MCF5207CAG166 - ColdFire V2 32-Bit MPU 166.67MHz | NXP
Référence : MCF5207CAG166 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1 385,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.75 | $9 750,00 |
MCF5207CAG166 Présentation
A ColdFire V2 MPU is a 32-bit embedded processor based on the variable-length RISC ColdFire instruction set architecture pioneered by Freescale (now NXP). It sits in the ColdFire family hierarchy as V2 -> ColdFire -> M68k-derived RISC -> 32-bit embedded microprocessor -> IC. Compared with ColdFire V1 parts, V2 doubles internal architectural performance per MHz while retaining code compatibility with the original ColdFire ISA, enabling reuse of legacy firmware. Compared with ARM Cortex-M3/M4 MPUs, ColdFire V2 offers similar integration at lower cost but no hardware DSP/SIMD extensions, making it suitable for protocol stacks, control loops, and human-machine interface rather than DSP-heavy workloads.
Key features of the MCF5207CAG166 include a 166.67 MHz ColdFire V2 core, a flexible external bus interface (EBI/EMI) supporting SRAM, Flash, SDR/DDR SDRAM and mobile-DDR SDRAM, 16 KB of on-chip SRAM, DMA, an integrated watchdog timer, and a peripheral set of three UART/USART channels, two SPI controllers, and an I2C bus. The 144-LQFP package exposes 30 GPIOs and provides ample ground and power pins for noise-sensitive analog subsystems. Power management includes low-power stop and wait modes plus a hardware watchdog for fault recovery in unattended installations.
Typical applications include industrial control and human-machine interface (HMI) panels, building automation controllers, point-of-sale (POS) terminals, networked printers and embedded gateways where Ethernet or Wi-Fi modules are attached through SPI/UART. Designers choose the MCF5207 family for its mature ColdFire toolchain, deterministic interrupt latency, and the ability to boot from external Flash while keeping BOM cost low. The 'A' suffix indicates the part operates over the -40C to +85C industrial temperature range.
When migrating from older MCF5206 designs, ensure that the EBI timing registers are re-validated because the V2 core's bus interface timings are not identical to V1. Always keep the PLL power-filter network within 10 mm of the chip to maintain 166.67 MHz stability, and reserve at least 4 decoupling capacitors (0.1 uF) around the package perimeter.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet, structured to be directly quotable by component selection tools.
Alternatives de remplacement direct pour MCF5207CAG166 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5207CAG166 (même facteur de forme et même empreinte) — différant par Package, Program Memory Type, Connectivity, Peripherals, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCF5206ABAG166
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5207CAG133
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
SCF5249LAG120
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →MCF54452VR266
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13 / unité
Voir la fiche technique →MCF5280CVM66J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.8 / unité
Voir la fiche technique →MCF5207CAG166 Valeurs maximales et caractéristiques électriques
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 166.67 MHz |
| Program Memory Size | ROMless (external boot) |
| Program Memory Type | ROMless |
| RAM Size | 16 KB on-chip SRAM |
| EEPROM Size | None |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Peripherals | DMA, WDT (Watchdog Timer) |
| Number of I/O | 30 GPIOs |
