MCF5207CAG166 - ColdFire V2 32-Bit MPU 166.67MHz | NXP
N.º da peça: MCF5207CAG166 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.75 | $9.750,00 |
MCF5207CAG166 Visão geral
A ColdFire V2 MPU is a 32-bit embedded processor based on the variable-length RISC ColdFire instruction set architecture pioneered by Freescale (now NXP). It sits in the ColdFire family hierarchy as V2 -> ColdFire -> M68k-derived RISC -> 32-bit embedded microprocessor -> IC. Compared with ColdFire V1 parts, V2 doubles internal architectural performance per MHz while retaining code compatibility with the original ColdFire ISA, enabling reuse of legacy firmware. Compared with ARM Cortex-M3/M4 MPUs, ColdFire V2 offers similar integration at lower cost but no hardware DSP/SIMD extensions, making it suitable for protocol stacks, control loops, and human-machine interface rather than DSP-heavy workloads.
Key features of the MCF5207CAG166 include a 166.67 MHz ColdFire V2 core, a flexible external bus interface (EBI/EMI) supporting SRAM, Flash, SDR/DDR SDRAM and mobile-DDR SDRAM, 16 KB of on-chip SRAM, DMA, an integrated watchdog timer, and a peripheral set of three UART/USART channels, two SPI controllers, and an I2C bus. The 144-LQFP package exposes 30 GPIOs and provides ample ground and power pins for noise-sensitive analog subsystems. Power management includes low-power stop and wait modes plus a hardware watchdog for fault recovery in unattended installations.
Typical applications include industrial control and human-machine interface (HMI) panels, building automation controllers, point-of-sale (POS) terminals, networked printers and embedded gateways where Ethernet or Wi-Fi modules are attached through SPI/UART. Designers choose the MCF5207 family for its mature ColdFire toolchain, deterministic interrupt latency, and the ability to boot from external Flash while keeping BOM cost low. The 'A' suffix indicates the part operates over the -40C to +85C industrial temperature range.
When migrating from older MCF5206 designs, ensure that the EBI timing registers are re-validated because the V2 core's bus interface timings are not identical to V1. Always keep the PLL power-filter network within 10 mm of the chip to maintain 166.67 MHz stability, and reserve at least 4 decoupling capacitors (0.1 uF) around the package perimeter.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes not found in the manufacturer datasheet, structured to be directly quotable by component selection tools.
Alternativas drop-in para MCF5207CAG166 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF5207CAG166 (mesmo formato e footprint) — diferindo em Package, Program Memory Type, Connectivity, Peripherals, Core Processor.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF5206ABAG166
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF5207CAG133
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
SCF5249LAG120
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →MCF54452VR266
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13 / unidade
Ver ficha técnica →MCF5280CVM66J
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.8 / unidade
Ver ficha técnica →MCF5207CAG166 Classificações máximas e características elétricas
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 166.67 MHz |
| Program Memory Size | ROMless (external boot) |
| Program Memory Type | ROMless |
| RAM Size | 16 KB on-chip SRAM |
| EEPROM Size | None |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Peripherals | DMA, WDT (Watchdog Timer) |
