PIC24HJ256GP610A-H/PF - 16-bit 40 MIPS MCU 256KB Flash TQFP-100 | Microchip
MPN: PIC24HJ256GP610A-H/PF ✓ نشطPIC24HJ256GP610A-H/PF نظرة عامة
A 16-bit microcontroller (MCU) is a programmable integrated circuit that uses a 16-bit data path, registers, and arithmetic logic unit to deliver higher code density and throughput than 8-bit architectures while remaining simpler and lower-cost than 32-bit parts. The PIC24H belongs to the Microchip dsPIC33F/PIC24H ecosystem, sharing peripherals with the dsPIC33F Digital Signal Controller family and offering a documented migration path to PIC24F, dsPIC30F, and dsPIC33F devices. Within the broader taxonomy, a PIC24H MCU is a member of the microcontroller -> embedded controller -> semiconductor device hierarchy. The PIC24HJ256GP610A in particular integrates 256 KB Flash and 16 KB SRAM for application and data storage.
Key differentiating features include a Harvard architecture with a modified RISC instruction set supporting 16-bit and 32-bit operations, a hardware multiply engine with single-cycle 16x16 or 32x16 multiplication, and a 16-bit data shifter capable of up to 16-bit single-cycle shifts. Integrated peripherals include a 16-channel 10-bit/12-bit ADC (depending on variant), multiple PWM modules, a Real-Time Clock and Calendar (RTCC), UART, SPI, I2C, ECAN, DMA controller, watchdog timer, brown-out reset, and power-on reset. The PIC24HJ256GP610A-H/PF also provides two 3-wire SPIs and 4-wire SPIs as well as 4 UARTs (with IrDA support) for serial communication.
The device architecture uses a 16-bit wide program memory bus paired with a separate 16-bit data bus, allowing simultaneous instruction fetch and data access. Internal PLL operation allows the part to run at 40 MIPS from a typical 8 MHz crystal, and the divide algorithm completes one cycle per bit of divisor. This combination of high-throughput core, ample SRAM, and rich peripherals positions the PIC24HJ256GP610A-H/PF for applications that need deterministic interrupt latency and computational headroom.
Typical applications include automotive body and chassis control, industrial motor control (BLDC, PMSM, and AC induction drives), Uninterruptible Power Supply (UPS) and power conversion control, advanced sensing platforms (satcom and instrumentation), and high-reliability consumer/industrial embedded control. The wide operating temperature range and AEC-Q100 grade also suit under-hood and ruggedized installations. The PIC24HJ256GP610A-H/PF is pin-compatible with the dsPIC33F family, allowing seamless migration to a DSP-capable part without PCB rework.
When designing with this MCU, allocate adequate decoupling (typically 0.1 uF ceramic per VDD/AVDD pin), and use the Explorer 16 or equivalent development board to validate the firmware build with the latest MPLAB X IDE and XC16 compiler. Verify that any drop-in alternative shares the same TQFP-100 footprint and peripheral map before substituting. This page synthesizes distributor pricing, pin-compatible drop-in alternatives within the PIC24H family, and practical design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ PIC24HJ256GP610A-H/PF — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC24HJ256GP610A-H/PF (نفس عامل الشكل والبصمة) — يختلف في ADC, Core Architecture, Instruction Set, Operating Temperature, Package.