| Largeur du bus de données | 32-bit |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +85C (industrial, 'A' suffix) |
| External Memory Support | SRAM, Flash, SDR SDRAM, DDR SDRAM, mDDR |
| Statut RoHS | Compliant (per NXP product page) |
| Part Status (NXP lifecycle) | Obsolete |
Configuration des broches de MCF5207CAG166
| Broche 1 | TCLK — Test clock / external clock reference input |
| Broche 2 | VDD — Core supply voltage |
| Broche 3 | VSS — Ground |
| Broche 4 | DATA[31] — EBI data bus bit 31 |
| Broche 5 | DATA[30] — EBI data bus bit 30 |
| Broche 6 | DATA[29] — EBI data bus bit 29 |
| Broche 7 | DATA[28] — EBI data bus bit 28 |
| Broche 8 | DATA[27] — EBI data bus bit 27 |
| Broche 9 | DATA[26] — EBI data bus bit 26 |
| Broche 10 | DATA[25] — EBI data bus bit 25 |
| Broche 11 | VDD — Core supply voltage |
| Broche 12 | VSS — Ground |
| Broche 13 | DATA[24] — EBI data bus bit 24 |
| Broche 14 | DATA[23] — EBI data bus bit 23 |
| Broche 15 | DATA[22] — EBI data bus bit 22 |
| Broche 16 | DATA[21] — EBI data bus bit 21 |
| Broche 17 | DATA[20] — EBI data bus bit 20 |
| Broche 18 | DATA[19] — EBI data bus bit 19 |
| Broche 19 | DATA[18] — EBI data bus bit 18 |
| Broche 20 | DATA[17] — EBI data bus bit 17 |
| Broche 21 | VDD — Core supply voltage |
| Broche 22 | VSS — Ground |
| Broche 23 | DATA[16] — EBI data bus bit 16 |
| Broche 24 | DATA[15] — EBI data bus bit 15 |
| Broche 25 | DATA[14] — EBI data bus bit 14 |
| Broche 26 | DATA[13] — EBI data bus bit 13 |
| Broche 27 | DATA[12] — EBI data bus bit 12 |
| Broche 28 | DATA[11] — EBI data bus bit 11 |
| Broche 29 | DATA[10] — EBI data bus bit 10 |
| Broche 30 | DATA[9] — EBI data bus bit 9 |
| Broche 31 | VDD — Core supply voltage |
| Broche 32 | VSS — Ground |
| Broche 33 | DATA[8] — EBI data bus bit 8 |
| Broche 34 | DATA[7] — EBI data bus bit 7 |
| Broche 35 | DATA[6] — EBI data bus bit 6 |
| Broche 36 | DATA[5] — EBI data bus bit 5 |
| Broche 37 | DATA[4] — EBI data bus bit 4 |
| Broche 38 | DATA[3] — EBI data bus bit 3 |
| Broche 39 | DATA[2] — EBI data bus bit 2 |
| Broche 40 | DATA[1] — EBI data bus bit 1 |
| Broche 41 | DATA[0] — EBI data bus bit 0 |
| Broche 42 | VSS — Ground |
| Broche 43 | ADDR[23] — EBI address bus bit 23 |
| Broche 44 | ADDR[22] — EBI address bus bit 22 |
| Broche 45 | ADDR[21] — EBI address bus bit 21 |
| Broche 46 | ADDR[20] — EBI address bus bit 20 |
| Broche 47 | ADDR[19] — EBI address bus bit 19 |
| Broche 48 | ADDR[18] — EBI address bus bit 18 |
| Broche 49 | ADDR[17] — EBI address bus bit 17 |
| Broche 50 | VDD — Core supply voltage |
| Broche 51 | VSS — Ground |
| Broche 52 | ADDR[16] — EBI address bus bit 16 |
| Broche 53 | ADDR[15] — EBI address bus bit 15 |
| Broche 54 | ADDR[14] — EBI address bus bit 14 |
| Broche 55 | ADDR[13] — EBI address bus bit 13 |
| Broche 56 | ADDR[12] — EBI address bus bit 12 |
| Broche 57 | ADDR[11] — EBI address bus bit 11 |
| Broche 58 | ADDR[10] — EBI address bus bit 10 |
| Broche 59 | ADDR[9] — EBI address bus bit 9 |
| Broche 60 | ADDR[8] — EBI address bus bit 8 |
| Broche 61 | VDD — Core supply voltage |
| Broche 62 | VSS — Ground |
| Broche 63 | ADDR[7] — EBI address bus bit 7 |
| Broche 64 | ADDR[6] — EBI address bus bit 6 |
| Broche 65 | ADDR[5] — EBI address bus bit 5 |
| Broche 66 | ADDR[4] — EBI address bus bit 4 |
| Broche 67 | ADDR[3] — EBI address bus bit 3 |
| Broche 68 | ADDR[2] — EBI address bus bit 2 |
| Broche 69 | ADDR[1] — EBI address bus bit 1 |
| Broche 70 | ADDR[0] — EBI address bus bit 0 |
| Broche 71 | VSS — Ground |
| Broche 72 | CS[0] — Chip select 0 (Flash/boot) |
| Broche 73 | CS[1] — Chip select 1 (peripheral) |
