PIC18F46K22-E/MV - 8-Bit 64KB Flash MCU, 40-UQFN | Microchip
MPN: PIC18F46K22-E/MV ✓ نشطPIC18F46K22-E/MV نظرة عامة
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path CPU with on-chip Flash program memory, SRAM data memory, and a rich set of peripherals (ADC, timers, PWM, communication interfaces). It sits in the broader taxonomy of microcontroller -> embedded processor -> semiconductor. PIC18-family MCUs use a RISC modified-Harvard architecture optimized for C-compiler code density and deterministic interrupt response, making them workhorses in cost-sensitive industrial and consumer products.
Key features include operation across 2.5V/3.3V/5V supplies (4.2V-5.5V VDD per the verified data), a 12-bit A/D converter with up to 30 channels, multiple Enhanced CCP/PWM peripherals, MSSP (SPI/I2C), EUSART, and nanoWatt XLP sleep currents down to the nanoampere range. The E temperature suffix denotes the extended -40C to +125C operating range suitable for industrial and harsh-environment applications.
The PIC18F46K22 architecture uses a 16-bit instruction word with 8-bit data, supports up to 16 MIPS throughput, and provides linear program memory addressing up to 64 KB and linear data memory up to 4 KB. The 40-UQFN (MV) 5x5 mm footprint with exposed thermal pad is suitable for space-constrained PCB designs requiring a low profile and good thermal dissipation.
Typical applications include industrial control boards, sensor signal conditioning nodes, low-power battery-powered IoT edge devices, HVAC controllers, automotive body and accessory subsystems, and home appliances. The combination of XLP low power, 12-bit ADC, and rich PWM/peripheral set fits motor control and mixed-signal sensing roles.
Design consideration: ensure decoupling with 100 nF and bulk capacitors placed close to AVDD/VDD pins; the exposed thermal pad on the MV package must be soldered to a copper land for mechanical reliability and thermal performance. Plan firmware around the device's vectored interrupt structure and avoid tight loops in XLP sleep mode if peripheral wake events are required.
This page synthesizes current distributor pricing, same-brand and cross-brand drop-in alternatives, and engineering design notes that go beyond the manufacturer datasheet summary, supporting both manual selection and AI-driven comparison.
بدائل مباشرة لـ PIC18F46K22-E/MV — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC18F46K22-E/MV (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Timers, ADC, Program Memory (Flash).
PIC18F46K22-I/MV
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F45K22-E/MV
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F44K22-E/MV
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18F46K22T-I/MV
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18F43K22-E/MV
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18F46K22-E/MV الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC18 8-bit RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Data Memory (SRAM) | 3,968 bytes |
| EEPROM | 1,024 bytes |
| Maximum CPU Speed | 48 MHz (16 MIPS) |
| Supply Voltage (VDD) | 2.5V / 3.3V / 5V (4.2V to 5.5V operating range per data) |
| درجة حرارة التشغيل | -40C to +125C (Extended, E suffix) |
| I/O Pins | 36 |
| العلبة | 40-pin UQFN (MV) 5x5 mm with exposed pad |
| ADC | 12-bit, up to 30 channels |
| PWM / ECCP | Multiple ECCP/CCP modules |
| Communication Interfaces | MSSP (SPI/I2C), EUSART |
| Low-Power Technology | nanoWatt XLP |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف PIC18F46K22-E/MV
| دبوس 1 | RA0/AN0/C1IN0-/ULPWU — Port A bit 0 / analog input 0 / comparator input |
| دبوس 2 | RA1/AN1/C2IN0-/HLVDIN — Port A bit 1 / analog input 1 / HLVD input |
| دبوس 3 | RA2/AN2/VREF-/CVREF — Port A bit 2 / analog input 2 / DAC reference |
| دبوس 4 | RA3/AN3/VREF+ — Port A bit 3 / analog input 3 / positive reference |
| دبوس 5 | RA4/T0CKI/C1OUT — Port A bit 4 / Timer0 clock / comparator output |
| دبوس 6 | RA5/AN4/C2OUT — Port A bit 5 / analog input 4 / comparator output |
| دبوس 7 | RA6/OSC2/CLKO — Port A bit 6 / oscillator output |
| دبوس 8 | RA7/OSC1/CLKI — Port A bit 7 / oscillator input |
| دبوس 9 | RE0/RD/AN5 — Port E bit 0 / parallel port read |
| دبوس 10 | RE1/WR/AN6 — Port E bit 1 / parallel port write |
| دبوس 11 | RE2/CS/AN7 — Port E bit 2 / parallel port chip select |
| دبوس 12 | RE3/P3A/MCLR/VPP — Port E bit 3 / master clear / programming voltage |
