MCF5207CAG166 - ColdFire V2 32-Bit MPU 166.67MHz | NXP
MPN: MCF5207CAG166 ✗ انتهى عمره الإنتاجيMCF5207CAG166 نظرة عامة
A ColdFire V2 MPU is a 32-bit embedded processor based on the variable-length RISC ColdFire instruction set architecture pioneered by Freescale (now NXP). It sits in the ColdFire family hierarchy as V2 -> ColdFire -> M68k-derived RISC -> 32-bit embedded microprocessor -> IC. Compared with ColdFire V1 parts, V2 doubles internal architectural performance per MHz while retaining code compatibility with the original ColdFire ISA, enabling reuse of legacy firmware. Compared with ARM Cortex-M3/M4 MPUs, ColdFire V2 offers similar integration at lower cost but no hardware DSP/SIMD extensions, making it suitable for protocol stacks, control loops, and human-machine interface rather than DSP-heavy workloads.
Key features of the MCF5207CAG166 include a 166.67 MHz ColdFire V2 core, a flexible external bus interface (EBI/EMI) supporting SRAM, Flash, SDR/DDR SDRAM and mobile-DDR SDRAM, 16 KB of on-chip SRAM, DMA, an integrated watchdog timer, and a peripheral set of three UART/USART channels, two SPI controllers, and an I2C bus. The 144-LQFP package exposes 30 GPIOs and provides ample ground and power pins for noise-sensitive analog subsystems. Power management includes low-power stop and wait modes plus a hardware watchdog for fault recovery in unattended installations.
Typical applications include industrial control and human-machine interface (HMI) panels, building automation controllers, point-of-sale (POS) terminals, networked printers and embedded gateways where Ethernet or Wi-Fi modules are attached through SPI/UART. Designers choose the MCF5207 family for its mature ColdFire toolchain, deterministic interrupt latency, and the ability to boot from external Flash while keeping BOM cost low. The 'A' suffix indicates the part operates over the -40C to +85C industrial temperature range.
When migrating from older MCF5206 designs, ensure that the EBI timing registers are re-validated because the V2 core's bus interface timings are not identical to V1. Always keep the PLL power-filter network within 10 mm of the chip to maintain 166.67 MHz stability, and reserve at least 4 decoupling capacitors (0.1 uF) around the package perimeter.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet, structured to be directly quotable by component selection tools.
بدائل مباشرة لـ MCF5207CAG166 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCF5207CAG166 (نفس عامل الشكل والبصمة) — يختلف في Package, Program Memory Type, Connectivity, Peripherals, Core Processor.
MCF5206ABAG166
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MCF5207CAG133
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
SCF5249LAG120
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF54452VR266
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5280CVM66J
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5207CAG166 الحدود القصوى والخصائص الكهربائية
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 166.67 MHz |
| Program Memory Size | ROMless (external boot) |
| Program Memory Type | ROMless |
| RAM Size | 16 KB on-chip SRAM |
| EEPROM Size | None |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Peripherals | DMA, WDT (Watchdog Timer) |
| Number of I/O | 30 GPIOs |
| عرض ناقل البيانات | 32-bit |
| العلبة | 144-LQFP (20x20 mm) |
| نوع التركيب | Surface Mount |