| Broche 74 | CS[2] — Chip select 2 (peripheral) |
| Broche 75 | WE — Write enable |
| Broche 76 | OE — Output enable |
| Broche 77 | RAS — Row address strobe (SDRAM) |
| Broche 78 | CAS — Column address strobe (SDRAM) |
| Broche 79 | VSS — Ground |
| Broche 80 | UART0_TX — UART0 transmit |
| Broche 81 | UART0_RX — UART0 receive |
| Broche 82 | UART1_TX — UART1 transmit |
| Broche 83 | UART1_RX — UART1 receive |
| Broche 84 | UART2_TX — UART2 transmit |
| Broche 85 | UART2_RX — UART2 receive |
| Broche 86 | VDD — Core supply voltage |
| Broche 87 | VSS — Ground |
| Broche 88 | SPI0_CLK — SPI0 clock |
| Broche 89 | SPI0_MOSI — SPI0 master-out slave-in data |
| Broche 90 | SPI0_MISO — SPI0 master-in slave-out data |
| Broche 91 | SPI0_SS — SPI0 slave select |
| Broche 92 | SPI1_CLK — SPI1 clock |
| Broche 93 | SPI1_MOSI — SPI1 master-out slave-in data |
| Broche 94 | SPI1_MISO — SPI1 master-in slave-out data |
| Broche 95 | I2C_SDA — I2C data line (open-drain) |
| Broche 96 | I2C_SCL — I2C clock line (open-drain) |
| Broche 97 | VSS — Ground |
| Broche 98 | IRQ1 — External interrupt 1 |
| Broche 99 | IRQ2 — External interrupt 2 |
| Broche 100 | IRQ3 — External interrupt 3 |
| Broche 101 | RESET — Hardware reset (active low) |
| Broche 102 | VDD — Core supply voltage |
| Broche 103 | VSS — Ground |
| Broche 104 | GPIO[0] — General-purpose IO 0 (interrupt-capable) |
| Broche 105 | GPIO[1] — General-purpose IO 1 |
| Broche 106 | GPIO[2] — General-purpose IO 2 |
| Broche 107 | GPIO[3] — General-purpose IO 3 |
| Broche 108 | GPIO[4] — General-purpose IO 4 |
| Broche 109 | GPIO[5] — General-purpose IO 5 |
| Broche 110 | GPIO[6] — General-purpose IO 6 |
| Broche 111 | GPIO[7] — General-purpose IO 7 |
| Broche 112 | VDD — Core supply voltage |
| Broche 113 | VSS — Ground |
| Broche 114 | GPIO[8] — General-purpose IO 8 |
| Broche 115 | GPIO[9] — General-purpose IO 9 |
| Broche 116 | GPIO[10] — General-purpose IO 10 |
| Broche 117 | GPIO[11] — General-purpose IO 11 |
| Broche 118 | GPIO[12] — General-purpose IO 12 |
| Broche 119 | GPIO[13] — General-purpose IO 13 |
| Broche 120 | GPIO[14] — General-purpose IO 14 |
| Broche 121 | GPIO[15] — General-purpose IO 15 |
| Broche 122 | VSS — Ground |
| Broche 123 | GPIO[16] — General-purpose IO 16 |
| Broche 124 | GPIO[17] — General-purpose IO 17 |
| Broche 125 | GPIO[18] — General-purpose IO 18 |
| Broche 126 | GPIO[19] — General-purpose IO 19 |
| Broche 127 | GPIO[20] — General-purpose IO 20 |
| Broche 128 | GPIO[21] — General-purpose IO 21 |
| Broche 129 | GPIO[22] — General-purpose IO 22 |
| Broche 130 | VDD — Core supply voltage |
| Broche 131 | VSS — Ground |
| Broche 132 | GPIO[23] — General-purpose IO 23 |
| Broche 133 | GPIO[24] — General-purpose IO 24 |
| Broche 134 | GPIO[25] — General-purpose IO 25 |
| Broche 135 | GPIO[26] — General-purpose IO 26 |
| Broche 136 | GPIO[27] — General-purpose IO 27 |
| Broche 137 | GPIO[28] — General-purpose IO 28 |
| Broche 138 | GPIO[29] — General-purpose IO 29 |
| Broche 139 | VDDPLL — PLL analog supply |
| Broche 140 | VSSPLL — PLL analog ground |
| Broche 141 | XIN — Crystal oscillator input |
| Broche 142 | XOUT — Crystal oscillator output |
| Broche 143 | RSTOUT — Reset output to peripherals |
| Broche 144 | TESTMODE — Factory test mode strap (must be tied low in normal operation) |
Applications typiques
MCF5207CAG166 convient pour 6 applications: Industrial Control and HMI Panels, Building Automation Controllers, Point-of-Sale (POS) Terminals, Networked Printers and MFPs, Embedded Gateways and Protocol Converters, Medical and Health Monitoring Devices.