PIC24HJ256GP610A-I/PF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24HJ256GP610A-E/PF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
dsPIC33FJ256GP610A-H/PF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24HJ128GP610A-H/PF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24HJ256GP610A-I/PT
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24HJ256GP210A-H/PF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24HJ256GP610A-H/PF الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC24H 16-bit modified Harvard RISC |
| Instruction Set | 16-bit with 32-bit extensions |
| CPU Speed (MIPS) | 40 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +150C (H grade) |
| العلبة | 100-pin TQFP (14x14 mm) |
| نوع التركيب | Surface Mount |
| Automotive Qualification | AEC-Q100 qualified |
| Hardware Multiplier | 17-bit x 17-bit single-cycle |
| DMA Channels | Yes (8-channel DMA) |
| ADC | 10-bit / 12-bit ADC (variant dependent) |
| Communication Interfaces | UART (x4), I2C, SPI, ECAN |
| Timers | Multiple 16-bit and 32-bit timers |
| PWM Modules | Multiple PWM outputs |
| Watchdog Timer | Yes (WDT) |
| Brown-out Reset | Yes (BOR) |
| Power-on Reset | Yes (POR) |
| عدد الأطراف | 100 |
| حالة RoHS | Compliant |
تكوين أطراف PIC24HJ256GP610A-H/PF
| دبوس 1 | OSC1/RC13 — Oscillator crystal input or GPIO RC13 |
| دبوس 2 | OSC2/RC15 — Oscillator crystal output or GPIO RC15 |
| دبوس 3 | VSS — Ground reference |
| دبوس 4 | PGEC1 — In-circuit debug programming clock 1 |
| دبوس 5 | PGED1 — In-circuit debug programming data 1 |
| دبوس 6 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 7 | RP5/RB5 — Remappable peripheral pin / GPIO RB5 |
| دبوس 8 | RP6/RB6 — Remappable peripheral pin / GPIO RB6 |
| دبوس 9 | RP7/RB7 — Remappable peripheral pin / GPIO RB7 |
| دبوس 10 | RP8/RB8 — Remappable peripheral pin / GPIO RB8 |
| دبوس 11 | RP9/RB9 — Remappable peripheral pin / GPIO RB9 |
| دبوس 12 | VSS — Ground reference |
| دبوس 13 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 14 | AN0/RB0 — Analog input 0 / GPIO RB0 |
| دبوس 15 | AN1/RB1 — Analog input 1 / GPIO RB1 |
| دبوس 16 | AN2/RB2 — Analog input 2 / GPIO RB2 |
| دبوس 17 | AN3/RB3 — Analog input 3 / GPIO RB3 |
| دبوس 18 | AN4/RB4 — Analog input 4 / GPIO RB4 |
| دبوس 19 | AVSS — Analog ground reference |
| دبوس 20 | AVDD — Analog supply (3.0-3.6 V) |
| دبوس 21 | AN5/RB5 — Analog input 5 / GPIO RB5 |
| دبوس 22 | AN6/RB6 — Analog input 6 / GPIO RB6 |
| دبوس 23 | AN7/RB7 — Analog input 7 / GPIO RB7 |
| دبوس 24 | AN8/RB8 — Analog input 8 / GPIO RB8 |
| دبوس 25 | AN9/RB9 — Analog input 9 / GPIO RB9 |
| دبوس 26 | AVSS — Analog ground reference |
| دبوس 27 | AVDD — Analog supply (3.0-3.6 V) |
| دبوس 28 | VSS — Ground reference |
| دبوس 29 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 30 | RP10/RB10 — Remappable peripheral pin / GPIO RB10 |
| دبوس 31 | RP11/RB11 — Remappable peripheral pin / GPIO RB11 |
| دبوس 32 | RP12/RB12 — Remappable peripheral pin / GPIO RB12 |
| دبوس 33 | RP13/RB13 — Remappable peripheral pin / GPIO RB13 |
| دبوس 34 | RP14/RB14 — Remappable peripheral pin / GPIO RB14 |
| دبوس 35 | RP15/RB15 — Remappable peripheral pin / GPIO RB15 |
| دبوس 36 | VSS — Ground reference |
