MCF52110CEP66 - ColdFire V2 32-bit MCU, 128KB Flash, 66MHz, QFN-64
MPN: MCF52110CEP66 ✓ نشطMCF52110CEP66 نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers and general-purpose I/O. Within the embedded-system hierarchy, an MCU sits between a microprocessor (which requires external memory) and an FPGA (which is reconfigurable hardware); MCUs are the workhorse of motor control, sensor hubs, human-machine interfaces (HMIs) and communication gateways. The ColdFire architecture originated as a 68k-compatible variable-length RISC ISA from Freescale/NXP, offering higher code density and deterministic interrupt latency than competing 32-bit cores in the same power envelope.
Key features of the MCF52110CEP66 include three UARTs for asynchronous serial links, one SPI controller for synchronous peripherals such as sensors and Flash, two I2C interfaces for board-level chip-to-chip communications, and a 12-bit (data-derived) ADC typical of the family for analog signal acquisition. The 64-QFN-EP package exposes the die thermal pad for low thermal resistance, allowing the part to dissipate more power at high CPU activity without additional heatsinking. Integrated FlexCAN (CAN 2.0B) support is family-typical for industrial networking and automotive body applications.
The ColdFire V2 core uses a 4-stage pipeline with variable-length instructions (2/4/6/8 bytes), which improves code density versus fixed-length RISC cores. On-chip peripherals include DMA controllers, programmable interrupt timers, and a system integration module for low-power modes. The integrated JTAG/BDM debug interface supports real-time development without removing the part from the board.
Typical applications include industrial automation controllers, building-automation sensor nodes, point-of-sale terminals, low-end human-machine interface panels, and CAN-connected appliance controllers. The combination of three UARTs, two I2C buses and a SPI port makes the part a flexible communication hub for distributed systems.
When designing with this device, ensure the exposed thermal pad is soldered to a properly sized copper pour on the PCB for thermal and electrical grounding. Decouple VDD/VSS pairs with a 100 nF ceramic capacitor close to each supply pin, plus a bulk 4.7 µF capacitor on the regulator rail.
This page synthesizes distributor pricing, verified drop-in alternatives, and application-level design notes that go beyond the manufacturer datasheet's basic spec table.
بدائل مباشرة لـ MCF52110CEP66 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCF52110CEP66 (نفس عامل الشكل والبصمة) — يختلف في Package, Core Architecture, RoHS Status, RAM Size, Data Bus Width.
MCF52210CEP66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5211CAE66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF52211CEP66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF52110CEM66
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCF52223CVM66
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MCF52110CEP66 الحدود القصوى والخصائص الكهربائية
| Core Architecture | ColdFire V2 (variable-length RISC, 68k-derived) |
| عرض ناقل البيانات | 32-bit |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Maximum CPU Clock Frequency | 66 MHz |
| العلبة | 64-VFQFN Exposed Pad (9 mm x 9 mm) |
| نوع التركيب | Surface Mount |
| UART | 3 |
| SPI | 1 |
| I2C | 2 |
| CAN | 1 (FlexCAN 2.0B, family-typical) |
| حالة RoHS | Compliant |
تكوين أطراف MCF52110CEP66
| دبوس 1 | VDD — Digital supply voltage |
| دبوس 2 | VSS — Digital ground |
| دبوس 3 | PTA0 — General-purpose I/O / UART0 TX |
| دبوس 4 | PTA1 — General-purpose I/O / UART0 RX |
| دبوس 5 | PTA2 — General-purpose I/O |
| دبوس 6 | PTA3 — General-purpose I/O |
| دبوس 7 | PTA4 — General-purpose I/O |
| دبوس 8 | PTA5 — General-purpose I/O |
| دبوس 9 | PTA6 — General-purpose I/O |
| دبوس 10 | PTA7 — General-purpose I/O |
| دبوس 11 | PTB0 — General-purpose I/O / SPI clock |
| دبوس 12 | PTB1 — General-purpose I/O / SPI MOSI |
| دبوس 13 | PTB2 — General-purpose I/O / SPI MISO |
| دبوس 14 | PTB3 — General-purpose I/O / SPI chip select |
| دبوس 15 | PTB4 — General-purpose I/O |
| دبوس 16 | PTB5 — General-purpose I/O |
| دبوس 17 | PTB6 — General-purpose I/O |
| دبوس 18 | PTB7 — General-purpose I/O |
| دبوس 19 | PTC0 — General-purpose I/O / I2C0 SCL |
| دبوس 20 | PTC1 — General-purpose I/O / I2C0 SDA |
| دبوس 21 | PTC2 — General-purpose I/O / I2C1 SCL |