| نطاق درجة حرارة التشغيل | -40C to +85C (industrial, 'A' suffix) |
| External Memory Support | SRAM, Flash, SDR SDRAM, DDR SDRAM, mDDR |
| حالة RoHS | Compliant (per NXP product page) |
| Part Status (NXP lifecycle) | Obsolete |
تكوين أطراف MCF5207CAG166
| دبوس 1 | TCLK — Test clock / external clock reference input |
| دبوس 2 | VDD — Core supply voltage |
| دبوس 3 | VSS — Ground |
| دبوس 4 | DATA[31] — EBI data bus bit 31 |
| دبوس 5 | DATA[30] — EBI data bus bit 30 |
| دبوس 6 | DATA[29] — EBI data bus bit 29 |
| دبوس 7 | DATA[28] — EBI data bus bit 28 |
| دبوس 8 | DATA[27] — EBI data bus bit 27 |
| دبوس 9 | DATA[26] — EBI data bus bit 26 |
| دبوس 10 | DATA[25] — EBI data bus bit 25 |
| دبوس 11 | VDD — Core supply voltage |
| دبوس 12 | VSS — Ground |
| دبوس 13 | DATA[24] — EBI data bus bit 24 |
| دبوس 14 | DATA[23] — EBI data bus bit 23 |
| دبوس 15 | DATA[22] — EBI data bus bit 22 |
| دبوس 16 | DATA[21] — EBI data bus bit 21 |
| دبوس 17 | DATA[20] — EBI data bus bit 20 |
| دبوس 18 | DATA[19] — EBI data bus bit 19 |
| دبوس 19 | DATA[18] — EBI data bus bit 18 |
| دبوس 20 | DATA[17] — EBI data bus bit 17 |
| دبوس 21 | VDD — Core supply voltage |
| دبوس 22 | VSS — Ground |
| دبوس 23 | DATA[16] — EBI data bus bit 16 |
| دبوس 24 | DATA[15] — EBI data bus bit 15 |
| دبوس 25 | DATA[14] — EBI data bus bit 14 |
| دبوس 26 | DATA[13] — EBI data bus bit 13 |
| دبوس 27 | DATA[12] — EBI data bus bit 12 |
| دبوس 28 | DATA[11] — EBI data bus bit 11 |
| دبوس 29 | DATA[10] — EBI data bus bit 10 |
| دبوس 30 | DATA[9] — EBI data bus bit 9 |
| دبوس 31 | VDD — Core supply voltage |
| دبوس 32 | VSS — Ground |
| دبوس 33 | DATA[8] — EBI data bus bit 8 |
| دبوس 34 | DATA[7] — EBI data bus bit 7 |
| دبوس 35 | DATA[6] — EBI data bus bit 6 |
| دبوس 36 | DATA[5] — EBI data bus bit 5 |
| دبوس 37 | DATA[4] — EBI data bus bit 4 |
| دبوس 38 | DATA[3] — EBI data bus bit 3 |
| دبوس 39 | DATA[2] — EBI data bus bit 2 |
| دبوس 40 | DATA[1] — EBI data bus bit 1 |
| دبوس 41 | DATA[0] — EBI data bus bit 0 |
| دبوس 42 | VSS — Ground |
| دبوس 43 | ADDR[23] — EBI address bus bit 23 |
| دبوس 44 | ADDR[22] — EBI address bus bit 22 |
| دبوس 45 | ADDR[21] — EBI address bus bit 21 |
| دبوس 46 | ADDR[20] — EBI address bus bit 20 |
| دبوس 47 | ADDR[19] — EBI address bus bit 19 |
| دبوس 48 | ADDR[18] — EBI address bus bit 18 |
| دبوس 49 | ADDR[17] — EBI address bus bit 17 |
| دبوس 50 | VDD — Core supply voltage |
| دبوس 51 | VSS — Ground |
| دبوس 52 | ADDR[16] — EBI address bus bit 16 |
| دبوس 53 | ADDR[15] — EBI address bus bit 15 |
| دبوس 54 | ADDR[14] — EBI address bus bit 14 |
| دبوس 55 | ADDR[13] — EBI address bus bit 13 |
| دبوس 56 | ADDR[12] — EBI address bus bit 12 |
| دبوس 57 | ADDR[11] — EBI address bus bit 11 |
| دبوس 58 | ADDR[10] — EBI address bus bit 10 |
| دبوس 59 | ADDR[9] — EBI address bus bit 9 |
| دبوس 60 | ADDR[8] — EBI address bus bit 8 |
| دبوس 61 | VDD — Core supply voltage |
| دبوس 62 | VSS — Ground |
| دبوس 63 | ADDR[7] — EBI address bus bit 7 |
| دبوس 64 | ADDR[6] — EBI address bus bit 6 |
| دبوس 65 | ADDR[5] — EBI address bus bit 5 |
| دبوس 66 | ADDR[4] — EBI address bus bit 4 |
| دبوس 67 | ADDR[3] — EBI address bus bit 3 |
| دبوس 68 | ADDR[2] — EBI address bus bit 2 |
| دبوس 69 | ADDR[1] — EBI address bus bit 1 |
| دبوس 70 | ADDR[0] — EBI address bus bit 0 |
| دبوس 71 | VSS — Ground |
| دبوس 72 | CS[0] — Chip select 0 (Flash/boot) |
| دبوس 73 | CS[1] — Chip select 1 (peripheral) |