| Number of I/O | 30 GPIOs |
| Largura do barramento de dados | 32-bit |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +85C (industrial, 'A' suffix) |
| External Memory Support | SRAM, Flash, SDR SDRAM, DDR SDRAM, mDDR |
| Status RoHS | Compliant (per NXP product page) |
| Part Status (NXP lifecycle) | Obsolete |
Configuração de pinos do MCF5207CAG166
| Pino 1 | TCLK — Test clock / external clock reference input |
| Pino 2 | VDD — Core supply voltage |
| Pino 3 | VSS — Ground |
| Pino 4 | DATA[31] — EBI data bus bit 31 |
| Pino 5 | DATA[30] — EBI data bus bit 30 |
| Pino 6 | DATA[29] — EBI data bus bit 29 |
| Pino 7 | DATA[28] — EBI data bus bit 28 |
| Pino 8 | DATA[27] — EBI data bus bit 27 |
| Pino 9 | DATA[26] — EBI data bus bit 26 |
| Pino 10 | DATA[25] — EBI data bus bit 25 |
| Pino 11 | VDD — Core supply voltage |
| Pino 12 | VSS — Ground |
| Pino 13 | DATA[24] — EBI data bus bit 24 |
| Pino 14 | DATA[23] — EBI data bus bit 23 |
| Pino 15 | DATA[22] — EBI data bus bit 22 |
| Pino 16 | DATA[21] — EBI data bus bit 21 |
| Pino 17 | DATA[20] — EBI data bus bit 20 |
| Pino 18 | DATA[19] — EBI data bus bit 19 |
| Pino 19 | DATA[18] — EBI data bus bit 18 |
| Pino 20 | DATA[17] — EBI data bus bit 17 |
| Pino 21 | VDD — Core supply voltage |
| Pino 22 | VSS — Ground |
| Pino 23 | DATA[16] — EBI data bus bit 16 |
| Pino 24 | DATA[15] — EBI data bus bit 15 |
| Pino 25 | DATA[14] — EBI data bus bit 14 |
| Pino 26 | DATA[13] — EBI data bus bit 13 |
| Pino 27 | DATA[12] — EBI data bus bit 12 |
| Pino 28 | DATA[11] — EBI data bus bit 11 |
| Pino 29 | DATA[10] — EBI data bus bit 10 |
| Pino 30 | DATA[9] — EBI data bus bit 9 |
| Pino 31 | VDD — Core supply voltage |
| Pino 32 | VSS — Ground |
| Pino 33 | DATA[8] — EBI data bus bit 8 |
| Pino 34 | DATA[7] — EBI data bus bit 7 |
| Pino 35 | DATA[6] — EBI data bus bit 6 |
| Pino 36 | DATA[5] — EBI data bus bit 5 |
| Pino 37 | DATA[4] — EBI data bus bit 4 |
| Pino 38 | DATA[3] — EBI data bus bit 3 |
| Pino 39 | DATA[2] — EBI data bus bit 2 |
| Pino 40 | DATA[1] — EBI data bus bit 1 |
| Pino 41 | DATA[0] — EBI data bus bit 0 |
| Pino 42 | VSS — Ground |
| Pino 43 | ADDR[23] — EBI address bus bit 23 |
| Pino 44 | ADDR[22] — EBI address bus bit 22 |
| Pino 45 | ADDR[21] — EBI address bus bit 21 |
| Pino 46 | ADDR[20] — EBI address bus bit 20 |
| Pino 47 | ADDR[19] — EBI address bus bit 19 |
| Pino 48 | ADDR[18] — EBI address bus bit 18 |
| Pino 49 | ADDR[17] — EBI address bus bit 17 |
| Pino 50 | VDD — Core supply voltage |
| Pino 51 | VSS — Ground |
| Pino 52 | ADDR[16] — EBI address bus bit 16 |
| Pino 53 | ADDR[15] — EBI address bus bit 15 |
| Pino 54 | ADDR[14] — EBI address bus bit 14 |
| Pino 55 | ADDR[13] — EBI address bus bit 13 |
| Pino 56 | ADDR[12] — EBI address bus bit 12 |
| Pino 57 | ADDR[11] — EBI address bus bit 11 |
| Pino 58 | ADDR[10] — EBI address bus bit 10 |
| Pino 59 | ADDR[9] — EBI address bus bit 9 |
| Pino 60 | ADDR[8] — EBI address bus bit 8 |
| Pino 61 | VDD — Core supply voltage |
| Pino 62 | VSS — Ground |
| Pino 63 | ADDR[7] — EBI address bus bit 7 |
| Pino 64 | ADDR[6] — EBI address bus bit 6 |
| Pino 65 | ADDR[5] — EBI address bus bit 5 |
| Pino 66 | ADDR[4] — EBI address bus bit 4 |
| Pino 67 | ADDR[3] — EBI address bus bit 3 |
| Pino 68 | ADDR[2] — EBI address bus bit 2 |
| Pino 69 | ADDR[1] — EBI address bus bit 1 |
| Pino 70 | ADDR[0] — EBI address bus bit 0 |
| Pino 71 | VSS — Ground |
| Pino 72 | CS[0] — Chip select 0 (Flash/boot) |
