MWCT1200CFM - 5W Multi-Coil Wireless Charging Tx IC | NXP
MPN: MWCT1200CFM ✗ پایان تولیدMWCT1200CFM نمای کلی
What is a wireless charging transmitter IC? A wireless charging transmitter IC (PMIC) is a specialized power management unit that drives a transmitter coil to deliver energy to a Qi-compliant receiver through resonant inductive coupling. The transmitter sits inside the category hierarchy: PMIC -> power management IC -> wireless power transmitter -> semiconductor. It is responsible for half-bridge or full-bridge coil driving, closed-loop current regulation based on Qi protocol packets, digital demodulation of load-modulated messages from the receiver, and safety functions such as over-temperature, over-current, and foreign object detection.
Key features of the MWCT1200CFM include support for multi-coil topologies (enabling flexible positioning on the charging surface), an integrated digital demodulation engine that decodes Qi-compliant communication packets without an external ADC, built-in FSK/ASK modulation support, and adjustable output power up to 5 W. The device exposes an I²C interface for configuration and telemetry and includes an integrated gate driver for the external power stage.
Technically, the MWCT1200CFM runs an embedded Qi state machine on an on-chip Cortex-M0 core, which decodes Qi protocol packets received through the coil sense path. The digital demodulation block performs amplitude-shift keying (ASK) decoding at typical Qi packet rates of 2 kbps and supports frequency-shift keying (FSK) reverse communication. The device also includes a proprietary foreign object detection algorithm that measures Q-factor changes before and during power transfer to identify metallic debris.
Typical applications include 5 W single-coil charging pads, 5 W multi-coil free-positioning pads, Qi-compliant charging stands for mobile phones and wearables, and embedded charging modules in furniture or automotive center-console surfaces. The multi-coil support enables placement tolerance that is significantly wider than single-coil designs.
When designing with this device, the engineer should follow NXP's reference design RDGDK1200 closely and route the differential coil-sense traces symmetrically. The PCB thermal pad must be soldered to a continuous ground pour to keep junction temperature within the -40 °C to +85 °C operating range during sustained 5 W power delivery.
This page synthesizes distributor pricing, drop-in alternative availability, and practical design notes not found in the manufacturer datasheet alone.
جایگزینهای drop-in برای MWCT1200CFM — همان پکیج، سازگار پینبهپین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونهها در این سری
مدلهای همسری که جایگزین مستقیم هستند برای MWCT1200CFM (همان فرمفاکتور و فوتپرینت) — متفاوت در Communication Protocol, Package, Topology.
MWCT1100CFM
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MWCT1000CFM
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←MWCT1201CFM
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MWCT1300CFM
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MAX77950EWX+T
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
MWCT1200CFM مشخصات
| عملکرد | Wireless Power Transmitter PMIC |
| Output Power | 5 W |
| توپولوژی | Multi-coil |
| ولتاژ تغذیه | 2.7 V to 3.6 V |
| جریان تغذیه | 300 µA |
| Communication Protocol | WPC Qi A5/A11 |
| Modulation | ASK/FSK demodulation |
| Foreign Object Detection | Yes (Q-factor based) |
| بستهبندی | 32-HVQFN (5x5 mm) wettable flank |
| نوع نصب | Surface Mount |
| دمای کاری | -40 °C to +85 °C |
| Standard Package Quantity | 490 (Tray) |
| Minimum Order Quantity | 2450 (5 trays) |
| Lead Time | 39 weeks |
| وضعیت RoHS | Compliant |