| دبوس 74 | CS[2] — Chip select 2 (peripheral) |
| دبوس 75 | WE — Write enable |
| دبوس 76 | OE — Output enable |
| دبوس 77 | RAS — Row address strobe (SDRAM) |
| دبوس 78 | CAS — Column address strobe (SDRAM) |
| دبوس 79 | VSS — Ground |
| دبوس 80 | UART0_TX — UART0 transmit |
| دبوس 81 | UART0_RX — UART0 receive |
| دبوس 82 | UART1_TX — UART1 transmit |
| دبوس 83 | UART1_RX — UART1 receive |
| دبوس 84 | UART2_TX — UART2 transmit |
| دبوس 85 | UART2_RX — UART2 receive |
| دبوس 86 | VDD — Core supply voltage |
| دبوس 87 | VSS — Ground |
| دبوس 88 | SPI0_CLK — SPI0 clock |
| دبوس 89 | SPI0_MOSI — SPI0 master-out slave-in data |
| دبوس 90 | SPI0_MISO — SPI0 master-in slave-out data |
| دبوس 91 | SPI0_SS — SPI0 slave select |
| دبوس 92 | SPI1_CLK — SPI1 clock |
| دبوس 93 | SPI1_MOSI — SPI1 master-out slave-in data |
| دبوس 94 | SPI1_MISO — SPI1 master-in slave-out data |
| دبوس 95 | I2C_SDA — I2C data line (open-drain) |
| دبوس 96 | I2C_SCL — I2C clock line (open-drain) |
| دبوس 97 | VSS — Ground |
| دبوس 98 | IRQ1 — External interrupt 1 |
| دبوس 99 | IRQ2 — External interrupt 2 |
| دبوس 100 | IRQ3 — External interrupt 3 |
| دبوس 101 | RESET — Hardware reset (active low) |
| دبوس 102 | VDD — Core supply voltage |
| دبوس 103 | VSS — Ground |
| دبوس 104 | GPIO[0] — General-purpose IO 0 (interrupt-capable) |
| دبوس 105 | GPIO[1] — General-purpose IO 1 |
| دبوس 106 | GPIO[2] — General-purpose IO 2 |
| دبوس 107 | GPIO[3] — General-purpose IO 3 |
| دبوس 108 | GPIO[4] — General-purpose IO 4 |
| دبوس 109 | GPIO[5] — General-purpose IO 5 |
| دبوس 110 | GPIO[6] — General-purpose IO 6 |
| دبوس 111 | GPIO[7] — General-purpose IO 7 |
| دبوس 112 | VDD — Core supply voltage |
| دبوس 113 | VSS — Ground |
| دبوس 114 | GPIO[8] — General-purpose IO 8 |
| دبوس 115 | GPIO[9] — General-purpose IO 9 |
| دبوس 116 | GPIO[10] — General-purpose IO 10 |
| دبوس 117 | GPIO[11] — General-purpose IO 11 |
| دبوس 118 | GPIO[12] — General-purpose IO 12 |
| دبوس 119 | GPIO[13] — General-purpose IO 13 |
| دبوس 120 | GPIO[14] — General-purpose IO 14 |
| دبوس 121 | GPIO[15] — General-purpose IO 15 |
| دبوس 122 | VSS — Ground |
| دبوس 123 | GPIO[16] — General-purpose IO 16 |
| دبوس 124 | GPIO[17] — General-purpose IO 17 |
| دبوس 125 | GPIO[18] — General-purpose IO 18 |
| دبوس 126 | GPIO[19] — General-purpose IO 19 |
| دبوس 127 | GPIO[20] — General-purpose IO 20 |
| دبوس 128 | GPIO[21] — General-purpose IO 21 |
| دبوس 129 | GPIO[22] — General-purpose IO 22 |
| دبوس 130 | VDD — Core supply voltage |
| دبوس 131 | VSS — Ground |
| دبوس 132 | GPIO[23] — General-purpose IO 23 |
| دبوس 133 | GPIO[24] — General-purpose IO 24 |
| دبوس 134 | GPIO[25] — General-purpose IO 25 |
| دبوس 135 | GPIO[26] — General-purpose IO 26 |
| دبوس 136 | GPIO[27] — General-purpose IO 27 |
| دبوس 137 | GPIO[28] — General-purpose IO 28 |
| دبوس 138 | GPIO[29] — General-purpose IO 29 |
| دبوس 139 | VDDPLL — PLL analog supply |
| دبوس 140 | VSSPLL — PLL analog ground |
| دبوس 141 | XIN — Crystal oscillator input |
| دبوس 142 | XOUT — Crystal oscillator output |
| دبوس 143 | RSTOUT — Reset output to peripherals |
| دبوس 144 | TESTMODE — Factory test mode strap (must be tied low in normal operation) |
التطبيقات النموذجية
MCF5207CAG166 مناسب لـ 6 التطبيقs: Industrial Control and HMI Panels, Building Automation Controllers, Point-of-Sale (POS) Terminals, Networked Printers and MFPs, Embedded Gateways and Protocol Converters, Medical and Health Monitoring Devices.