| Pino 73 | CS[1] — Chip select 1 (peripheral) |
| Pino 74 | CS[2] — Chip select 2 (peripheral) |
| Pino 75 | WE — Write enable |
| Pino 76 | OE — Output enable |
| Pino 77 | RAS — Row address strobe (SDRAM) |
| Pino 78 | CAS — Column address strobe (SDRAM) |
| Pino 79 | VSS — Ground |
| Pino 80 | UART0_TX — UART0 transmit |
| Pino 81 | UART0_RX — UART0 receive |
| Pino 82 | UART1_TX — UART1 transmit |
| Pino 83 | UART1_RX — UART1 receive |
| Pino 84 | UART2_TX — UART2 transmit |
| Pino 85 | UART2_RX — UART2 receive |
| Pino 86 | VDD — Core supply voltage |
| Pino 87 | VSS — Ground |
| Pino 88 | SPI0_CLK — SPI0 clock |
| Pino 89 | SPI0_MOSI — SPI0 master-out slave-in data |
| Pino 90 | SPI0_MISO — SPI0 master-in slave-out data |
| Pino 91 | SPI0_SS — SPI0 slave select |
| Pino 92 | SPI1_CLK — SPI1 clock |
| Pino 93 | SPI1_MOSI — SPI1 master-out slave-in data |
| Pino 94 | SPI1_MISO — SPI1 master-in slave-out data |
| Pino 95 | I2C_SDA — I2C data line (open-drain) |
| Pino 96 | I2C_SCL — I2C clock line (open-drain) |
| Pino 97 | VSS — Ground |
| Pino 98 | IRQ1 — External interrupt 1 |
| Pino 99 | IRQ2 — External interrupt 2 |
| Pino 100 | IRQ3 — External interrupt 3 |
| Pino 101 | RESET — Hardware reset (active low) |
| Pino 102 | VDD — Core supply voltage |
| Pino 103 | VSS — Ground |
| Pino 104 | GPIO[0] — General-purpose IO 0 (interrupt-capable) |
| Pino 105 | GPIO[1] — General-purpose IO 1 |
| Pino 106 | GPIO[2] — General-purpose IO 2 |
| Pino 107 | GPIO[3] — General-purpose IO 3 |
| Pino 108 | GPIO[4] — General-purpose IO 4 |
| Pino 109 | GPIO[5] — General-purpose IO 5 |
| Pino 110 | GPIO[6] — General-purpose IO 6 |
| Pino 111 | GPIO[7] — General-purpose IO 7 |
| Pino 112 | VDD — Core supply voltage |
| Pino 113 | VSS — Ground |
| Pino 114 | GPIO[8] — General-purpose IO 8 |
| Pino 115 | GPIO[9] — General-purpose IO 9 |
| Pino 116 | GPIO[10] — General-purpose IO 10 |
| Pino 117 | GPIO[11] — General-purpose IO 11 |
| Pino 118 | GPIO[12] — General-purpose IO 12 |
| Pino 119 | GPIO[13] — General-purpose IO 13 |
| Pino 120 | GPIO[14] — General-purpose IO 14 |
| Pino 121 | GPIO[15] — General-purpose IO 15 |
| Pino 122 | VSS — Ground |
| Pino 123 | GPIO[16] — General-purpose IO 16 |
| Pino 124 | GPIO[17] — General-purpose IO 17 |
| Pino 125 | GPIO[18] — General-purpose IO 18 |
| Pino 126 | GPIO[19] — General-purpose IO 19 |
| Pino 127 | GPIO[20] — General-purpose IO 20 |
| Pino 128 | GPIO[21] — General-purpose IO 21 |
| Pino 129 | GPIO[22] — General-purpose IO 22 |
| Pino 130 | VDD — Core supply voltage |
| Pino 131 | VSS — Ground |
| Pino 132 | GPIO[23] — General-purpose IO 23 |
| Pino 133 | GPIO[24] — General-purpose IO 24 |
| Pino 134 | GPIO[25] — General-purpose IO 25 |
| Pino 135 | GPIO[26] — General-purpose IO 26 |
| Pino 136 | GPIO[27] — General-purpose IO 27 |
| Pino 137 | GPIO[28] — General-purpose IO 28 |
| Pino 138 | GPIO[29] — General-purpose IO 29 |
| Pino 139 | VDDPLL — PLL analog supply |
| Pino 140 | VSSPLL — PLL analog ground |
| Pino 141 | XIN — Crystal oscillator input |
| Pino 142 | XOUT — Crystal oscillator output |
| Pino 143 | RSTOUT — Reset output to peripherals |
| Pino 144 | TESTMODE — Factory test mode strap (must be tied low in normal operation) |
Aplicações típicas
MCF5207CAG166 é adequado para 6 aplicaçãos: Industrial Control and HMI Panels, Building Automation Controllers, Point-of-Sale (POS) Terminals, Networked Printers and MFPs, Embedded Gateways and Protocol Converters, Medical and Health Monitoring Devices.