| دبوس 13 | VDD — Positive supply voltage |
| دبوس 14 | VSS — Ground reference |
| دبوس 15 | RB0/INT0/FLT0/AN12 — Port B bit 0 / external interrupt 0 |
| دبوس 16 | RB1/INT1/AN10 — Port B bit 1 / external interrupt 1 |
| دبوس 17 | RB2/INT2/CTPLS/AN8 — Port B bit 2 / external interrupt 2 |
| دبوس 18 | RB3/CTED1/AN9/CCP2 — Port B bit 3 / CCP2 output |
| دبوس 19 | RB4/IOC0/AN11 — Port B bit 4 / interrupt-on-change |
| دبوس 20 | RB5/IOC1/CCP3 — Port B bit 5 / CCP3 output |
| دبوس 21 | RB6/IOC2/PGC — Port B bit 6 / ICSP clock |
| دبوس 22 | RB7/IOC3/PGD — Port B bit 7 / ICSP data |
| دبوس 23 | RC0/SOSCO — Port C bit 0 / secondary oscillator output |
| دبوس 24 | RC1/SOSCI — Port C bit 1 / secondary oscillator input |
| دبوس 25 | RC2/CCP1/P1A/AN13 — Port C bit 2 / CCP1 output |
| دبوس 26 | RC3/SCL1/SCK1 — Port C bit 3 / I2C clock / SPI clock |
| دبوس 27 | RC4/SDA1/SDI1 — Port C bit 4 / I2C data / SPI data in |
| دبوس 28 | RC5/SDO1 — Port C bit 5 / SPI data out |
| دبوس 29 | RC6/CK1/TX1/CK2 — Port C bit 6 / UART clock/transmit |
| دبوس 30 | RC7/RX1/DT1 — Port C bit 7 / UART receive |
| دبوس 31 | RD0/C1INA/AN22 — Port D bit 0 |
| دبوس 32 | RD1/CCP4/AN23 — Port D bit 1 / CCP4 output |
| دبوس 33 | RD2/C2INA/AN24 — Port D bit 2 |
| دبوس 34 | RD3/C3INA/AN25 — Port D bit 3 |
| دبوس 35 | RD4/CCP5/AN26 — Port D bit 4 / CCP5 output |
| دبوس 36 | RD5/CCP6/AN27 — Port D bit 5 / CCP6 output |
| دبوس 37 | RD6/ECCP1/P1B/AN28 — Port D bit 6 / enhanced CCP |
| دبوس 38 | RD7/ECCP2/P2A/AN29 — Port D bit 7 / enhanced CCP |
| دبوس 39 | AVDD — Analog positive supply |
| دبوس 40 | AVSS — Analog ground reference |
التطبيقات النموذجية
PIC18F46K22-E/MV مناسب لـ 6 التطبيقs: Industrial Control & Sensor Interface Boards, Low-Power IoT Edge Sensor Nodes, HVAC and Building Automation Controllers, Automotive Body and Accessory Modules, Home Appliance Control Boards, User Interface and Display Driver Boards.
Industrial Control & Sensor Interface Boards
The PIC18F46K22-E/MV fits industrial control boards thanks to its 12-bit ADC with up to 30 channels for multi-signal conditioning, 36 digital I/O lines for actuator and switch interfacing, and Extended -40C to +125C temperature rating. Its 48 MHz / 16 MIPS core executes closed-loop PID at the millisecond scale typical of process-control update rates. Place it on a 40-UQFN (MV) 5x5 mm footprint with the exposed pad soldered for thermal reliability in enclosed cabinets; nanoWatt XLP sleep modes reduce quiescent draw between sensor scans for always-on industrial nodes.
موصى به
Low-Power IoT Edge Sensor Nodes
The PIC18F46K22-E/MV is well-suited to battery-powered IoT sensor endpoints thanks to nanoWatt XLP technology with sleep currents in the nanoampere range, enabling multi-year battery life when waking periodically to read sensors. Its MSSP (SPI/I2C) peripheral drives digital sensors and the EUSART interfaces to sub-GHz radios or BLE modules. The 40-UQFN 5x5 mm footprint enables compact sensor PCBs, and 64 KB Flash accommodates OTA bootloader + application firmware stacks. The 12-bit ADC with sleep-mode conversion supports low-duty-cycle battery telemetry on 3.3V coin-cell rails.
موصى به
HVAC and Building Automation Controllers
The PIC18F46K22-E/MV drives HVAC and building-automation subsystems where Extended temperature grade, multiple PWM channels, and 12-bit ADC precision are mandatory for valve and damper control loops. Its nanoWatt XLP modes cut standby power in wall thermostats and fan-coil controllers between user interactions. The 64 KB Flash hosts BACnet/Modbus stack plus application logic, and the 40-UQFN (MV) 5x5 mm profile fits slim-line wall-mount enclosures. 36 GPIO handle keypads, relays, and triac-fired AC loads when paired with zero-cross optocouplers.
موصى به
Automotive Body and Accessory Modules
The PIC18F46K22-E/MV suits non-safety automotive body modules - lighting controllers, seat controllers, HVAC blend-door actuators, and accessory multiplex nodes - where Extended -40C to +125C operation and PWM/ECCP peripherals are required. Its 12-bit ADC monitors current-sense shunts and thermistor inputs for actuator feedback. Note: this part is not AEC-Q100 qualified; for AEC-Q100 safety-relevant modules choose PIC18F46K22-E/MV with explicit automotive part number or migrate to AEC-Q100-qualified PIC18F Q-series. The 40-UQFN (MV) 5x5 mm enables small ECU sub-modules.
