MWCT1200CFM - 5W Multi-Coil Wireless Charging Tx IC | NXP
MPN: MWCT1200CFM ✗ انتهى عمره الإنتاجيMWCT1200CFM نظرة عامة
What is a wireless charging transmitter IC? A wireless charging transmitter IC (PMIC) is a specialized power management unit that drives a transmitter coil to deliver energy to a Qi-compliant receiver through resonant inductive coupling. The transmitter sits inside the category hierarchy: PMIC -> power management IC -> wireless power transmitter -> semiconductor. It is responsible for half-bridge or full-bridge coil driving, closed-loop current regulation based on Qi protocol packets, digital demodulation of load-modulated messages from the receiver, and safety functions such as over-temperature, over-current, and foreign object detection.
Key features of the MWCT1200CFM include support for multi-coil topologies (enabling flexible positioning on the charging surface), an integrated digital demodulation engine that decodes Qi-compliant communication packets without an external ADC, built-in FSK/ASK modulation support, and adjustable output power up to 5 W. The device exposes an I²C interface for configuration and telemetry and includes an integrated gate driver for the external power stage.
Technically, the MWCT1200CFM runs an embedded Qi state machine on an on-chip Cortex-M0 core, which decodes Qi protocol packets received through the coil sense path. The digital demodulation block performs amplitude-shift keying (ASK) decoding at typical Qi packet rates of 2 kbps and supports frequency-shift keying (FSK) reverse communication. The device also includes a proprietary foreign object detection algorithm that measures Q-factor changes before and during power transfer to identify metallic debris.
Typical applications include 5 W single-coil charging pads, 5 W multi-coil free-positioning pads, Qi-compliant charging stands for mobile phones and wearables, and embedded charging modules in furniture or automotive center-console surfaces. The multi-coil support enables placement tolerance that is significantly wider than single-coil designs.
When designing with this device, the engineer should follow NXP's reference design RDGDK1200 closely and route the differential coil-sense traces symmetrically. The PCB thermal pad must be soldered to a continuous ground pour to keep junction temperature within the -40 °C to +85 °C operating range during sustained 5 W power delivery.
This page synthesizes distributor pricing, drop-in alternative availability, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ MWCT1200CFM — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MWCT1200CFM (نفس عامل الشكل والبصمة) — يختلف في Communication Protocol, Package, Topology.
MWCT1100CFM
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MWCT1000CFM
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MWCT1201CFM
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MWCT1300CFM
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MAX77950EWX+T
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MWCT1200CFM المواصفات
| الوظيفة | Wireless Power Transmitter PMIC |
| Output Power | 5 W |
| البنية الطوبولوجية | Multi-coil |
| جهد التغذية | 2.7 V to 3.6 V |
| تيار التغذية | 300 µA |
| Communication Protocol | WPC Qi A5/A11 |
| Modulation | ASK/FSK demodulation |
| Foreign Object Detection | Yes (Q-factor based) |
| العلبة | 32-HVQFN (5x5 mm) wettable flank |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40 °C to +85 °C |
| Standard Package Quantity | 490 (Tray) |
| Minimum Order Quantity | 2450 (5 trays) |
| Lead Time | 39 weeks |
| حالة RoHS | Compliant |
تكوين أطراف MWCT1200CFM
| دبوس 1 | COIL_P — Differential coil-sense input (positive) |
| دبوس 2 | COIL_N — Differential coil-sense input (negative) |
| دبوس 3 | GND — Ground |
| دبوس 4 | DRV_H — Half-bridge high-side gate driver output |
| دبوس 5 | DRV_L — Half-bridge low-side gate driver output |
| دبوس 6 | BST — Bootstrap supply for high-side driver |
| دبوس 7 | VDD — 3.3 V supply input |
| دبوس 8 | GND — Ground |
| دبوس 9 | EN — Enable (active high) |
| دبوس 10 | SDA — I²C data |
| دبوس 11 | SCL — I²C clock |
| دبوس 12 | INT — Interrupt output (active low) |
| دبوس 13 | GND — Ground |
| دبوس 14 | LED1 — Status LED driver 1 |
| دبوس 15 | LED2 — Status LED driver 2 |
| دبوس 16 | TS — Temperature sense input |
| دبوس 17 | VREF — Internal reference voltage |
| دبوس 18 | GND — Ground |
| دبوس 19 | MUX_A — Coil multiplexer select A |
| دبوس 20 | MUX_B — Coil multiplexer select B |
| دبوس 21 | MUX_C — Coil multiplexer select C |
| دبوس 22 | GND — Ground |
| دبوس 23 | CS_P — Current sense input (positive) |
| دبوس 24 | CS_N — Current sense input (negative) |
| دبوس 25 | RESET — Reset input (active low) |
| دبوس 26 | VDD — 3.3 V supply input |
| دبوس 27 | GND — Ground |
| دبوس 28 | TEST1 — Factory test pin (leave NC) |
| دبوس 29 | TEST2 — Factory test pin (leave NC) |
| دبوس 30 | NC — Not connected (per datasheet) |
| دبوس 31 | NC — Not connected (per datasheet) |
| دبوس 32 | EP — Exposed thermal pad (connect to GND) |
التطبيقات النموذجية
MWCT1200CFM مناسب لـ 6 التطبيقs: Single-Coil Qi Charging Pad, Multi-Coil Free-Positioning Charging Pad, Qi Charging Stand (Mobile Phone), Embedded Furniture Charging Module, Wearable Charging Cradle, Industrial 5 W Wireless Power Module.