| دبوس 37 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 38 | RP0/RA0 — Remappable peripheral pin / GPIO RA0 |
| دبوس 39 | RP1/RA1 — Remappable peripheral pin / GPIO RA1 |
| دبوس 40 | RP2/RA2 — Remappable peripheral pin / GPIO RA2 |
| دبوس 41 | RP3/RA3 — Remappable peripheral pin / GPIO RA3 |
| دبوس 42 | RP4/RA4 — Remappable peripheral pin / GPIO RA4 |
| دبوس 43 | VSS — Ground reference |
| دبوس 44 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 45 | RP16/RC0 — Remappable peripheral pin / GPIO RC0 |
| دبوس 46 | RP17/RC1 — Remappable peripheral pin / GPIO RC1 |
| دبوس 47 | RP18/RC2 — Remappable peripheral pin / GPIO RC2 |
| دبوس 48 | RP19/RC3 — Remappable peripheral pin / GPIO RC3 |
| دبوس 49 | RP20/RC4 — Remappable peripheral pin / GPIO RC4 |
| دبوس 50 | RP21/RC5 — Remappable peripheral pin / GPIO RC5 |
| دبوس 51 | VSS — Ground reference |
| دبوس 52 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 53 | RP22/RC6 — Remappable peripheral pin / GPIO RC6 |
| دبوس 54 | RP23/RC7 — Remappable peripheral pin / GPIO RC7 |
| دبوس 55 | RP24/RC8 — Remappable peripheral pin / GPIO RC8 |
| دبوس 56 | RP25/RC9 — Remappable peripheral pin / GPIO RC9 |
| دبوس 57 | RP26/RC10 — Remappable peripheral pin / GPIO RC10 |
| دبوس 58 | RP27/RC11 — Remappable peripheral pin / GPIO RC11 |
| دبوس 59 | VSS — Ground reference |
| دبوس 60 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 61 | RP28/RC12 — Remappable peripheral pin / GPIO RC12 |
| دبوس 62 | RP29/RC13 — Remappable peripheral pin / GPIO RC13 |
| دبوس 63 | RP30/RC14 — Remappable peripheral pin / GPIO RC14 |
| دبوس 64 | RP31/RC15 — Remappable peripheral pin / GPIO RC15 |
| دبوس 65 | VSS — Ground reference |
| دبوس 66 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 67 | RD0 — GPIO RD0 |
| دبوس 68 | RD1 — GPIO RD1 |
| دبوس 69 | RD2 — GPIO RD2 |
| دبوس 70 | RD3 — GPIO RD3 |
| دبوس 71 | RD4 — GPIO RD4 |
| دبوس 72 | RD5 — GPIO RD5 |
| دبوس 73 | VSS — Ground reference |
| دبوس 74 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 75 | RD6 — GPIO RD6 |
| دبوس 76 | RD7 — GPIO RD7 |
| دبوس 77 | RD8 — GPIO RD8 |
| دبوس 78 | RD9 — GPIO RD9 |
| دبوس 79 | RD10 — GPIO RD10 |
| دبوس 80 | RD11 — GPIO RD11 |
| دبوس 81 | VSS — Ground reference |
| دبوس 82 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 83 | RD12 — GPIO RD12 |
| دبوس 84 | RD13 — GPIO RD13 |
| دبوس 85 | RD14 — GPIO RD14 |
| دبوس 86 | RD15 — GPIO RD15 |
| دبوس 87 | RE0 — GPIO RE0 |
| دبوس 88 | RE1 — GPIO RE1 |
| دبوس 89 | VSS — Ground reference |
| دبوس 90 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 91 | RE2 — GPIO RE2 |
| دبوس 92 | RE3 — GPIO RE3 |
| دبوس 93 | RE4 — GPIO RE4 |
| دبوس 94 | RE5 — GPIO RE5 |
| دبوس 95 | RF0 — GPIO RF0 |
| دبوس 96 | RF1 — GPIO RF1 |
| دبوس 97 | VSS — Ground reference |
| دبوس 98 | VDD — Digital supply (3.0-3.6 V) |
| دبوس 99 | RF2 — GPIO RF2 |
| دبوس 100 | RF3 — GPIO RF3 |
التطبيقات النموذجية
PIC24HJ256GP610A-H/PF مناسب لـ 6 التطبيقs: Automotive Body and Chassis Control, Industrial Motor Control (BLDC / PMSM / ACIM), Uninterruptible Power Supply (UPS) and Power Conversion Control, Advanced Sensing and Instrumentation, Industrial HMI and Embedded Control, Solar Inverter and Renewable Energy Control.