پیکربندی پین MWCT1200CFM
| پین 1 | COIL_P — Differential coil-sense input (positive) |
| پین 2 | COIL_N — Differential coil-sense input (negative) |
| پین 3 | GND — Ground |
| پین 4 | DRV_H — Half-bridge high-side gate driver output |
| پین 5 | DRV_L — Half-bridge low-side gate driver output |
| پین 6 | BST — Bootstrap supply for high-side driver |
| پین 7 | VDD — 3.3 V supply input |
| پین 8 | GND — Ground |
| پین 9 | EN — Enable (active high) |
| پین 10 | SDA — I²C data |
| پین 11 | SCL — I²C clock |
| پین 12 | INT — Interrupt output (active low) |
| پین 13 | GND — Ground |
| پین 14 | LED1 — Status LED driver 1 |
| پین 15 | LED2 — Status LED driver 2 |
| پین 16 | TS — Temperature sense input |
| پین 17 | VREF — Internal reference voltage |
| پین 18 | GND — Ground |
| پین 19 | MUX_A — Coil multiplexer select A |
| پین 20 | MUX_B — Coil multiplexer select B |
| پین 21 | MUX_C — Coil multiplexer select C |
| پین 22 | GND — Ground |
| پین 23 | CS_P — Current sense input (positive) |
| پین 24 | CS_N — Current sense input (negative) |
| پین 25 | RESET — Reset input (active low) |
| پین 26 | VDD — 3.3 V supply input |
| پین 27 | GND — Ground |
| پین 28 | TEST1 — Factory test pin (leave NC) |
| پین 29 | TEST2 — Factory test pin (leave NC) |
| پین 30 | NC — Not connected (per datasheet) |
| پین 31 | NC — Not connected (per datasheet) |
| پین 32 | EP — Exposed thermal pad (connect to GND) |
کاربردهای معمول
MWCT1200CFM مناسب است برای 6 کاربردs: Single-Coil Qi Charging Pad, Multi-Coil Free-Positioning Charging Pad, Qi Charging Stand (Mobile Phone), Embedded Furniture Charging Module, Wearable Charging Cradle, Industrial 5 W Wireless Power Module.
Single-Coil Qi Charging Pad
The MWCT1200CFM directly drives a single Qi A5/A11 transmitter coil at 5 W output power, providing a complete charging-pad solution in the 32-HVQFN package. The device integrates ASK/FSK demodulation, eliminating the external microcontroller that legacy Qi designs required. The 300 µA quiescent current keeps standby power well below 100 mW, satisfying Energy Star standby requirements. With the on-chip FOD algorithm monitoring Q-factor shifts, the pad safely rejects metallic debris before power transfer starts.
پیشنهادی
Multi-Coil Free-Positioning Charging Pad
The MWCT1200CFM's integrated coil multiplexer natively drives up to three transmitter coils, enabling a free-positioning charging surface where phones can be placed anywhere on the pad. Each coil is sequentially scanned for a Qi-compliant receiver, then selected by the on-chip mux once a load is detected. The 5 W output, ASK/FSK demodulation, and Q-factor FOD combine to deliver a robust consumer charging experience with wide placement tolerance and safe operation.
پیشنهادی
Qi Charging Stand (Mobile Phone)
In a vertical charging-stand form factor, the MWCT1200CFM drives a single 5 W coil angled at 15-30° to align with the phone's receiver coil. The 5 mm × 5 mm 32-HVQFN footprint fits easily behind the stand's PCB, and the exposed thermal pad couples to a small copper pour for sustained 5 W operation. The on-chip Qi state machine handles the entire ping-identify-configure-power handshake without external code, simplifying firmware development.
پیشنهادی
Embedded Furniture Charging Module
For tables and nightstands with integrated Qi charging, the MWCT1200CFM provides the complete transmitter functionality in a single chip. The 2.7 V to 3.6 V supply accepts a 3.3 V rail derived from a USB-C 5 V input, and the I²C interface allows a host MCU to monitor charging status or drive LED indicators. The Q-factor FOD ensures the device never energizes when coins, keys, or foil are placed on the surface, meeting furniture-safety standards.
