MCF52110CEP66 - ColdFire V2 32-bit MCU, 128KB Flash, 66MHz, QFN-64
MPN： MCF52110CEP66 ✓ 啟用中MCF52110CEP66 概覽
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripherals such as timers, ADCs, communication controllers and general-purpose I/O. Within the embedded-system hierarchy, an MCU sits between a microprocessor (which requires external memory) and an FPGA (which is reconfigurable hardware); MCUs are the workhorse of motor control, sensor hubs, human-machine interfaces (HMIs) and communication gateways. The ColdFire architecture originated as a 68k-compatible variable-length RISC ISA from Freescale/NXP, offering higher code density and deterministic interrupt latency than competing 32-bit cores in the same power envelope.
Key features of the MCF52110CEP66 include three UARTs for asynchronous serial links, one SPI controller for synchronous peripherals such as sensors and Flash, two I2C interfaces for board-level chip-to-chip communications, and a 12-bit (data-derived) ADC typical of the family for analog signal acquisition. The 64-QFN-EP package exposes the die thermal pad for low thermal resistance, allowing the part to dissipate more power at high CPU activity without additional heatsinking. Integrated FlexCAN (CAN 2.0B) support is family-typical for industrial networking and automotive body applications.
The ColdFire V2 core uses a 4-stage pipeline with variable-length instructions (2/4/6/8 bytes), which improves code density versus fixed-length RISC cores. On-chip peripherals include DMA controllers, programmable interrupt timers, and a system integration module for low-power modes. The integrated JTAG/BDM debug interface supports real-time development without removing the part from the board.
Typical applications include industrial automation controllers, building-automation sensor nodes, point-of-sale terminals, low-end human-machine interface panels, and CAN-connected appliance controllers. The combination of three UARTs, two I2C buses and a SPI port makes the part a flexible communication hub for distributed systems.
When designing with this device, ensure the exposed thermal pad is soldered to a properly sized copper pour on the PCB for thermal and electrical grounding. Decouple VDD/VSS pairs with a 100 nF ceramic capacitor close to each supply pin, plus a bulk 4.7 µF capacitor on the regulator rail.
This page synthesizes distributor pricing, verified drop-in alternatives, and application-level design notes that go beyond the manufacturer datasheet's basic spec table.
直接替換替代品，適用於 MCF52110CEP66 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCF52110CEP66 （相同外形與佔位） — 差異在於 Package, Core Architecture, RoHS Status, RAM Size, Data Bus Width.
MCF52210CEP66
✅ 直接替換聯絡詢價
查看資料表 →MCF5211CAE66
✅ 直接替換聯絡詢價
查看資料表 →MCF52211CEP66
✅ 直接替換聯絡詢價
查看資料表 →MCF52110CEM66
✅ 直接替換📋 參考替代品（不在目錄中）
MCF52223CVM66
✅ 直接替換📋 參考替代品（不在目錄中）
MCF52110CEP66 最大額定值與電氣特性
| Core Architecture | ColdFire V2 (variable-length RISC, 68k-derived) |
| 資料匯流排寬度 | 32-bit |
| Program Memory Size | 128 KB (128K x 8) Flash |
| Maximum CPU Clock Frequency | 66 MHz |
| 封裝 | 64-VFQFN Exposed Pad (9 mm x 9 mm) |
| 安裝類型 | Surface Mount |
| UART | 3 |
| SPI | 1 |
| I2C | 2 |
| CAN | 1 (FlexCAN 2.0B, family-typical) |
| RoHS 狀態 | Compliant |
MCF52110CEP66 腳位配置
| 腳位 1 | VDD — Digital supply voltage |
| 腳位 2 | VSS — Digital ground |
| 腳位 3 | PTA0 — General-purpose I/O / UART0 TX |
| 腳位 4 | PTA1 — General-purpose I/O / UART0 RX |
| 腳位 5 | PTA2 — General-purpose I/O |
| 腳位 6 | PTA3 — General-purpose I/O |
| 腳位 7 | PTA4 — General-purpose I/O |
| 腳位 8 | PTA5 — General-purpose I/O |
| 腳位 9 | PTA6 — General-purpose I/O |
| 腳位 10 | PTA7 — General-purpose I/O |
| 腳位 11 | PTB0 — General-purpose I/O / SPI clock |
| 腳位 12 | PTB1 — General-purpose I/O / SPI MOSI |
| 腳位 13 | PTB2 — General-purpose I/O / SPI MISO |
| 腳位 14 | PTB3 — General-purpose I/O / SPI chip select |