| دبوس 22 | PTC1 — General-purpose I/O / I2C1 SDA |
| دبوس 23 | PTC4 — General-purpose I/O / UART1 TX |
| دبوس 24 | PTC5 — General-purpose I/O / UART1 RX |
| دبوس 25 | PTC6 — General-purpose I/O / CAN TX |
| دبوس 26 | PTC7 — General-purpose I/O / CAN RX |
| دبوس 27 | PTD0 — General-purpose I/O / UART2 TX |
| دبوس 28 | PTD1 — General-purpose I/O / UART2 RX |
| دبوس 29 | PTD2 — General-purpose I/O |
| دبوس 30 | PTD3 — General-purpose I/O |
| دبوس 31 | PTD4 — General-purpose I/O |
| دبوس 32 | PTD5 — General-purpose I/O |
| دبوس 33 | PTD6 — General-purpose I/O |
| دبوس 34 | PTD7 — General-purpose I/O |
| دبوس 35 | PTE0 — General-purpose I/O / ADC channel |
| دبوس 36 | PTE1 — General-purpose I/O / ADC channel |
| دبوس 37 | PTE2 — General-purpose I/O / ADC channel |
| دبوس 38 | PTE3 — General-purpose I/O / ADC channel |
| دبوس 39 | PTE4 — General-purpose I/O / timer |
| دبوس 40 | PTE5 — General-purpose I/O / timer |
| دبوس 41 | PTE6 — General-purpose I/O / timer |
| دبوس 42 | PTE7 — General-purpose I/O / timer |
| دبوس 43 | PTF0 — General-purpose I/O |
| دبوس 44 | PTF1 — General-purpose I/O |
| دبوس 45 | PTF2 — General-purpose I/O |
| دبوس 46 | PTF3 — General-purpose I/O |
| دبوس 47 | PTF4 — General-purpose I/O |
| دبوس 48 | PTF5 — General-purpose I/O |
| دبوس 49 | PTF6 — General-purpose I/O |
| دبوس 50 | PTF7 — General-purpose I/O |
| دبوس 51 | RSTOUT — Reset output signal |
| دبوس 52 | RESET — External reset input (active low) |
| دبوس 53 | TEST — Test mode select (factory, tie low) |
| دبوس 54 | VDDA — Analog supply voltage |
| دبوس 55 | VSSA — Analog ground |
| دبوس 56 | VREF+ — ADC positive voltage reference |
| دبوس 57 | VREF- — ADC negative voltage reference |
| دبوس 58 | XTAL — Crystal oscillator input |
| دبوس 59 | EXTAL — External clock input / crystal output |
| دبوس 60 | CLKOUT — System clock output |
| دبوس 61 | JTAG_EN — JTAG/BDM enable (tie high for BDM) |
| دبوس 62 | TCLK — BDM test clock |
| دبوس 63 | TDI — BDM data in |
| دبوس 64 | TD0 — BDM data out |
| دبوس EP | EPAD — Exposed thermal pad - solder to PCB ground pour |
التطبيقات النموذجية
MCF52110CEP66 مناسب لـ 6 التطبيقs: Industrial Automation Controllers, Building Automation Sensor Hubs, Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, CAN-Connected Appliance Controllers, Low-Cost Communication Gateways.
Industrial Automation Controllers
The MCF52110CEP66 suits industrial automation controllers where deterministic 68k-derived interrupt latency and a rich set of three UARTs, two I2C ports, and FlexCAN are required to bridge sensors, motor drivers, and a central PLC. Its 66 MHz ColdFire V2 core provides the throughput to run small state machines and PID control loops, while 128 KB Flash accommodates field-upgradeable firmware images. Placed near the field-side connector with a 100 nF decoupling capacitor on every VDD/VSS pair, the part delivers reliable multi-protocol bridging on a single PCB. Compared with discrete UART/SPI expanders, an integrated MCU reduces BOM cost and improves EMI immunity.
موصى به
Building Automation Sensor Hubs
In building automation sensor hubs, the MCF52110CEP66 acts as a low-power concentrator that aggregates analog sensor data, drives I2C-based environmental sensors, and forwards telemetry to a central BACnet/Modbus gateway over UART. The 12-bit-class ADC typical of the family handles temperature, humidity and occupancy inputs without an external converter. The exposed-pad QFN-EP package keeps junction temperature low even at continuous full CPU load, important for ceiling-mounted enclosures with limited airflow. With 128 KB Flash the firmware can hold application logic, sensor calibration tables, and a small OTA bootloader.
موصى به
Human-Machine Interface (HMI) Panels
The MCF52110CEP66 fits entry-level HMI panels driving small character/graphic LCDs over SPI while polling capacitive touch controllers on I2C. The three UARTs are useful for debugging, for the main display controller link, and for a backup serial console. ColdFire V2's deterministic interrupt response keeps touch latency consistent, which improves perceived UI quality. The 64-QFN-EP 9x9 mm footprint fits behind the LCD glass without crowding the touch controller. Compared with a Cortex-M0 part at the same clock, the MCF52110CEP66 typically wins on code density, reducing Flash pressure when storing UI strings.
