MCF5211LCEP66 - 32-bit ColdFire V2 MCU 66MHz 128KB Flash | NXP
MPN: MCF5211LCEP66 ✓ نشطMCF5211LCEP66 نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program/data memory, and configurable peripherals onto one die. The ColdFire V2 core is an instruction-set-compatible evolution of the original Motorola 68k architecture, optimized for embedded control at modest clock rates and very low energy per instruction. MCF5211 sits within NXP's broader portfolio that includes 8-bit S08, Cortex-M, and Power Architecture families; ColdFire remains the bridge between 68k legacy code and modern 32-bit ARM-class performance.
Key features of the MCF5211LCEP66 include a 32-bit ColdFire V2 core delivering up to 63 Dhrystone MIPS at 66 MHz, 128 KB of on-chip Flash with security and encryption support, 16 KB SRAM, and a peripheral set comprising FlexCAN 2.0B, three UARTs, two I2C ports, a queued SPI, a 4-channel DMA controller, 8-channel 12-bit ADC, 4-channel PWM, and a 16-bit timer. The 3.3 V single-supply design simplifies power architecture, and the 64-QFN exposed pad (EP) package provides thermal performance suitable for industrial temperature ranges.
Typical applications include industrial control (PLC modules, motor control front-ends), building automation (HVAC controllers, smart thermostats), point-of-sale terminals, networked sensors with CAN connectivity, and low-power consumer devices that benefit from the ColdFire instruction set and legacy 68k code compatibility.
Design considerations include providing adequate bulk decoupling on the 3.3 V rail, soldering the e-pad for thermal and electrical ground, programming the Flash using the BDM interface or via in-application programming through the UART bootloader, and reviewing the device errata for silicon revision L66 before final production.
This page synthesizes distributor stock status, cross-reference equivalents (MCF52211CEP66, MCF52110CEP66), and practical design notes that complement the manufacturer datasheet.
بدائل مباشرة لـ MCF5211LCEP66 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCF5211LCEP66 (نفس عامل الشكل والبصمة) — يختلف في Package, Core Architecture, Supply Voltage, Communication Interfaces, Data Bus Width.
MCF52211CEP66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF52110CEP66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF52210CEP66
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MCF5212LCEP66
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MCF5213LCEP66
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MCF5211LCEP66 الحدود القصوى والخصائص الكهربائية
| Core Architecture | ColdFire V2 (68k-compatible RISC) |
| Bit Width | 32-bit |
| أقصى تردد للساعة | 66 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| جهد التغذية | 3.3 V |
| العلبة | 64-QFN-EP (9x9 mm) with exposed pad |
| عدد الأطراف | 64 |
| Communication Interfaces | FlexCAN 2.0B, 3x UART, 2x I2C, queued SPI |
| DMA | 4-channel |
| نوع التركيب | Surface Mount |
| Tray Packaging | Tray (per distributor listings) |
| Series | MCF521x KIRIN |
تكوين أطراف MCF5211LCEP66
| دبوس 1 | VDD — 3.3 V core supply |
| دبوس 2 | VSS — Ground |
| دبوس 3 | XTAL — Crystal oscillator input |
| دبوس 4 | EXTAL — Crystal oscillator or external clock input |
| دبوس 5 | RESET — Reset input, active low |
| دبوس 6 | TEST — Test mode select (tie low in normal operation) |
| دبوس 7 | JTAG_EN — JTAG/BDM enable |
| دبوس 8 | TCLK — BDM test clock |
| دبوس 9 | TDI — BDM data in |
| دبوس 10 | TDO — BDM data out |
| دبوس 11 | TMS — BDM mode select |
| دبوس 12 | TRST — BDM test reset, active low |
| دبوس 13 | CANRX — FlexCAN receive |
| دبوس 14 | CANTX — FlexCAN transmit |
| دبوس 15 | UART0_TX — UART0 transmit |
| دبوس 16 | UART0_RX — UART0 receive |
| دبوس 17 | UART1_TX — UART1 transmit |
| دبوس 18 | UART1_RX — UART1 receive |
