XC6SLX45-3FGG676C - Spartan-6 LX 43,661-Cell FPGA | Xilinx
MPN: XC6SLX45-3FGG676C ✓ نشطXC6SLX45-3FGG676C نظرة عامة
A field-programmable gate array, or FPGA, is a programmable semiconductor that combines configurable logic, programmable interconnect, memory resources, and dedicated input/output blocks. Within the product hierarchy, the XC6SLX45 belongs to the Spartan-6 LX FPGA family and the broader Xilinx programmable-logic portfolio. Its 43,661 logic cells support parallel digital processing, control logic, interface bridging, and embedded signal-processing designs where fixed-function logic would require excessive board area.
The device is manufactured on a 45 nm CMOS technology and operates with a 1.2 V core voltage. The -3 suffix identifies the highest-performance speed grade listed for the Spartan-6 LX family. Distributed RAM, block RAM, digital clock management, and programmable I/O resources allow designs to combine control functions with moderate data processing. The package provides 676 balls for power distribution, configuration access, and signal interconnection in high-pin-count designs.
Engineering use depends on the complete device configuration, selected I/O standards, clocking scheme, and system timing constraints. A 500 MHz internal-frequency figure is listed in the device information, but it should not be treated as a guaranteed operating frequency for every design. External memory interfaces, high-speed transceivers, clock inputs, and timing-critical interfaces must be evaluated against the applicable Xilinx documentation and simulation results.
Typical applications include industrial automation controllers, embedded video and image-processing systems, communications infrastructure, test and measurement equipment, and compact control platforms. The 676-ball BGA package is particularly useful where I/O density is important and the PCB can support controlled escape routing, fine-pitch assembly, and appropriate thermal management.
Design planning should include the Spartan-6 configuration scheme, supported memory interfaces, bank-specific supply requirements, decoupling, clock topology, and pin assignments. A new PCB revision should use the manufacturer package drawing and pinout rather than inferring ball locations from a generic BGA diagram. For replacements, verify the speed grade, temperature grade, package ball map, voltage requirements, and configuration compatibility before treating a device as interchangeable.
This product page consolidates the device identity, package information, comparison guidance, and practical implementation considerations into one engineering reference. It also identifies where design verification must rely on the manufacturer documentation, particularly for ball assignments, power sequencing, timing, and configuration details.
بدائل مباشرة لـ XC6SLX45-3FGG676C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC6SLX45-3FGG676C (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Device Type, Operating Temperature, Speed Grade.
XC6SLX45-3FG676I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-2FGG676C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-2FGG676I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-2FG676I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-3FGG676I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX45-3FGG676C الحدود القصوى والخصائص الكهربائية
| Device Type | Spartan-6 LX Field Programmable Gate Array |
| Logic Cells | 43,661 cells |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Internal Frequency | 500 MHz |
| العلبة | 676-ball BGA |
| Package Outline | MO-275 |
| Package Dimensions | 15 mm x 15 mm |
| Package Pitch | 0.80 mm |
| Surface Mounting | Surface Mount |
| درجة حرارة التشغيل | 0°C to 85°C |
| Speed Grade | -3 |
| Lead-Free Status | Lead Free |
دليل تكوين أطراف XC6SLX45-3FGG676C 0.80 mm
تكوين الأطراف لـ XC6SLX45-3FGG676C (حزمة 0.80 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC6SLX45-3FGG676C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC6SLX45-3FGG676C مناسب لـ 6 التطبيقs: Industrial Automation and Motion Control, Embedded Video and Image Processing, Communications Infrastructure, Test and Measurement Equipment, Network Security Appliances, Aerospace Ground and Control Systems.
Industrial Automation and Motion Control
The XC6SLX45-3FGG676C fits industrial automation controllers that combine sequencing, machine interfaces, and moderate parallel processing. Its 43,661 logic cells provide substantial programmable capacity, while the 676-ball BGA exposes a high I/O count for encoder inputs, digital I/O, communications, and control logic. The listed 0°C to 85°C operating range suits many factory environments. During implementation, partition the design into timing-safe control, communications, and diagnostics domains, then validate each interface against the selected I/O standards. Because the package uses a 0.80 mm pitch, careful escape routing, uniform power distribution, and assembly-process control are essential for manufacturing yield.
موصى به
Embedded Video and Image Processing
The XC6SLX45-3FGG676C is suitable for embedded image-processing systems that require parallel pixel pipelines, control logic, and programmable data paths. The Spartan-6 LX architecture provides 43,661 logic cells, while the -3 speed grade offers the highest listed performance level for the family. Designers can implement parallel stages for capture synchronization, filtering, color conversion, and interface bridging. Practical implementation requires careful clocking, register balancing, and memory bandwidth planning to prevent pipeline stalls. The 676-ball package also supports dense board routing, although high-speed video signals demand controlled trace geometry, solid reference planes, and careful simulation of source-synchronous interfaces.