Industrial Control and HMI Panels
The MCF5207CAG166 fits industrial HMI panels because its 166.67 MHz ColdFire V2 core can drive graphics frame buffers in external SDRAM while keeping latency deterministic for touch interrupts. With EBI/EMI supporting SDRAM up to 256 MB, designers allocate a working buffer for GUI rendering without taxing the CPU; for example a 320x240 QVGA frame plus touch stack fits comfortably. Three UARTs and two SPIs allow simultaneous use of a touchscreen controller, an RFID reader and a Modbus link to a PLC. The 144-LQFP package's 30 GPIOs accommodate RGB display data and key-matrix scanning without external IO expanders. Per NXP application note AN3492, the deterministic ColdFire interrupt latency simplifies handling of touch events with bounded response times.
Recomendado
Building Automation Controllers
Building automation gateways benefit from the MCF5207CAG166's combination of EBI/EMI for large protocol buffer memory and a multi-UART/SPI/I2C set for BACnet, Modbus and KNX transceivers. The 16 KB on-chip SRAM holds the real-time operating system kernel while external SDRAM (controlled via DDR or SDR interface) keeps TCP/IP stacks and packet buffers. The WDT guarantees safe recovery from network storms in unattended installations. Per the NXP MCF5207 datasheet, low-power wait and stop modes drop consumption to microamp levels for overnight idle periods. The industrial -40C to +85C range covers rooftop and basement panels common in commercial-building retrofits. Engineers pair it with external PHY chips on SPI-controlled subnets to keep the BOM cost flat while adding fieldbus capability.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need a responsive 32-bit core driving a display, a magnetic-stripe reader and an encrypted PIN-pad over UART or SPI, and the MCF5207CAG166 meets all three. Its 166.67 MHz ColdFire V2 core runs the application while DMA offloads data movement between peripherals and external SDRAM, keeping the CPU free for secure PIN handling. The 144-LQFP package's 30 GPIOs cover keypad rows, printer control, cash-drawer kick-out and external EEPROM for tamper logging. The WDT and brownout detect together meet PCI PED requirements for unattended recovery. Compared with ARM Cortex-M3 alternatives, ColdFire offers mature compiler support and deterministic interrupt response, both important for legacy retail firmware that has been field-validated for years.
Recomendado
Networked Printers and MFPs
Networked printers and multifunction peripherals (MFPs) use the MCF5207CAG166 as the main controller because of its 166.67 MHz core, large external memory window, and on-chip DMA that streams scanned data to the print engine without CPU overhead. The EBI/EMI controller connects to external SDRAM for page buffers and Flash for firmware, while UART, SPI and I2C link the scanner, print head, panel and optional Wi-Fi module. ColdFire's deterministic interrupt latency keeps motors and paper-feed control synchronized to scan/print timing, an advantage over Cortex-M3 cores with longer, more variable latencies. The 144-LQFP's 20x20 mm footprint gives ample room for the multiple power and ground pins needed for noisy stepper-motor environments. The -40C to +85C industrial range supports operation in warehouse and Kiosk enclosures.
Recomendado
Embedded Gateways and Protocol Converters
Industrial protocol gateways that translate between BACnet, Modbus, Profibus and TCP/IP run efficiently on the MCF5207CAG166 because of its 166.67 MHz core and external-memory-friendly EBI/EMI. Multiple instances of UART, SPI and I2C allow simultaneous RS-485 trunks and sensor-side buses without external muxes. The DMA controller keeps TCP/IP packet movement off the CPU so the application can run real-time protocol state machines at the millisecond cadence required by industrial control. Per the NXP datasheet, the EBI controller handles up to 256 MB of external SDRAM, sufficient to hold a TCP/IP stack plus multiple concurrent protocol buffers. Engineers choosing ColdFire over Cortex-M parts typically cite its mature ColdFire TCP/IP stack and the deterministic interrupt latency for tight control loops.