Industrial Control and HMI Panels
The MCF5207CAG166 fits industrial HMI panels because its 166.67 MHz ColdFire V2 core can drive graphics frame buffers in external SDRAM while keeping latency deterministic for touch interrupts. With EBI/EMI supporting SDRAM up to 256 MB, designers allocate a working buffer for GUI rendering without taxing the CPU; for example a 320x240 QVGA frame plus touch stack fits comfortably. Three UARTs and two SPIs allow simultaneous use of a touchscreen controller, an RFID reader and a Modbus link to a PLC. The 144-LQFP package's 30 GPIOs accommodate RGB display data and key-matrix scanning without external IO expanders. Per NXP application note AN3492, the deterministic ColdFire interrupt latency simplifies handling of touch events with bounded response times.
Recommandé
Building Automation Controllers
Building automation gateways benefit from the MCF5207CAG166's combination of EBI/EMI for large protocol buffer memory and a multi-UART/SPI/I2C set for BACnet, Modbus and KNX transceivers. The 16 KB on-chip SRAM holds the real-time operating system kernel while external SDRAM (controlled via DDR or SDR interface) keeps TCP/IP stacks and packet buffers. The WDT guarantees safe recovery from network storms in unattended installations. Per the NXP MCF5207 datasheet, low-power wait and stop modes drop consumption to microamp levels for overnight idle periods. The industrial -40C to +85C range covers rooftop and basement panels common in commercial-building retrofits. Engineers pair it with external PHY chips on SPI-controlled subnets to keep the BOM cost flat while adding fieldbus capability.
Recommandé
Point-of-Sale (POS) Terminals
POS terminals need a responsive 32-bit core driving a display, a magnetic-stripe reader and an encrypted PIN-pad over UART or SPI, and the MCF5207CAG166 meets all three. Its 166.67 MHz ColdFire V2 core runs the application while DMA offloads data movement between peripherals and external SDRAM, keeping the CPU free for secure PIN handling. The 144-LQFP package's 30 GPIOs cover keypad rows, printer control, cash-drawer kick-out and external EEPROM for tamper logging. The WDT and brownout detect together meet PCI PED requirements for unattended recovery. Compared with ARM Cortex-M3 alternatives, ColdFire offers mature compiler support and deterministic interrupt response, both important for legacy retail firmware that has been field-validated for years.
Recommandé
Networked Printers and MFPs
Networked printers and multifunction peripherals (MFPs) use the MCF5207CAG166 as the main controller because of its 166.67 MHz core, large external memory window, and on-chip DMA that streams scanned data to the print engine without CPU overhead. The EBI/EMI controller connects to external SDRAM for page buffers and Flash for firmware, while UART, SPI and I2C link the scanner, print head, panel and optional Wi-Fi module. ColdFire's deterministic interrupt latency keeps motors and paper-feed control synchronized to scan/print timing, an advantage over Cortex-M3 cores with longer, more variable latencies. The 144-LQFP's 20x20 mm footprint gives ample room for the multiple power and ground pins needed for noisy stepper-motor environments. The -40C to +85C industrial range supports operation in warehouse and Kiosk enclosures.
Recommandé
Embedded Gateways and Protocol Converters
Industrial protocol gateways that translate between BACnet, Modbus, Profibus and TCP/IP run efficiently on the MCF5207CAG166 because of its 166.67 MHz core and external-memory-friendly EBI/EMI. Multiple instances of UART, SPI and I2C allow simultaneous RS-485 trunks and sensor-side buses without external muxes. The DMA controller keeps TCP/IP packet movement off the CPU so the application can run real-time protocol state machines at the millisecond cadence required by industrial control. Per the NXP datasheet, the EBI controller handles up to 256 MB of external SDRAM, sufficient to hold a TCP/IP stack plus multiple concurrent protocol buffers. Engineers choosing ColdFire over Cortex-M parts typically cite its mature ColdFire TCP/IP stack and the deterministic interrupt latency for tight control loops.