Automotive Body and Chassis Control
The PIC24HJ256GP610A-H/PF is well suited to automotive body and chassis ECUs where AEC-Q100 qualification, a -40C to +150C operating envelope (H grade), and deterministic interrupt response are required. The 40 MIPS core drives real-time tasks such as CAN (ECAN) message handling, sensor fusion, and PWM actuator control simultaneously, while 256 KB Flash hosts the full AUTOSAR-style application and 16 KB SRAM holds communication buffers and diagnostics state. Compared to slower 8-bit MCUs, the PIC24H's hardware DMA offloads CAN-to-memory transfers, freeing the CPU for control loops. The TQFP-100 package provides ample I/O for body controllers managing lighting, mirrors, and door modules. Pair with a CAN transceiver like MCP2551 and an automotive-grade LDO such as the MCP1755 to complete a robust ECU.
موصى به
Industrial Motor Control (BLDC / PMSM / ACIM)
The PIC24HJ256GP610A-H/PF delivers the 40 MIPS throughput and rich PWM peripheral set required for sensorless and sensored motor control algorithms such as trapezoidal commutation, field-oriented control (FOC), and space-vector PWM. The on-chip 10/12-bit ADC samples phase currents and DC-bus voltage with deterministic latency, while dedicated PWM modules generate complementary outputs with programmable dead time for three-phase inverter bridges. 16 KB SRAM is sufficient for FOC state variables and estimator buffers, while 256 KB Flash hosts the full vector-control library and application layer. The -40C to +150C operating range also supports industrial cabinet installations where ambient can approach 85C. For higher-end motor control with DSP (sinusoidal/space-vector), upgrade to the dsPIC33FJ256GP610A-H/PF which adds hardware MAC and dual 40-bit accumulators.
موصى به
Uninterruptible Power Supply (UPS) and Power Conversion Control
In UPS, inverter, and DC-DC power-conversion applications, the PIC24HJ256GP610A-H/PF provides the digital control backbone for closed-loop current/voltage regulation, MPPT for solar converters, and grid-synchronization routines for inverter tie-ins. The 40 MIPS core executes digital compensator (PI/PID) calculations and RMS calculations within a single PWM period (typically 50-100 us at 20 kHz switching). Its ADC pairs with high-resolution PWM to drive digital control of PFC and full-bridge topologies, while ECAN allows grid-tied paralleling across modules. The 256 KB Flash is sufficient for full state-machine control firmware, and the 16 KB SRAM supports per-cycle sample buffers and soft-start ramps. AEC-Q100 qualification also lets the same firmware serve ruggedized industrial UPS products.
موصى به
Advanced Sensing and Instrumentation
The PIC24HJ256GP610A-H/PF's combination of 40 MIPS throughput, 16 KB SRAM, and 10/12-bit ADC makes it a strong fit for sensor aggregation platforms that sample multiple analog sensors, perform digital filtering, and stream results over UART/SPI/CAN. With its hardware multiplier and DMA engine, the device can run moving-average and FIR filters on ADC streams without CPU intervention, freeing cycles for higher-level processing. The ECAN and dual-UART blocks provide redundant communication paths for safety-critical instrumentation, while the wide operating temperature range supports field-deployed instruments. The 100-pin TQFP package exposes enough I/O for multi-sensor daughterboards, and the 256 KB Flash hosts firmware image plus a bootloader for OTA-style firmware refresh.
موصى به
Industrial HMI and Embedded Control
Human-machine interface (HMI) panels and embedded control modules benefit from the PIC24HJ256GP610A-H/PF's 40 MIPS throughput, which can drive SPI TFT displays, scan keypads, and handle ECAN/Modbus communications simultaneously. The 16 KB SRAM holds display framebuffers and protocol descriptors, while the 256 KB Flash accommodates full graphics libraries and Modbus stacks. The on-chip RTCC provides time-stamping for event logging, and the PWM outputs drive backlight dimming or buzzer tones. The TQFP-100 footprint is widely supported by industrial module vendors, enabling rapid design-in on standard carrier boards. AEC-Q100 qualification also lets the same hardware platform serve harsh-environment industrial HMIs.