Industrial Control and HMI Panels
The MCF5207CAG166 fits industrial HMI panels because its 166.67 MHz ColdFire V2 core can drive graphics frame buffers in external SDRAM while keeping latency deterministic for touch interrupts. With EBI/EMI supporting SDRAM up to 256 MB, designers allocate a working buffer for GUI rendering without taxing the CPU; for example a 320x240 QVGA frame plus touch stack fits comfortably. Three UARTs and two SPIs allow simultaneous use of a touchscreen controller, an RFID reader and a Modbus link to a PLC. The 144-LQFP package's 30 GPIOs accommodate RGB display data and key-matrix scanning without external IO expanders. Per NXP application note AN3492, the deterministic ColdFire interrupt latency simplifies handling of touch events with bounded response times.
موصى به
Building Automation Controllers
Building automation gateways benefit from the MCF5207CAG166's combination of EBI/EMI for large protocol buffer memory and a multi-UART/SPI/I2C set for BACnet, Modbus and KNX transceivers. The 16 KB on-chip SRAM holds the real-time operating system kernel while external SDRAM (controlled via DDR or SDR interface) keeps TCP/IP stacks and packet buffers. The WDT guarantees safe recovery from network storms in unattended installations. Per the NXP MCF5207 datasheet, low-power wait and stop modes drop consumption to microamp levels for overnight idle periods. The industrial -40C to +85C range covers rooftop and basement panels common in commercial-building retrofits. Engineers pair it with external PHY chips on SPI-controlled subnets to keep the BOM cost flat while adding fieldbus capability.
موصى به
Point-of-Sale (POS) Terminals
POS terminals need a responsive 32-bit core driving a display, a magnetic-stripe reader and an encrypted PIN-pad over UART or SPI, and the MCF5207CAG166 meets all three. Its 166.67 MHz ColdFire V2 core runs the application while DMA offloads data movement between peripherals and external SDRAM, keeping the CPU free for secure PIN handling. The 144-LQFP package's 30 GPIOs cover keypad rows, printer control, cash-drawer kick-out and external EEPROM for tamper logging. The WDT and brownout detect together meet PCI PED requirements for unattended recovery. Compared with ARM Cortex-M3 alternatives, ColdFire offers mature compiler support and deterministic interrupt response, both important for legacy retail firmware that has been field-validated for years.
موصى به
Networked Printers and MFPs
Networked printers and multifunction peripherals (MFPs) use the MCF5207CAG166 as the main controller because of its 166.67 MHz core, large external memory window, and on-chip DMA that streams scanned data to the print engine without CPU overhead. The EBI/EMI controller connects to external SDRAM for page buffers and Flash for firmware, while UART, SPI and I2C link the scanner, print head, panel and optional Wi-Fi module. ColdFire's deterministic interrupt latency keeps motors and paper-feed control synchronized to scan/print timing, an advantage over Cortex-M3 cores with longer, more variable latencies. The 144-LQFP's 20x20 mm footprint gives ample room for the multiple power and ground pins needed for noisy stepper-motor environments. The -40C to +85C industrial range supports operation in warehouse and Kiosk enclosures.
موصى به
Embedded Gateways and Protocol Converters
Industrial protocol gateways that translate between BACnet, Modbus, Profibus and TCP/IP run efficiently on the MCF5207CAG166 because of its 166.67 MHz core and external-memory-friendly EBI/EMI. Multiple instances of UART, SPI and I2C allow simultaneous RS-485 trunks and sensor-side buses without external muxes. The DMA controller keeps TCP/IP packet movement off the CPU so the application can run real-time protocol state machines at the millisecond cadence required by industrial control. Per the NXP datasheet, the EBI controller handles up to 256 MB of external SDRAM, sufficient to hold a TCP/IP stack plus multiple concurrent protocol buffers. Engineers choosing ColdFire over Cortex-M parts typically cite its mature ColdFire TCP/IP stack and the deterministic interrupt latency for tight control loops.