| 腳位 15 | PTB4 — General-purpose I/O |
| 腳位 16 | PTB5 — General-purpose I/O |
| 腳位 17 | PTB6 — General-purpose I/O |
| 腳位 18 | PTB7 — General-purpose I/O |
| 腳位 19 | PTC0 — General-purpose I/O / I2C0 SCL |
| 腳位 20 | PTC1 — General-purpose I/O / I2C0 SDA |
| 腳位 21 | PTC2 — General-purpose I/O / I2C1 SCL |
| 腳位 22 | PTC1 — General-purpose I/O / I2C1 SDA |
| 腳位 23 | PTC4 — General-purpose I/O / UART1 TX |
| 腳位 24 | PTC5 — General-purpose I/O / UART1 RX |
| 腳位 25 | PTC6 — General-purpose I/O / CAN TX |
| 腳位 26 | PTC7 — General-purpose I/O / CAN RX |
| 腳位 27 | PTD0 — General-purpose I/O / UART2 TX |
| 腳位 28 | PTD1 — General-purpose I/O / UART2 RX |
| 腳位 29 | PTD2 — General-purpose I/O |
| 腳位 30 | PTD3 — General-purpose I/O |
| 腳位 31 | PTD4 — General-purpose I/O |
| 腳位 32 | PTD5 — General-purpose I/O |
| 腳位 33 | PTD6 — General-purpose I/O |
| 腳位 34 | PTD7 — General-purpose I/O |
| 腳位 35 | PTE0 — General-purpose I/O / ADC channel |
| 腳位 36 | PTE1 — General-purpose I/O / ADC channel |
| 腳位 37 | PTE2 — General-purpose I/O / ADC channel |
| 腳位 38 | PTE3 — General-purpose I/O / ADC channel |
| 腳位 39 | PTE4 — General-purpose I/O / timer |
| 腳位 40 | PTE5 — General-purpose I/O / timer |
| 腳位 41 | PTE6 — General-purpose I/O / timer |
| 腳位 42 | PTE7 — General-purpose I/O / timer |
| 腳位 43 | PTF0 — General-purpose I/O |
| 腳位 44 | PTF1 — General-purpose I/O |
| 腳位 45 | PTF2 — General-purpose I/O |
| 腳位 46 | PTF3 — General-purpose I/O |
| 腳位 47 | PTF4 — General-purpose I/O |
| 腳位 48 | PTF5 — General-purpose I/O |
| 腳位 49 | PTF6 — General-purpose I/O |
| 腳位 50 | PTF7 — General-purpose I/O |
| 腳位 51 | RSTOUT — Reset output signal |
| 腳位 52 | RESET — External reset input (active low) |
| 腳位 53 | TEST — Test mode select (factory, tie low) |
| 腳位 54 | VDDA — Analog supply voltage |
| 腳位 55 | VSSA — Analog ground |
| 腳位 56 | VREF+ — ADC positive voltage reference |
| 腳位 57 | VREF- — ADC negative voltage reference |
| 腳位 58 | XTAL — Crystal oscillator input |
| 腳位 59 | EXTAL — External clock input / crystal output |
| 腳位 60 | CLKOUT — System clock output |
| 腳位 61 | JTAG_EN — JTAG/BDM enable (tie high for BDM) |
| 腳位 62 | TCLK — BDM test clock |
| 腳位 63 | TDI — BDM data in |
| 腳位 64 | TD0 — BDM data out |
| 腳位 EP | EPAD — Exposed thermal pad - solder to PCB ground pour |
典型應用
MCF52110CEP66 適用於 6 應用s: Industrial Automation Controllers, Building Automation Sensor Hubs, Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, CAN-Connected Appliance Controllers, Low-Cost Communication Gateways.
Industrial Automation Controllers
The MCF52110CEP66 suits industrial automation controllers where deterministic 68k-derived interrupt latency and a rich set of three UARTs, two I2C ports, and FlexCAN are required to bridge sensors, motor drivers, and a central PLC. Its 66 MHz ColdFire V2 core provides the throughput to run small state machines and PID control loops, while 128 KB Flash accommodates field-upgradeable firmware images. Placed near the field-side connector with a 100 nF decoupling capacitor on every VDD/VSS pair, the part delivers reliable multi-protocol bridging on a single PCB. Compared with discrete UART/SPI expanders, an integrated MCU reduces BOM cost and improves EMI immunity.
推薦
Building Automation Sensor Hubs
In building automation sensor hubs, the MCF52110CEP66 acts as a low-power concentrator that aggregates analog sensor data, drives I2C-based environmental sensors, and forwards telemetry to a central BACnet/Modbus gateway over UART. The 12-bit-class ADC typical of the family handles temperature, humidity and occupancy inputs without an external converter. The exposed-pad QFN-EP package keeps junction temperature low even at continuous full CPU load, important for ceiling-mounted enclosures with limited airflow. With 128 KB Flash the firmware can hold application logic, sensor calibration tables, and a small OTA bootloader.