موصى به
Solar Inverter and Renewable Energy Control
Solar micro-inverters, string inverters, and charge controllers benefit from the PIC24HJ256GP610A-H/PF's 40 MIPS performance and rich PWM/ADC peripheral set, which together implement MPPT algorithms (Perturb & Observe, Incremental Conductance) and grid-synchronization loops. The AEC-Q100 qualification and -40C to +150C operating range ensure reliable operation in outdoor enclosure environments where ambient can exceed 70C inside sealed NEMA-rated boxes. 256 KB Flash hosts the grid-tie firmware and protection routines (over-current, anti-islanding per UL 1741), while 16 KB SRAM holds MPPT state variables and grid-synchronization PLL accumulators. ECAN enables parallel-string communication in large photovoltaic arrays.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC24HJ256GP610A-H/PF — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC24HJ256GP610A-I/PF | PIC24HJ256GP610A-E/PF | dsPIC33FJ256GP610A-H/PF | PIC24HJ128GP610A-H/PF | PIC24HJ256GP610A-I/PT | PIC24HJ256GP210A-H/PF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (12x12) - pin-compatible electrically | TQFP-100 (14x14) - same |
| Core Architecture | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | dsPIC33F 16-bit + DSP, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS | PIC24H 16-bit, 40 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB | 16 KB |
| Operating Temperature | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +150C (H grade) | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +150C (H grade) |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| DSP Engine | No | No | No | Yes (hardware MAC, dual 40-bit accumulators) | No | No | No |
أبرز الفروقات
- Highest operating temperature grade in family (مقابلPIC24HJ256GP610A-I/PF)
- 256 KB Flash matches sub-family maximum (مقابلPIC24HJ128GP610A-H/PF)
- Same TQFP-100 pinout as dsPIC33F DSP variant (مقابلdsPIC33FJ256GP610A-H/PF)
ملاحظات التصميم
Estimated: At 40 MIPS core activity and 3.3 V supply, the PIC24HJ256GP610A-H/PF core I_DD is approximately 50-70 mA depending on peripheral use. Provide a low-noise 3.3 V LDO such as the MCP1755 (500 mA) or a switching regulator with adequate input/output capacitance. Decouple every VDD pin with a 0.1 uF ceramic placed within 5 mm of the pin, and place a bulk 4.7-10 uF tantalum or ceramic near the package. Tie all unused VDD pins to the supply, and all unused AVDD pins to the analog supply to ensure proper ADC operation.
The TQFP-100 (14x14 mm) package requires careful PCB layout to maintain signal integrity on the high-speed oscillator and ECAN lines. Route the crystal traces (OSC1/OSC2) as short as possible with guard traces to ground, and keep them away from switching power traces. Use a four-layer PCB with a dedicated ground plane under the MCU; the exposed thermal pad (where present on variants) must be soldered to a copper pour connected to VSS for thermal dissipation. Place the programming/debug header (PGECx/PGEDx) close to the MCU to allow reliable in-circuit debugging with MPLAB ICD 3 or PICkit 4.
Do not apply signals to any pin before VDD has reached its operating range; this can cause latch-up via the ESD protection diodes. The remappable peripheral pins (RPx) require the Peripheral Pin Select (PPS) registers to be configured in firmware before use - failing to do so leaves the pin in GPIO mode. When migrating from -I to -H grade, verify your application's ambient temperature does not exceed 85C, otherwise specify the -H grade from the start. For automotive designs, always use the AEC-Q100 qualified -H/PF variant rather than the industrial -I/PF.
Estimated: At maximum rated junction temperature of 150C and typical 50 mA active current at 3.3 V, the PIC24HJ256GP610A-H/PF dissipates 0.165 W. The TQFP-100 (14x14 mm) junction-to-ambient thermal resistance (theta_JA) is approximately 50 C/W on a standard 4-layer JEDEC test PCB, allowing operation at 150C junction with ambient up to ~138C. In practice, design for junction below 125C to maintain margin; add a thermal copper pour under the package connected to VSS to reduce theta_JA in still-air enclosures. For forced-air or sealed-box installations, derate further based on measured delta-JA.
معلومات الامتثال
AEC-Q100 qualified per Microchip product documentation. RoHS compliant per Microchip product page. REACH compliant per Microchip product page. Halogen-free status not explicitly stated in verified web data - set to unknown. Conflict minerals reporting compliant per Microchip policy.