پیشنهادی
Wearable Charging Cradle
Smartwatch and hearable charging cradles use small-form-factor Qi transmitters where the MWCT1200CFM's 32-HVQFN package delivers full Qi compliance in minimal PCB area. The low 300 µA quiescent current extends cradle standby time when paired with battery-powered hosts. The on-chip FOD protects the small metal pins used to align the wearable from being falsely detected as foreign objects.
پیشنهادی
Industrial 5 W Wireless Power Module
Industrial sensor and HMI panels benefit from wireless power to eliminate connector wear. The MWCT1200CFM provides 5 W Qi-compliant power with the -40 °C to +85 °C industrial temperature range. The 32-HVQFN's wettable flank package supports automated optical inspection (AOI) on industrial assembly lines. The I²C interface enables predictive maintenance telemetry on coil health and power delivery efficiency.
پیشنهادی
خلاصه محصولات پیشنهادی
دادههای مرجع مهندسی برای MWCT1200CFM — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزینها
| پارامتر | این محصول | MWCT1100CFM | MWCT1000CFM | MWCT1201CFM | MWCT1300CFM | MAX77950EWX+T |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Maxim Integrated |
| Package | 32-HVQFN (5x5 mm) | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | QFN-30 - different pinout |
| Output Power | 5 W | 3 W | 5 W | 5 W | 5 W | 5 W |
| Topology | Multi-coil | Single-coil | Single-coil | Multi-coil | Multi-coil | Single-coil |
| Qi Standard | Qi 1.2 (A5/A11) | Qi 1.2 | Qi 1.2 | Qi 1.2 | Qi 1.3 | Qi 1.2 |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 3.0 V to 5.5 V |
| FSK Modulation | Yes | Yes | Yes | Yes | Yes | No |
| Foreign Object Detection | Yes (Q-factor based) | Yes | Yes | Yes | Yes (improved) | Yes (loss-based) |
| Lifecycle Status | NRND | NRND | NRND | Active | Active | Active |
تفاوتهای کلیدی
- Multi-coil support integrated (در مقابلMWCT1000CFM)
- Higher output power rating (در مقابلMWCT1100CFM)
- Native Qi 1.2 compliance with FSK (در مقابلMAX77950EWX+T)
- Qi 1.3 upgrade path in same family (در مقابلMWCT1300CFM)
یادداشتهای طراحی
At 5 W output and 90% coil-to-load efficiency, the MWCT1200CFM must dissipate approximately 0.5 W internally plus drive losses in the external half-bridge. Solder the exposed thermal pad (pin 32) to a continuous ground copper pour of at least 100 mm² on top and inner layers. Without adequate copper, junction temperature can exceed 100 °C during sustained operation at 25 °C ambient, triggering the on-chip thermal shutdown.
Route the differential coil-sense traces (COIL_P, COIL_N, pins 1-2) symmetrically with matched lengths within 1 mm and ground shielding to preserve signal integrity. Keep the high-current half-bridge loop (DRV_H, DRV_L, BST) area minimal to reduce EMI. Place the 100 nF bootstrap capacitor for BST as close to pins 4-6 as physically possible.
Use NXP reference design RDGDK1200 as the layout starting point. The 32-HVQFN requires wettable flank side pads for automated optical inspection; ensure PCB land pattern matches IPC-7351 nominal with 0.2 mm toe extension. Keep digital I²C traces (SDA, SCL) away from the analog coil-sense traces to avoid coupling noise into the demodulation path.
Do not connect the EPAD to a floating copper island - it must be tied directly to the system ground plane with multiple stitching vias. Do not drive the I²C lines above 3.6 V; the device is not 5 V tolerant on SDA/SCL. Do not skip the FSK capacitor on the BST pin, or the high-side gate will not switch and the device will appear to operate in ASK mode only with reduced power transfer efficiency.
اطلاعات انطباق
RoHS compliant per NXP product page. NRND status as of 2026-10-15 - minimum order quantity 2450 units, 39-week lead time. Not AEC-Q100 qualified - use MWCT1xxxA-Q family for automotive.