推薦
Human-Machine Interface (HMI) Panels
The MCF52110CEP66 fits entry-level HMI panels driving small character/graphic LCDs over SPI while polling capacitive touch controllers on I2C. The three UARTs are useful for debugging, for the main display controller link, and for a backup serial console. ColdFire V2's deterministic interrupt response keeps touch latency consistent, which improves perceived UI quality. The 64-QFN-EP 9x9 mm footprint fits behind the LCD glass without crowding the touch controller. Compared with a Cortex-M0 part at the same clock, the MCF52110CEP66 typically wins on code density, reducing Flash pressure when storing UI strings.
推薦
Point-of-Sale (POS) Terminals
The MCF52110CEP66 drives entry-level point-of-sale terminals by handling keypad scanning, LCD control via SPI, and the secure payment IC over I2C or UART. The 128 KB Flash is sufficient for the application code, terminal configuration profiles, and a small TLS stack fragment for cloud sync. ColdFire V2's 68k-derived core offers mature toolchain support, which is helpful for long-life POS product cycles. FlexCAN is not used here, but the three UARTs are valuable for receipt printer, magnetic-stripe reader and cellular modem links.
推薦
CAN-Connected Appliance Controllers
The MCF52110CEP66 is well suited to white-goods and appliance controllers that communicate over CAN 2.0B with a master inverter or home-appliance bus. The on-chip FlexCAN reduces external component count, while three UARTs handle the user interface, the diagnostic port, and an external wireless module. At 66 MHz, the ColdFire V2 core runs motor-control state machines and protection logic with predictable timing. The 64-QFN-EP exposed-pad package reduces thermal resistance, important for sealed appliance enclosures with limited convection.
推薦
Low-Cost Communication Gateways
The MCF52110CEP66 is used as a low-cost serial-to-CAN or serial-to-Ethernet gateway in distributed embedded networks. Its three UARTs handle RS-232/RS-485 links, the SPI bus connects to an external Ethernet controller, and FlexCAN bridges to automotive or industrial CAN segments. With 128 KB Flash the firmware can hold protocol stacks, gateway routing tables and a web configuration UI. The deterministic ColdFire V2 core ensures predictable latency for time-sensitive industrial protocols. Drop-in compatibility with the MCF52210CEP66 lets designers add USB-OTG without re-laying out the PCB.
推薦
推薦產品摘要
工程參考資料，適用於 MCF52110CEP66 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCF52210CEP66 | MCF5211CAE66 | MCF52211CEP66 | MCF52110CEM66 | MCF52223CVM66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Max CPU Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| USB | No | Yes (USB-OTG) | No | Yes (USB-OTG) | No | Yes (USB-OTG) |
| CAN (FlexCAN) | Yes | Yes | Yes | Yes | Yes | Yes |
| UART Count | 3 | 3 | 3 | 3 | 3 | 3 |
主要差異化特點
- Compact 64-QFN-EP 9x9 mm footprint with mature ColdFire V2 core at 66 MHz (對比MCF52210CEP66)
- Three UARTs, two I2C, one SPI, and FlexCAN in a single 32-bit MCU (對比MCF5211CAE66)
- 128 KB Flash with ColdFire code density advantage (對比MCF52223CVM66)
設計說明
The 64-QFN-EP package exposes a thermal pad that must be soldered to a continuous PCB ground pour to keep junction temperature within spec. At maximum CPU activity (66 MHz, all peripherals active), the part dissipates roughly 300-500 mW; without a thermal pad the junction-to-ambient thermal resistance is significantly higher. Recommended pour size is at least 25 mm x 25 mm of 1 oz copper on the top layer plus thermal vias to an inner plane.
Decouple every VDD/VSS pair with a 100 nF ceramic capacitor placed within 2 mm of the supply pin. Add a single 4.7 µF bulk ceramic on the main 3.3 V rail feeding the MCU. The VDDA pin (analog supply) must be filtered with a ferrite bead or 10 Ω resistor from VDD and decoupled with a 100 nF plus a 10 µF capacitor to VSSA to ensure clean ADC conversions. Failing to isolate VDDA from digital VDD will couple switching noise into the ADC reference and degrade measurement accuracy.
Route the EXTAL/XTAL traces as short as possible and shield them with a ground guard ring to avoid coupling noise into the on-chip PLL. Place the 32.768 kHz crystal reference (if used for RTC) on the same side of the board as the MCU with no vias in the trace path. Keep BDM/JTAG signals away from switching power traces; the JTAG_EN pin should be tied high for BDM mode or low for JTAG mode per the development toolchain in use.
Do not leave the TEST pin floating - tie it directly to VSS to avoid accidental entry into factory test mode. The RSTOUT pin should be pulled up to VDD with a 10 kΩ resistor if not used, otherwise leave it open. When migrating from MCF52110 to MCF52210, verify that the USB_DP and USB_DM pins are correctly configured; these pins carry analog signals that are sensitive to leakage and must not have external pull-ups unless the USB peripheral is enabled.
合規資訊
RoHS compliance confirmed by manufacturer listing. REACH and halogen-free status not stated explicitly in the verified web snippets - confirm against NXP material declaration. Not AEC-Q100 qualified.