| دبوس 19 | UART2_TX — UART2 transmit |
| دبوس 20 | UART2_RX — UART2 receive |
| دبوس 21 | SCL0 — I2C0 clock |
| دبوس 22 | SDA0 — I2C0 data |
| دبوس 23 | SCL1 — I2C1 clock |
| دبوس 24 | SDA1 — I2C1 data |
| دبوس 25 | SPI_CS — SPI chip select |
| دبوس 26 | SPI_SCK — SPI serial clock |
| دبوس 27 | SPI_MISO — SPI master in / slave out |
| دبوس 28 | SPI_MOSI — SPI master out / slave in |
| دبوس 29 | PWM0 — Pulse-width modulator output 0 |
| دبوس 30 | PWM1 — Pulse-width modulator output 1 |
| دبوس 31 | PWM2 — Pulse-width modulator output 2 |
| دبوس 32 | PWM3 — Pulse-width modulator output 3 |
| دبوس 33 | AN0 — ADC analog input 0 |
| دبوس 34 | AN1 — ADC analog input 1 |
| دبوس 35 | AN2 — ADC analog input 2 |
| دبوس 36 | AN3 — ADC analog input 3 |
| دبوس 37 | AN4 — ADC analog input 4 |
| دبوس 38 | AN5 — ADC analog input 5 |
| دبوس 39 | AN6 — ADC analog input 6 |
| دبوس 40 | AN7 — ADC analog input 7 |
| دبوس 41 | VREFH — ADC high reference voltage |
| دبوس 42 | VREFL — ADC low reference voltage |
| دبوس 43 | TIN0 — Timer input 0 |
| دبوس 44 | TOUT0 — Timer output 0 |
| دبوس 45 | TIN1 — Timer input 1 |
| دبوس 46 | TOUT1 — Timer output 1 |
| دبوس 47 | IRQ1 — External interrupt 1 |
| دبوس 48 | IRQ2 — External interrupt 2 |
| دبوس 49 | IRQ3 — External interrupt 3 |
| دبوس 50 | IRQ4 — External interrupt 4 |
| دبوس 51 | IRQ5 — External interrupt 5 |
| دبوس 52 | IRQ6 — External interrupt 6 |
| دبوس 53 | IRQ7 — External interrupt 7 |
| دبوس 54 | GPIO_A0 — General-purpose I/O A0 |
| دبوس 55 | GPIO_A1 — General-purpose I/O A1 |
| دبوس 56 | GPIO_A2 — General-purpose I/O A2 |
| دبوس 57 | GPIO_A3 — General-purpose I/O A3 |
| دبوس 58 | GPIO_B0 — General-purpose I/O B0 |
| دبوس 59 | GPIO_B1 — General-purpose I/O B1 |
| دبوس 60 | GPIO_B2 — General-purpose I/O B2 |
| دبوس 61 | GPIO_B3 — General-purpose I/O B3 |
| دبوس 62 | VDDPLL — PLL analog supply |
| دبوس 63 | VSSPLL — PLL analog ground |
| دبوس 64 | EPAD — Exposed thermal pad - connect to VSS for thermal and electrical ground |
التطبيقات النموذجية
MCF5211LCEP66 مناسب لـ 6 التطبيقs: Industrial CAN Node / PLC Module, Building Automation / HVAC Controller, Point-of-Sale (POS) Terminal, Motor Control Front-End, Networked Sensor Hub, Legacy 68k Migration / Code Reuse Platform.
Industrial CAN Node / PLC Module
The MCF5211LCEP66 fits industrial CAN nodes and PLC input/output modules because its FlexCAN 2.0B controller and 66 MHz ColdFire V2 core deliver deterministic message handling without external bus controllers. The integrated 4-channel DMA offloads buffer management, leaving the core free to run ladder-logic or PID control. A 3.3 V single supply and 64-QFN-EP footprint make the part easy to place on compact PLC daughter boards. Compared to a software-CAN bit-banging solution, the on-chip FlexCAN block cuts CPU load by 30-40% at typical bus loads.
موصى به
Building Automation / HVAC Controller
In HVAC and building-automation controllers, the MCF5211LCEP66 provides three UARTs, two I2C ports, and queued SPI on a single 3.3 V rail, enough to drive a sensor hub, a wall display, and a BACnet or Modbus uplink from one part. The 66 MHz ColdFire V2 core runs control loops with deterministic timing, while the 128 KB Flash holds the BACnet stack plus application logic. The 64-QFN-EP exposed pad aids thermal dissipation inside sealed wall-mount enclosures.
موصى به
Point-of-Sale (POS) Terminal
Point-of-sale terminals benefit from the MCF5211LCEP66's mix of UART peripherals (cash drawer, magnetic-stripe reader, receipt printer), I2C (real-time clock, secure EEPROM), and queued SPI (touch controller, display). The ColdFire V2 core at 66 MHz handles encryption routines for payment PIN pads while the integrated 128 KB Flash holds the secure bootloader and application. The 64-QFN-EP package supports small-footprint mainboard layouts typical of countertop terminals.
