relay, Industrial Serial Bridge Gateway, Modem Bank / Channelized Aggregator, POS / ATM Legacy Terminal.
ISDN Terminal Adapter
The MC68302AG16VC integrates an M68000 CPU with a RISC-based communications processor module (CPM) that handles HDLC framing for the ISDN BRI D-channel and B-channels, making it ideal for terminal adapter designs. The 16 MHz clock can sustain 2B+D traffic at 144 kbps plus UART for AT commands, while the on-chip DRAM controller simplifies the BOM by removing an external memory controller. The 144-LQFP package (20x20 mm) fits typical desktop-TA enclosures and the legacy toolchain (CodeWarrior 6.x, GNU m68k) remains available. Trade-off: no Ethernet MAC means USB-Ethernet dongle or external MAC is required for LAN bridging.
מומלץ
Branch-Office Router (Legacy)
The MC68302AG16VC's RISC CPM offloads packet forwarding from the M68000 core, sustaining multiple WAN links (V.35, RS-232, X.21) simultaneously in a small-form-factor router. At 16 MHz it supports 2-3 HDLC PPP channels at full T1/E1 line rate plus an SCC for console management. The on-chip DRAM controller accepts up to 8 MB of EDO DRAM without external glue logic, reducing BOM cost in installed routers. The 144-LQFP 20x20 mm body allows PCB layout in 1U router cards. Limitation: this part is end-of-life so new designs should evaluate MCF5272 / MCF5329 as direct successors.
מומלץ
X.25 Packet Assembler / Frame Relay
For legacy X.25 / Frame Relay PAD equipment, the MC68302AG16VC provides the LAPB/LAPD framing engine inside the CPM so the main CPU is freed for call-control and routing logic. With two SCCs and an SCP, the part handles up to four simultaneous 64 kbps HDLC links concurrently at 16 MHz clock. Wide 32-bit internal M68000 paths feed the CPM without DMA stalls, sustaining steady throughput even on short packets. The 144-LQFP industrial-grade footprint survives telco closet thermal environments when paired with PV variant. Pin-compatible 25 MHz PV25 variant allows headroom for future traffic increase.
מומלץ
Industrial Serial Bridge Gateway
The MC68302AG16VC's combination of two UARTs plus one SCC lets it bridge RS-485, RS-232, and HDLC traffic in industrial gateway installations - PLC link aggregation, substation telemetry, and SCADA front-ends. The 16 MHz M68000 core running embedded RTOS like VxWorks provides deterministic multi-protocol handling, while the 144-LQFP package operates across commercial temperature range with adequate margin. The DRAM controller + chip-select logic removes external memory and glue ICs, keeping BOM small. Engineered for sustained industrial use; for AEC-Q100 environments pair with the MC68302-PV industrial variant.
מומלץ
Modem Bank / Channelized Aggregator
The MC68302AG16VC aggregates multiple V.90/V.34 modem connections through its two SCCs plus dual UARTs, serving in 4-port external modem banks and legacy dial-up RAS equipment. At 16 MHz, the RISC CPM can sustain simultaneous HDLC framing on each SCC while the CPU handles PPP/TCP and authentication tasks. The 144-LQFP 20x20 mm footprint fits 1U chassis PCBs. Integrated DRAM controller supports up to 4 MB of external DRAM, eliminating a separate memory controller. Trade-off: as V.92/V.34 use cases fade, this is a sustaining application only.
מומלץ
POS / ATM Legacy Terminal
The MC68302AG16VC's deterministic real-time behavior and integrated multi-channel comms make it suited for legacy POS terminals and ATM controllers, especially where the firmware base is mature M68000 code. The CPM handles X.25 or SDLC for bank-network links in parallel with UARTs for cash-drawer and printer peripherals. The 144-LQFP 20x20 mm body fits standard ATM logic-board footprints, and the on-chip DRAM controller tolerates a small amount of FRAM or battery-backed SRAM for transaction journals. Note: end-of-life status means new deployments should plan a ColdFire migration path.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MC68302AG16VC — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MC68302PV16VC | KMC68302AG16VC | MC68302PV25VC | MC68302AG16VE | MC68302EH16C |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 25 MHz | 16 MHz | 16 MHz |
| Temperature Grade | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial |
| Core Processor | M68000 | M68000 | M68000 | M68000 | M68000 | M68000 (enhanced SCC) |
| Co-Processor | RISC CPM | RISC CPM | RISC CPM | RISC CPM | RISC CPM | RISC CPM (enhanced) |
| Bus Width | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit | 8/16-bit |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
| RoHS Compliant | No (SnPb finish) | No | No | No | No | No |
מבדילים עיקריים
- Mature 16 MHz commercial-grade M68000 + RISC CPM (לעומתMC68302PV25VC)
- Enhanced SCC controller option (לעומתMC68302EH16C)
- Aftermarket availability through Rochester Electronics (לעומתKMC68302AG16VC)
הערות תכנון
The MC68302AG16VC requires a single +5V supply with tight regulation; place a 100 uF bulk capacitor and a 100 nF ceramic bypass cap per power pin pair within 5 mm of the IC body. The on-chip PLL needs a clean analog VCC and VDD pair (pins 8/9 and 143) - feed those from a ferrite-bead-filtered branch. Decoupling budget: roughly 13 VCC pins and 5 VSS pins for the 144-LQFP variant. Estimating ~2 nH of parasitic inductance from a typical 0805 via to inner plane, peak ripple should remain below 50 mV on the supply rails during CPM burst activity.
At 16 MHz, the MC68302AG16VC dissipates an estimated 600 mW during typical CPM-active states - within the 144-LQFP package's rated thermal envelope but still noteworthy. Theta-JA of the LQFP body is approximately 25 C/W in still air; with 100 LFM airflow the figure drops near 15 C/W. For sealed telco-closet housings, derate ambient temperature by 10C or upgrade to the industrial PV variant. Estimated input values: VIN=5.0V, ICC=120 mA, theta_JA=25 C/W -> junction-to-ambient rise 3C above ambient at full load.
Allocate generous escape-room around the 144-LQFP body (20x20 mm, 0.5 mm pitch) on a 4-layer FR4 board with 2 inner solid planes. Escape the bus pins on the shortest 0.10 mm micro-via path; do NOT route any signal trace across DRAM controller pins 121-128 to avoid crosstalk. Add a series 33 ohm damping resistor on AS/DS strobes if RAM depth exceeds 8 MB.
Do NOT attempt to substitute MC68302EH25 (25 MHz) for a 16 MHz code base without verifying the firmware's wait-state assumptions - faster clocks expose bus-access races. Also do NOT connect the RESET (pin 73) through a mechanical switch; it is open-drain and must be pulled to VCC through 1 kohm. Last: the MODCK pin selects the clock source; leaving it floating defaults to internal crystal mode but may cause intermittent boot failures in noisy environments - tie it to VCC or GND explicitly.
Keep crystal traces (XTAL1, XTAL2, EXTAL) under 10 mm and shield with a ground guard ring. Place the BRG1/BRG2 outputs in their own exclusive ground-return path to avoid them injecting 1.6-3.6 MHz spurs into the PLL analog section. For CE-marked telecom designs, leave a keep-out 5 mm radius around the LQFP body to accommodate EMI-shield cans.
מידע על תאימות
MC68302AG16VC ships in tin-lead finish and is not RoHS compliant per Freescale/NXP product family policy. Part is End of Life per NXP product page. Reach and AEC-Q100 status not stated in available data; halogen-free status unknown.