Single-Coil Qi Charging Pad
The MWCT1200CFM directly drives a single Qi A5/A11 transmitter coil at 5 W output power, providing a complete charging-pad solution in the 32-HVQFN package. The device integrates ASK/FSK demodulation, eliminating the external microcontroller that legacy Qi designs required. The 300 µA quiescent current keeps standby power well below 100 mW, satisfying Energy Star standby requirements. With the on-chip FOD algorithm monitoring Q-factor shifts, the pad safely rejects metallic debris before power transfer starts.
موصى به
Multi-Coil Free-Positioning Charging Pad
The MWCT1200CFM's integrated coil multiplexer natively drives up to three transmitter coils, enabling a free-positioning charging surface where phones can be placed anywhere on the pad. Each coil is sequentially scanned for a Qi-compliant receiver, then selected by the on-chip mux once a load is detected. The 5 W output, ASK/FSK demodulation, and Q-factor FOD combine to deliver a robust consumer charging experience with wide placement tolerance and safe operation.
موصى به
Qi Charging Stand (Mobile Phone)
In a vertical charging-stand form factor, the MWCT1200CFM drives a single 5 W coil angled at 15-30° to align with the phone's receiver coil. The 5 mm × 5 mm 32-HVQFN footprint fits easily behind the stand's PCB, and the exposed thermal pad couples to a small copper pour for sustained 5 W operation. The on-chip Qi state machine handles the entire ping-identify-configure-power handshake without external code, simplifying firmware development.
موصى به
Embedded Furniture Charging Module
For tables and nightstands with integrated Qi charging, the MWCT1200CFM provides the complete transmitter functionality in a single chip. The 2.7 V to 3.6 V supply accepts a 3.3 V rail derived from a USB-C 5 V input, and the I²C interface allows a host MCU to monitor charging status or drive LED indicators. The Q-factor FOD ensures the device never energizes when coins, keys, or foil are placed on the surface, meeting furniture-safety standards.
موصى به
Wearable Charging Cradle
Smartwatch and hearable charging cradles use small-form-factor Qi transmitters where the MWCT1200CFM's 32-HVQFN package delivers full Qi compliance in minimal PCB area. The low 300 µA quiescent current extends cradle standby time when paired with battery-powered hosts. The on-chip FOD protects the small metal pins used to align the wearable from being falsely detected as foreign objects.
موصى به
Industrial 5 W Wireless Power Module
Industrial sensor and HMI panels benefit from wireless power to eliminate connector wear. The MWCT1200CFM provides 5 W Qi-compliant power with the -40 °C to +85 °C industrial temperature range. The 32-HVQFN's wettable flank package supports automated optical inspection (AOI) on industrial assembly lines. The I²C interface enables predictive maintenance telemetry on coil health and power delivery efficiency.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MWCT1200CFM — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MWCT1100CFM | MWCT1000CFM | MWCT1201CFM | MWCT1300CFM | MAX77950EWX+T |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Maxim Integrated |
| Package | 32-HVQFN (5x5 mm) | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | QFN-30 - different pinout |
| Output Power | 5 W | 3 W | 5 W | 5 W | 5 W | 5 W |
| Topology | Multi-coil | Single-coil | Single-coil | Multi-coil | Multi-coil | Single-coil |
| Qi Standard | Qi 1.2 (A5/A11) | Qi 1.2 | Qi 1.2 | Qi 1.2 | Qi 1.3 | Qi 1.2 |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 3.0 V to 5.5 V |
| FSK Modulation | Yes | Yes | Yes | Yes | Yes | No |
| Foreign Object Detection | Yes (Q-factor based) | Yes | Yes | Yes | Yes (improved) | Yes (loss-based) |
| Lifecycle Status | NRND | NRND | NRND | Active | Active | Active |
أبرز الفروقات
- Multi-coil support integrated (مقابلMWCT1000CFM)
- Higher output power rating (مقابلMWCT1100CFM)
- Native Qi 1.2 compliance with FSK (مقابلMAX77950EWX+T)
- Qi 1.3 upgrade path in same family (مقابلMWCT1300CFM)
ملاحظات التصميم
At 5 W output and 90% coil-to-load efficiency, the MWCT1200CFM must dissipate approximately 0.5 W internally plus drive losses in the external half-bridge. Solder the exposed thermal pad (pin 32) to a continuous ground copper pour of at least 100 mm² on top and inner layers. Without adequate copper, junction temperature can exceed 100 °C during sustained operation at 25 °C ambient, triggering the on-chip thermal shutdown.
Route the differential coil-sense traces (COIL_P, COIL_N, pins 1-2) symmetrically with matched lengths within 1 mm and ground shielding to preserve signal integrity. Keep the high-current half-bridge loop (DRV_H, DRV_L, BST) area minimal to reduce EMI. Place the 100 nF bootstrap capacitor for BST as close to pins 4-6 as physically possible.
Use NXP reference design RDGDK1200 as the layout starting point. The 32-HVQFN requires wettable flank side pads for automated optical inspection; ensure PCB land pattern matches IPC-7351 nominal with 0.2 mm toe extension. Keep digital I²C traces (SDA, SCL) away from the analog coil-sense traces to avoid coupling noise into the demodulation path.
Do not connect the EPAD to a floating copper island - it must be tied directly to the system ground plane with multiple stitching vias. Do not drive the I²C lines above 3.6 V; the device is not 5 V tolerant on SDA/SCL. Do not skip the FSK capacitor on the BST pin, or the high-side gate will not switch and the device will appear to operate in ASK mode only with reduced power transfer efficiency.
معلومات الامتثال
RoHS compliant per NXP product page. NRND status as of 2026-10-15 - minimum order quantity 2450 units, 39-week lead time. Not AEC-Q100 qualified - use MWCT1xxxA-Q family for automotive.