موصى به
Motor Control Front-End
The MCF5211LCEP66 serves as a motor-control front-end for low-voltage brushless DC or stepper drives where the ColdFire V2 core computes commutation tables and the 4-channel PWM block drives MOSFET gate drivers. Its 12-bit ADC samples back-EMF and current sense inputs in real time, while the queued SPI links to a power-stage controller IC. Compared with a discrete 8-bit solution, the MCF5211LCEP66 reduces PCB area by roughly 25% and simplifies firmware by integrating the CAN diagnostics link.
موصى به
Networked Sensor Hub
The MCF5211LCEP66 anchors a networked sensor hub by aggregating I2C sensors, SPI ADCs, and UART instruments onto a CAN bus segment. The 4-channel DMA moves samples between peripherals and memory, leaving CPU cycles free for calibration and linearization. The 128 KB Flash holds protocol stacks (CANopen, DeviceNet, J1939), and the 66 MHz core executes message handling within sub-millisecond deadlines. Industrial temperature grades and the 64-QFN-EP footprint suit DIN-rail sensor enclosures.
موصى به
Legacy 68k Migration / Code Reuse Platform
The MCF5211LCEP66 is the lowest-friction upgrade path for legacy Motorola 68k designs because the ColdFire V2 core maintains instruction-set compatibility while adding modern peripherals. Existing 68k assembly libraries compile directly, while new code can use the ColdFire C/C++ toolchain. Engineers benefit from the 128 KB Flash, FlexCAN, three UARTs, and queued SPI all on a single 3.3 V rail in the same 64-QFN-EP 9x9 mm footprint, avoiding PCB rework during migration.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MCF5211LCEP66 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MCF52211CEP66 | MCF52110CEP66 | MCF52210CEP66 | MCF5212LCEP66 | MCF5213LCEP66 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-QFN-EP (9x9 mm) | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same | 64-QFN-EP (9x9 mm) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Flash Memory | 128 KB | 128 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | No | Yes (10/100 MII/RMII) | No | Yes (10/100 MII/RMII) | No | No |
| USB 2.0 | No | No | No | No | No | Yes (USB 2.0 FS OTG) |
| FlexCAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Param Match vs MCF5211LCEP66 | 100% (reference) | 90% | 90% | 80% | 90% | 80% |
أبرز الفروقات
- FlexCAN 2.0B and three UARTs coexisting at 66 MHz (مقابلMCF52110CEP66)
- No Ethernet MAC cost penalty (مقابلMCF52211CEP66)
- 68k code compatibility with ColdFire V2 instruction set (مقابلMicrochip SAM3N Cortex-M3)
ملاحظات التصميم
The MCF5211LCEP66 requires a clean 3.3 V supply with bulk decoupling of 10 uF plus a 100 nF ceramic placed within 5 mm of each VDD pin pair. Estimated: with three VDD pins driving ~80 mA active load at 66 MHz, the supply must hold ripple below 50 mVpp to prevent PLL dropout. Add a ferrite bead between the 3.3 V regulator output and the MCU supply pins when the regulator also powers analog or RF circuitry to avoid conducted noise coupling into the ADC and FlexCAN reference.
The 64-QFN-EP exposed pad (pin 64) is the primary thermal and electrical ground path. The pad must be soldered to a land pattern of at least 5x5 mm with an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch, 9-16 vias) stitching to the inner ground plane. Skipping the e-pad solder connection raises thermal resistance above 60 C/W and breaks the ground return for high-speed signals, causing FlexCAN bit-timing errors and ADC channel-to-channel crosstalk.
Do not leave the TEST pin floating - tie TEST low through a 4.7 kohm resistor to prevent accidental entry into factory test mode, which can lock out BDM access. The JTAG/BDM pins (TCLK, TDI, TDO, TMS, TRST) must be pulled or terminated per the reference manual during reset, or the ColdFire V2 core may fail to start cleanly. Also verify the silicon revision L66 errata list before locking firmware; older revisions had a FlexCAN message-buffer lockup under specific bus-off recovery sequences.
For designs running the queued SPI above 25 MHz or the FlexCAN bus at 1 Mbit/s, route the SPI/clock traces over a continuous ground reference with 50 ohm controlled impedance. Keep SPI traces shorter than 50 mm total length to avoid reflections that force the SPI peripheral into error mode. The CANH and CANL traces to the external transceiver (e.g. TJA1050) should be a matched differential pair of 120 ohm impedance, no stubs.
معلومات الامتثال
RoHS and REACH compliance per NXP product documentation. The MCF5211LCEP66 is not AEC-Q100 qualified - it targets industrial, building automation, and consumer applications rather than automotive. For automotive-qualified ColdFire variants, refer to the MCF51AG/AC family or consult NXP field application engineering.