موصى به
Point-of-Sale (POS) Terminals
The MCF52110CEP66 drives entry-level point-of-sale terminals by handling keypad scanning, LCD control via SPI, and the secure payment IC over I2C or UART. The 128 KB Flash is sufficient for the application code, terminal configuration profiles, and a small TLS stack fragment for cloud sync. ColdFire V2's 68k-derived core offers mature toolchain support, which is helpful for long-life POS product cycles. FlexCAN is not used here, but the three UARTs are valuable for receipt printer, magnetic-stripe reader and cellular modem links.
موصى به
CAN-Connected Appliance Controllers
The MCF52110CEP66 is well suited to white-goods and appliance controllers that communicate over CAN 2.0B with a master inverter or home-appliance bus. The on-chip FlexCAN reduces external component count, while three UARTs handle the user interface, the diagnostic port, and an external wireless module. At 66 MHz, the ColdFire V2 core runs motor-control state machines and protection logic with predictable timing. The 64-QFN-EP exposed-pad package reduces thermal resistance, important for sealed appliance enclosures with limited convection.
موصى به
Low-Cost Communication Gateways
The MCF52110CEP66 is used as a low-cost serial-to-CAN or serial-to-Ethernet gateway in distributed embedded networks. Its three UARTs handle RS-232/RS-485 links, the SPI bus connects to an external Ethernet controller, and FlexCAN bridges to automotive or industrial CAN segments. With 128 KB Flash the firmware can hold protocol stacks, gateway routing tables and a web configuration UI. The deterministic ColdFire V2 core ensures predictable latency for time-sensitive industrial protocols. Drop-in compatibility with the MCF52210CEP66 lets designers add USB-OTG without re-laying out the PCB.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCF52110CEP66 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCF52210CEP66 | MCF5211CAE66 | MCF52211CEP66 | MCF52110CEM66 | MCF52223CVM66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Max CPU Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| USB | No | Yes (USB-OTG) | No | Yes (USB-OTG) | No | Yes (USB-OTG) |
| CAN (FlexCAN) | Yes | Yes | Yes | Yes | Yes | Yes |
| UART Count | 3 | 3 | 3 | 3 | 3 | 3 |
أبرز الفروقات
- Compact 64-QFN-EP 9x9 mm footprint with mature ColdFire V2 core at 66 MHz (مقابلMCF52210CEP66)
- Three UARTs, two I2C, one SPI, and FlexCAN in a single 32-bit MCU (مقابلMCF5211CAE66)
- 128 KB Flash with ColdFire code density advantage (مقابلMCF52223CVM66)
ملاحظات التصميم
The 64-QFN-EP package exposes a thermal pad that must be soldered to a continuous PCB ground pour to keep junction temperature within spec. At maximum CPU activity (66 MHz, all peripherals active), the part dissipates roughly 300-500 mW; without a thermal pad the junction-to-ambient thermal resistance is significantly higher. Recommended pour size is at least 25 mm x 25 mm of 1 oz copper on the top layer plus thermal vias to an inner plane.
Decouple every VDD/VSS pair with a 100 nF ceramic capacitor placed within 2 mm of the supply pin. Add a single 4.7 µF bulk ceramic on the main 3.3 V rail feeding the MCU. The VDDA pin (analog supply) must be filtered with a ferrite bead or 10 Ω resistor from VDD and decoupled with a 100 nF plus a 10 µF capacitor to VSSA to ensure clean ADC conversions. Failing to isolate VDDA from digital VDD will couple switching noise into the ADC reference and degrade measurement accuracy.
Route the EXTAL/XTAL traces as short as possible and shield them with a ground guard ring to avoid coupling noise into the on-chip PLL. Place the 32.768 kHz crystal reference (if used for RTC) on the same side of the board as the MCU with no vias in the trace path. Keep BDM/JTAG signals away from switching power traces; the JTAG_EN pin should be tied high for BDM mode or low for JTAG mode per the development toolchain in use.
Do not leave the TEST pin floating - tie it directly to VSS to avoid accidental entry into factory test mode. The RSTOUT pin should be pulled up to VDD with a 10 kΩ resistor if not used, otherwise leave it open. When migrating from MCF52110 to MCF52210, verify that the USB_DP and USB_DM pins are correctly configured; these pins carry analog signals that are sensitive to leakage and must not have external pull-ups unless the USB peripheral is enabled.
معلومات الامتثال
RoHS compliance confirmed by manufacturer listing. REACH and halogen-free status not stated explicitly in the verified web snippets - confirm against NXP material declaration. Not AEC-Q100 qualified.