موصى به
Home Appliance Control Boards
The PIC18F46K22-E/MV integrates well into white-goods control boards (washing machines, dishwashers, refrigerators, microwave ovens) where its 48 MHz core drives multi-axis motor control via ECCP/PWM, 12-bit ADC reads temperature and level sensors, and Extended temperature rating survives appliance environments. 64 KB Flash hosts state-machine control firmware plus UI drivers for 7-segment or LCD interfaces. The 40-UQFN 5x5 mm footprint allows placement near motor drivers on the same board, and nanoWatt XLP keeps standby power low for Energy Star compliance.
موصى به
User Interface and Display Driver Boards
The PIC18F46K22-E/MV serves as a UI controller for vending machines, point-of-sale terminals, and instrument panels where 36 GPIO handle keypads, 7-segment or character LCDs, status LEDs, and rotary encoders. Its 64 KB Flash supports graphical menu structures and EEPROM stores user settings. MSSP (SPI) drives LED drivers or small TFT panels via serial interface. The 40-UQFN 5x5 mm footprint suits slim UI PCBs, and nanoWatt XLP idle mode saves power when the user interface is dormant between touches.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC18F46K22-E/MV — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC18F46K22-I/MV | PIC18F45K22-E/MV | PIC18F44K22-E/MV | PIC18F43K22-E/MV |
|---|---|---|---|---|---|
| Package | 40-pin UQFN (MV) 5x5 mm | 40-pin UQFN (MV) 5x5 mm - same | 40-pin UQFN (MV) 5x5 mm - same | 40-pin UQFN (MV) 5x5 mm - same | 40-pin UQFN (MV) 5x5 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 64 KB | 32 KB | 16 KB | 8 KB |
| SRAM | 3,968 bytes | 3,968 bytes | 3,968 bytes | 3,968 bytes | 1,536 bytes |
| EEPROM | 1,024 bytes | 1,024 bytes | 1,024 bytes | 1,024 bytes | 256 bytes |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Max CPU Speed | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS | 48 MHz / 16 MIPS |
| 12-bit ADC Channels | Up to 30 | Up to 30 | Up to 30 | Up to 28 | Up to 28 |
| Supply Voltage | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V |
أبرز الفروقات
- Extended -40C to +125C operating temperature with nanoWatt XLP extreme low power (مقابلPIC18F46K22-I/MV)
- Maximum Flash density in the 40-UQFN K22 family (مقابلPIC18F45K22-E/MV)
- Highest 12-bit ADC channel count in the 40-UQFN K22 family (مقابلPIC18F44K22-E/MV)
ملاحظات التصميم
The 40-UQFN (MV) package uses an exposed thermal pad on the underside that MUST be soldered to a copper land on the PCB, per Microchip package guidelines. A land area of at least 25 mm^2 (a 5x5 mm pad) provides primary heat spreading; for higher-power designs, stitch vias to an inner ground plane enlarge the thermal mass. Skipping the exposed-pad solder connection can lead to intermittent operation under thermal stress, especially at +125C ambient operation.
Decouple VDD and AVDD each with a 100 nF ceramic capacitor placed within 3 mm of the respective pins, plus a bulk 4.7 uF to 10 uF tantalum or ceramic on each rail. The PIC18F46K22-E/MV is sensitive to VDD ripple during ADC conversions; route AVDD separately and tie AVDD to VDD through a ferrite bead if analog precision is required. nanoWatt XLP modes require careful sequencing of peripheral disable bits before sleep entry to reach the lowest nanoampere standby currents quoted in the datasheet.
Route the ICSP clock (PGC, RB6) and data (PGD, RB7) lines as short as possible and avoid routing them near switching signals or analog inputs to prevent programming-noise coupling during in-circuit serial programming. The 40-UQFN (MV) 5x5 mm land pattern requires NSMD (non-solder mask defined) pads with 0.25 mm pitch - follow IPC-7351 land-pattern guidelines for QFN packages to ensure reliable solder joints and avoid tombstoning during reflow.
Configuration word settings must be set BEFORE the first instruction executes - an unconfigured MCLR/VPP pin defaults to MCLR mode, which can prevent normal startup if the ICSP programmer is not connected. The PIC18F46K22-E/MV is the Extended temperature grade; if your firmware was developed on an -I/MV industrial-grade part, you must verify timing and EEPROM endurance across the wider -40C to +125C range. Brown-out reset (BOR) and watchdog timer (WDT) must be enabled for unattended industrial deployments to recover from power glitches.
معلومات الامتثال
RoHS and lead-free compliant per Microchip product page. NOT AEC-Q100 qualified - for automotive safety-relevant modules choose an AEC-Q100-qualified part from the PIC18F Q-series or PIC18F K-series with explicit automotive part number.