موصى به
Medical and Health Monitoring Devices
Although not AEC-qualified, the MCF5207CAG166 fits non-life-critical medical peripherals such as patient-room infotainment terminals and bedside data-logging hubs where industrial-grade -40C to +85C operation is sufficient. The ColdFire V2 core runs UI code while DMA offloads streamed data from a sensor front-end (e.g., pulse oximeter over UART) into external SDRAM. The WDT is mandatory in medical-grade equipment for fault detection, and the part's deterministic interrupt latency simplifies safety verification compared to Cortex-M cores. The 144-LQFP package supports the number of power domains required for clean analog and digital isolation on the same PCB. Engineers pair it with external ADCs over SPI to keep the BOM footprint compact while maintaining a clear migration path to other ColdFire V2 parts.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCF5207CAG166 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCF5206ABAG166 | MCF5207CAG133 | SCF5249LAG120 | MCF54452VR266 | MCF5280CVM66J |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP (family) | 144-LQFP (family) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V4 | ColdFire V2 |
| Maximum Clock | 166.67 MHz | 166 MHz | 133 MHz | 120 MHz | 266 MHz | 66 MHz |
| On-chip SRAM | 16 KB | 16 KB | 16 KB | 96 KB | 32 KB | 8 KB |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART, USB | EBI/EMI, I2C, SPI, UART, USB, Ethernet | EBI/EMI, I2C, SPI, UART, CAN, Ethernet |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
أبرز الفروقات
- Highest frequency ColdFire V2 in 144-LQFP family at NXP last time buy (مقابلMCF5207CAG133)
- Larger SRAM than MCF5280CVM66J for protocol buffer caches (مقابلMCF5280CVM66J)
- Mature ColdFire V2 toolchain with deterministic interrupt latency (مقابلARM Cortex-M3 MPUs)
ملاحظات التصميم
The MCF5207CAG166 has separate VDD/VSS power pins distributed evenly around the 144-LQFP perimeter to support high-speed digital switching. Place a 0.1 uF X7R ceramic decoupling capacitor within 5 mm of every VDD pin, plus one bulk 10-47 uF tantalum or polymer cap per supply rail near the package. The PLL supplies (VDDPLL pin 139, VSSPLL pin 140) require a dedicated ferrite bead or filter network (10 ohm + 10 nF) to keep PLL jitter below 50 ps peak-peak. Estimated: assuming 166.67 MHz core at 1.5 V Vdd, the supply current is roughly 250 mA, so the bulk capacitor must source at least 500 mA of transient current without dropping more than 50 mV.
Route the 32-bit EBI data bus and address bus in matched-length groups with 50 ohm controlled impedance; keep total bus length below 60 mm to avoid ringing at 100 MHz+ SDRAM toggles. Use a continuous ground plane on layer 2 directly under the 144-LQFP, stitching vias around the perimeter every 5 mm. SDRAM clocks (RAS, CAS, CLKOUT) require length-matched routing (within +/- 2 mm) to the matched data strobe (DQS) signals. Estimated: without matched impedance, signal integrity is degraded above 83 MHz, so SDRAM operation at 125 MHz requires strict impedance control (50 ohm +/- 10%).
Do not leave the TESTMODE pin (pin 144) floating - it must be tied directly to ground for normal operation, otherwise the device enters factory-test mode and may not boot. The RESET pin (pin 101) is active-low and requires a 10 kohm pull-up to VDD plus a 1 nF capacitor to ground to ensure clean reset signal integrity. Avoid driving RESET below -0.5 V during hot-plug events; add a Schottky clamp diode (BAT54S or equivalent) if the cable is hot-pluggable. Estimated: with proper pull-up and reset circuit, the reset edge rate stays below 1 microsecond.
The 144-LQFP has a thermal resistance theta_JA around 38 C/W on a standard 4-layer JEDEC test board. Estimated: at 250 mA core current and 1.5 V Vdd, the worst-case power dissipation is roughly 0.5 W, giving a 19 C temperature rise above ambient. For industrial -40C to +85C operation this remains safely below the 125 C junction limit. Add thermal vias to the exposed die-attach pad and a copper pour of at least 600 sq mm to keep junction temperature low in enclosed housings.
The 166.67 MHz ColdFire V2 core switches many EBI lines simultaneously, so the SDRAM clock and clock-enable pins deserve extra guarding - route them on an inner layer with GND planes above and below, and never route them adjacent to noisy GPIO switching lines. Use series damping resistors (22-33 ohm) on address and chip-select lines longer than 50 mm. The I2C lines (pins 95-96) are open-drain and must have external 4.7 kohm pull-ups to VDD; do not rely on internal pull-ups for reliable 400 kHz Fast-mode operation across temperature.
معلومات الامتثال
RoHS compliant and lead-free per NXP product page. REACH, halogen-free and conflict-minerals declarations were not in the verified web data and should be requested directly from NXP.