موصى به
Communications Infrastructure
The XC6SLX45-3FGG676C can be used in communications equipment requiring deterministic programmable logic, protocol termination, buffering, and system control. Its 43,661 logic cells make it suitable for parallel data-plane functions, while the 676-ball package provides the I/O density needed for multiple buses and high-speed links. The design must account for the -3 speed grade during timing closure, especially on external memory and network interfaces. Constrain clocks and I/O timing correctly, validate signal integrity on long routes, and reserve power-management resources for link activity. For redundant or line-card systems, validate recovery behavior and thermal performance across the complete operating environment.
موصى به
Test and Measurement Equipment
The XC6SLX45-3FGG676C is appropriate for programmable test and measurement platforms that combine acquisition control, sequencing, timing logic, and data processing. Its logic capacity supports parallel decision paths and instrument-control functions, while the -3 speed grade is useful when timing margin is important. Engineers can partition acquisition, trigger, analysis, and communications logic into predictable clock domains. To obtain repeatable performance, use registered interfaces, disciplined clock distribution, and I/O constraints derived from the selected board environment. The 676-ball BGA footprint demands careful component placement and dense escape routing, but it allows a high-function-count instrument to be implemented without several smaller programmable devices.
موصى به
Network Security Appliances
The XC6SLX45-3FGG676C is applicable to network security appliances that perform packet classification, header parsing, filtering, and hardware-assisted control. The 43,661 logic cells allow parallel packet-processing stages, while the 676-ball package supports interfaces to external memory and networking components. Performance depends on architecture rather than a standalone internal-frequency claim, so pipeline depth, memory bandwidth, and lookup-table utilization require early estimation. Use pipelined datapaths to improve clock rate, maintain balanced branch and routing delays, and include debug access without exposing it in production systems. The lead-free package designation supports modern assembly processes, but production validation must still address moisture handling and solder-joint reliability.
موصى به
Aerospace Ground and Control Systems
The XC6SLX45-3FGG676C can support programmable control, monitoring, and telemetry functions in aerospace ground-support equipment where a high-pin-count FPGA provides extensive interface flexibility. Its 43,661 logic cells support parallel control logic and fault-management functions, while the -3 grade provides additional timing margin for critical pipelines. However, the listed 0°C to 85°C range is not an aerospace temperature qualification, and the device is not identified as AEC-Q100 qualified. Use the part in ground equipment or obtain a specifically qualified source before approving it for airborne use. System engineers should implement watchdog supervision, fail-safe states, configuration protection, and independent monitoring around the FPGA.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC6SLX45-3FGG676C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC6SLX45-3FG676I | XC6SLX45-2FGG676C | XC6SLX45-2FGG676I | XC6SLX45-2FG676I | XC6SLX45-3FGG676I |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | 676-ball FBGA | 676-pin FBGA | 676-pin FBGA | 676-pin FBGA | 676-pin FBGA | 676-pin FBGA |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 | -2 | -2 | -2 | -3 |
أبرز الفروقات
- Highest listed Spartan-6 LX speed grade (مقابلXC6SLX45-2FGG676C)
- Commercial ordering designation retained in the target (مقابلXC6SLX45-3FG676I)
- Same 43,661-cell architecture as the lower-speed candidate (مقابلXC6SLX45-2FG676I)
- Matches the 676-ball package format of same-family candidates (مقابلXC6SLX45-3FGG676I)
ملاحظات التصميم
Create the PCB footprint from the manufacturer’s MO-275 package drawing rather than a generic 676-ball BGA template. Verify ball-pitch geometry, pad diameters, solder-mask clearance, and assembly-process requirements. The listed 0.80 mm pitch leaves limited routing space, so route escape paths as a complete design problem rather than assigning them after logic placement. Include thermal-relief or via-stitching features appropriate to the chosen power and ground architecture.
Follow the manufacturer’s recommended decoupling and power-supply topology for every voltage rail. Separate core and I/O supply considerations during plane planning, and check bank voltage compatibility against the selected I/O standards. Do not infer a valid power sequence or decoupling value from the package name alone. Verify the selected configuration method, startup behavior, and power-supply tolerances in the device documentation before schematic release.
Constrain clocks and high-speed interfaces against the actual board and device timing assumptions. Use registered I/O where appropriate, balance pipeline stages, and simulate external memory or source-synchronous interfaces before committing to layout. The 500 MHz internal-frequency listing does not guarantee that an I/O interface will operate at 500 MHz; actual performance depends on architecture, resources, board loss, and timing closure.
Avoid treating every XC6SLX45 676-ball ordering code as automatically interchangeable. Confirm the speed grade, operating-temperature grade, package suffix, resource configuration, configuration mode, and exact ball map. For a migration from -3 to -2, re-run timing analysis rather than assuming equivalent performance. For any suffix change involving industrial or commercial grading, verify environmental requirements and procurement traceability.
معلومات الامتثال
The device is identified as lead-free and associated with package outline MO-275. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status require manufacturer declarations for the exact orderable MPN.