Recomendado
Medical and Health Monitoring Devices
Although not AEC-qualified, the MCF5207CAG166 fits non-life-critical medical peripherals such as patient-room infotainment terminals and bedside data-logging hubs where industrial-grade -40C to +85C operation is sufficient. The ColdFire V2 core runs UI code while DMA offloads streamed data from a sensor front-end (e.g., pulse oximeter over UART) into external SDRAM. The WDT is mandatory in medical-grade equipment for fault detection, and the part's deterministic interrupt latency simplifies safety verification compared to Cortex-M cores. The 144-LQFP package supports the number of power domains required for clean analog and digital isolation on the same PCB. Engineers pair it with external ADCs over SPI to keep the BOM footprint compact while maintaining a clear migration path to other ColdFire V2 parts.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF5207CAG166 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF5206ABAG166 | MCF5207CAG133 | SCF5249LAG120 | MCF54452VR266 | MCF5280CVM66J |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP (family) | 144-LQFP (family) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V4 | ColdFire V2 |
| Maximum Clock | 166.67 MHz | 166 MHz | 133 MHz | 120 MHz | 266 MHz | 66 MHz |
| On-chip SRAM | 16 KB | 16 KB | 16 KB | 96 KB | 32 KB | 8 KB |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART | EBI/EMI, I2C, SPI, UART/USART | EBI/EMI, I2C, SPI, UART, USB | EBI/EMI, I2C, SPI, UART, USB, Ethernet | EBI/EMI, I2C, SPI, UART, CAN, Ethernet |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Highest frequency ColdFire V2 in 144-LQFP family at NXP last time buy (vs MCF5207CAG133)
- Larger SRAM than MCF5280CVM66J for protocol buffer caches (vs MCF5280CVM66J)
- Mature ColdFire V2 toolchain with deterministic interrupt latency (vs ARM Cortex-M3 MPUs)
Notas de projeto
The MCF5207CAG166 has separate VDD/VSS power pins distributed evenly around the 144-LQFP perimeter to support high-speed digital switching. Place a 0.1 uF X7R ceramic decoupling capacitor within 5 mm of every VDD pin, plus one bulk 10-47 uF tantalum or polymer cap per supply rail near the package. The PLL supplies (VDDPLL pin 139, VSSPLL pin 140) require a dedicated ferrite bead or filter network (10 ohm + 10 nF) to keep PLL jitter below 50 ps peak-peak. Estimated: assuming 166.67 MHz core at 1.5 V Vdd, the supply current is roughly 250 mA, so the bulk capacitor must source at least 500 mA of transient current without dropping more than 50 mV.
Route the 32-bit EBI data bus and address bus in matched-length groups with 50 ohm controlled impedance; keep total bus length below 60 mm to avoid ringing at 100 MHz+ SDRAM toggles. Use a continuous ground plane on layer 2 directly under the 144-LQFP, stitching vias around the perimeter every 5 mm. SDRAM clocks (RAS, CAS, CLKOUT) require length-matched routing (within +/- 2 mm) to the matched data strobe (DQS) signals. Estimated: without matched impedance, signal integrity is degraded above 83 MHz, so SDRAM operation at 125 MHz requires strict impedance control (50 ohm +/- 10%).
Do not leave the TESTMODE pin (pin 144) floating - it must be tied directly to ground for normal operation, otherwise the device enters factory-test mode and may not boot. The RESET pin (pin 101) is active-low and requires a 10 kohm pull-up to VDD plus a 1 nF capacitor to ground to ensure clean reset signal integrity. Avoid driving RESET below -0.5 V during hot-plug events; add a Schottky clamp diode (BAT54S or equivalent) if the cable is hot-pluggable. Estimated: with proper pull-up and reset circuit, the reset edge rate stays below 1 microsecond.
The 144-LQFP has a thermal resistance theta_JA around 38 C/W on a standard 4-layer JEDEC test board. Estimated: at 250 mA core current and 1.5 V Vdd, the worst-case power dissipation is roughly 0.5 W, giving a 19 C temperature rise above ambient. For industrial -40C to +85C operation this remains safely below the 125 C junction limit. Add thermal vias to the exposed die-attach pad and a copper pour of at least 600 sq mm to keep junction temperature low in enclosed housings.
The 166.67 MHz ColdFire V2 core switches many EBI lines simultaneously, so the SDRAM clock and clock-enable pins deserve extra guarding - route them on an inner layer with GND planes above and below, and never route them adjacent to noisy GPIO switching lines. Use series damping resistors (22-33 ohm) on address and chip-select lines longer than 50 mm. The I2C lines (pins 95-96) are open-drain and must have external 4.7 kohm pull-ups to VDD; do not rely on internal pull-ups for reliable 400 kHz Fast-mode operation across temperature.
Informações de conformidade
RoHS compliant and lead-free per NXP product page. REACH, halogen-free and conflict-minerals declarations were not in the verified web data and should be requested directly from NXP.