Recommandé
Medical and Health Monitoring Devices
Although not AEC-qualified, the MCF5207CAG166 fits non-life-critical medical peripherals such as patient-room infotainment terminals and bedside data-logging hubs where industrial-grade -40C to +85C operation is sufficient. The ColdFire V2 core runs UI code while DMA offloads streamed data from a sensor front-end (e.g., pulse oximeter over UART) into external SDRAM. The WDT is mandatory in medical-grade equipment for fault detection, and the part's deterministic interrupt latency simplifies safety verification compared to Cortex-M cores. The 144-LQFP package supports the number of power domains required for clean analog and digital isolation on the same PCB. Engineers pair it with external ADCs over SPI to keep the BOM footprint compact while maintaining a clear migration path to other ColdFire V2 parts.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5207CAG166 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5206ABAG166 | MCF5207CAG133 | SCF5249LAG120 | MCF54452VR266 | MCF5280CVM66J |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP (family) | 144-LQFP (family) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V4 | ColdFire V2 |
| Maximum Clock | 166.67 MHz | 166 MHz | 133 MHz | 120 MHz | 266 MHz | 66 MHz |
| On-chip SRAM | 16 KB | 16 KB | 16 KB | 96 KB | 32 KB | 8 KB |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART, USB | EBI/EMI, I2C, SPI, UART, USB, Ethernet | EBI/EMI, I2C, SPI, UART, CAN, Ethernet |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Highest frequency ColdFire V2 in 144-LQFP family at NXP last time buy (vs MCF5207CAG133)
- Larger SRAM than MCF5280CVM66J for protocol buffer caches (vs MCF5280CVM66J)
- Mature ColdFire V2 toolchain with deterministic interrupt latency (vs ARM Cortex-M3 MPUs)
Notes de conception
The MCF5207CAG166 has separate VDD/VSS power pins distributed evenly around the 144-LQFP perimeter to support high-speed digital switching. Place a 0.1 uF X7R ceramic decoupling capacitor within 5 mm of every VDD pin, plus one bulk 10-47 uF tantalum or polymer cap per supply rail near the package. The PLL supplies (VDDPLL pin 139, VSSPLL pin 140) require a dedicated ferrite bead or filter network (10 ohm + 10 nF) to keep PLL jitter below 50 ps peak-peak. Estimated: assuming 166.67 MHz core at 1.5 V Vdd, the supply current is roughly 250 mA, so the bulk capacitor must source at least 500 mA of transient current without dropping more than 50 mV.
Route the 32-bit EBI data bus and address bus in matched-length groups with 50 ohm controlled impedance; keep total bus length below 60 mm to avoid ringing at 100 MHz+ SDRAM toggles. Use a continuous ground plane on layer 2 directly under the 144-LQFP, stitching vias around the perimeter every 5 mm. SDRAM clocks (RAS, CAS, CLKOUT) require length-matched routing (within +/- 2 mm) to the matched data strobe (DQS) signals. Estimated: without matched impedance, signal integrity is degraded above 83 MHz, so SDRAM operation at 125 MHz requires strict impedance control (50 ohm +/- 10%).
Do not leave the TESTMODE pin (pin 144) floating - it must be tied directly to ground for normal operation, otherwise the device enters factory-test mode and may not boot. The RESET pin (pin 101) is active-low and requires a 10 kohm pull-up to VDD plus a 1 nF capacitor to ground to ensure clean reset signal integrity. Avoid driving RESET below -0.5 V during hot-plug events; add a Schottky clamp diode (BAT54S or equivalent) if the cable is hot-pluggable. Estimated: with proper pull-up and reset circuit, the reset edge rate stays below 1 microsecond.
The 144-LQFP has a thermal resistance theta_JA around 38 C/W on a standard 4-layer JEDEC test board. Estimated: at 250 mA core current and 1.5 V Vdd, the worst-case power dissipation is roughly 0.5 W, giving a 19 C temperature rise above ambient. For industrial -40C to +85C operation this remains safely below the 125 C junction limit. Add thermal vias to the exposed die-attach pad and a copper pour of at least 600 sq mm to keep junction temperature low in enclosed housings.
The 166.67 MHz ColdFire V2 core switches many EBI lines simultaneously, so the SDRAM clock and clock-enable pins deserve extra guarding - route them on an inner layer with GND planes above and below, and never route them adjacent to noisy GPIO switching lines. Use series damping resistors (22-33 ohm) on address and chip-select lines longer than 50 mm. The I2C lines (pins 95-96) are open-drain and must have external 4.7 kohm pull-ups to VDD; do not rely on internal pull-ups for reliable 400 kHz Fast-mode operation across temperature.
Informations de conformité
RoHS compliant and lead-free per NXP product page. REACH, halogen-free and conflict-minerals declarations were not in the verified web data and should be requested directly from NXP.
