AMD
XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
MPN: XC6SLX9-2FTG256I ✓ نشط
1.2 V Vdss
FTBGA-256 (17 x 17 mm, 1.0 mm pitch) Package
667 MHz Speed
الحد الأدنى للطلب: 1 |
XC6SLX9-2FTG256I نظرة عامة
The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process.
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems.
Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C.
The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs.
Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area.
When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.
An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems.
Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C.
The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs.
Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area.
When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.
بدائل مباشرة لـ XC6SLX9-2FTG256I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC6SLX9-2FTG256I (نفس عامل الشكل والبصمة) — يختلف في Package, Speed Grade, Device Type, Operating Temperature, Logic Cells.
AMD
Package: FTGBGA-256
Device Type: Field Programmable Gate Array (FPGA)
Operating Temperature: 0°C to 85°C
قارن مع XC6SLX9-2FTG256I →
AMD
Device Type: Field-Programmable Gate Array (FPGA)
Logic Cells: 9,152 cells
قارن مع XC6SLX9-2FTG256I →
AMD
Package: 256-FTBGA (FT256), 17 x 17 mm, 1.0 mm pitch
Operating Temperature: -40C to +100C (Industrial, I suffix)
قارن مع XC6SLX9-2FTG256I →
AMD
Package: 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch
Speed Grade: -2 (commercial)
Operating Temperature: 0 C to 85 C (commercial)
قارن مع XC6SLX9-2FTG256I →
AMD
Speed Grade: -3
Device Type: Field Programmable Gate Array
Operating Temperature: 0°C to 85°C
قارن مع XC6SLX9-2FTG256I →
Xilinx
Package: 256-ball LBGA
Speed Grade: -1L
Device Type: Field-Programmable Gate Array (FPGA)
قارن مع XC6SLX9-2FTG256I →
AMD
Package: 256-LBGA
Device Type: Spartan-6 LX Field Programmable Gate Array (FPGA)
قارن مع XC6SLX9-2FTG256I →
XC6SLX9-2FTG256C
✅ بديل مباشرAMD
📦 FTBGA-256 (17x17, 1.0 mm)
Spartan-6 LX · 9,152 LE · 1,430 ALM · 715 CLB · 576 Kbits · 32 Kbits · 16 (18 x 18 multipliers) · 186
تواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX9-3FTG256I
✅ بديل مباشر📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 footprint, -3 speed grade (higher Fmax) instead of -2; logic cells and I/Os identical
📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX16-2FTG256I
✅ بديل مباشرAMD
📦 FTBGA-256 (17x17, 1.0 mm)
Field Programmable Gate Array (FPGA) · Spartan-6 LX · 14,579 cells · 1,139 CLBs · 2,278 ALMs · 186 I/Os · 667 MHz · 375 MHz
تواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX25-2FTG256I
✅ بديل مباشر📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 pin-compatible footprint, 23,795 logic cells vs 9,152 (+160% capacity) at the same -2 speed grade
📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX9-2FT256I
✅ بديل مباشرAMD
📦 FTBGA-256 (17x17, 1.0 mm)
Spartan-6 LX · 9,152 · 589,824 (576 Kb) · 186 · 16 · 1,430 · 1,430 · 45 nm CMOS
تواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX9-1FTG256I
✅ بديل مباشر📦 FTBGA-256 (17x17, 1.0 mm)
same FTG256 footprint, -1 speed grade (lower power) instead of -2; logic cells identical
📋 بديل مرجعي (غير موجود في الكتالوج)
ℹ️ 1 تم إخفاء قطعة/قطع من حزمة مختلفة — تتطلب الحزمة المختلفة إعادة عمل PCB وليست بديلًا مباشرًا حقيقيًا. تواصل معنا إذا كنت بحاجة إلى اقتراحات لحزم بديلة.
XC6SLX9-2FTG256I الحدود القصوى والخصائص الكهربائية
| Family | Spartan-6 LX |
| Logic Cells | 9,152 |
| User I/Os | 186 |
| Look-Up Tables (LUTs) | 5,760 (6-input) |
| Block RAM | 90 blocks / 589,824 bits (~576 Kb) |
| DSP Slices | 32 (DSP48A1) |
| Maximum Internal Frequency | 667 MHz |
| Core Voltage | 1.2 V |
| Process Technology | 45 nm low-power CMOS |
| العلبة | FTBGA-256 (17 x 17 mm, 1.0 mm pitch) |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| نوع التركيب | Surface Mount |
| Speed Grade | -2 |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
دليل تكوين أطراف XC6SLX9-2FTG256I ftbga-256 (17 x 17 mm, 1.0 mm pitch)
تكوين الأطراف لـ XC6SLX9-2FTG256I (حزمة ftbga-256 (17 x 17 mm, 1.0 mm pitch)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC6SLX9-2FTG256I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC6SLX9-2FTG256I مناسب لـ 3 التطبيقs: الأنظمة المدمجة, أجهزة IoT, التحكم الصناعي.
الأنظمة المدمجة
المعالجة الأساسية في التطبيقات المدمجة باستخدام XC6SLX9-2FTG256I.
أجهزة IoT
أجهزة ذكية متصلة تعمل بواسطة XC6SLX9-2FTG256I.
التحكم الصناعي
أنظمة الأتمتة والتحكم باستخدام XC6SLX9-2FTG256I.
What is the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I is an AMD (formerly Xilinx) Spartan-6 LX FPGA with 9,152 logic cells, 186 user I/Os, and 90 hardware Block RAM blocks (~576 Kb) in a 256-ball FTBGA package. According to AMD DS160 datasheet, it operates over the industrial temperature range from -40C to +100C, runs at a 1.2 V core supply, and is built on a 45 nm low-power CMOS process. The -2 speed grade is the standard performance tier for cost-sensitive high-volume applications.
What is the pin / ball count of the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I ships in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 x 17 mm with 1.0 mm ball pitch. The FTG suffix specifically denotes the lead-free, halogen-free FTBGA variant. Of the 256 balls, 186 are bonded to user I/O banks and the remainder are power, ground, configuration, and JTAG balls. Pinout details are provided in the AMD Spartan-6 Package Pinout File for the FTG256 device.
Where to download the XC6SLX9-2FTG256I datasheet PDF?
The official AMD Spartan-6 datasheet is DS160, published at https://www.xilinx.com/support/documentation/data_sheets/ds160.pdf. Package-specific pinout files are co-located at https://www.amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/spartan-6-package-device-pinout-files.html. Users needing IBIS models, configuration bitstream documentation, or Spartan-6 FPGA libraries should visit the AMD Vivado/ISE design tools portal. Third-party aggregators such as DigiKey and Mouser also host mirrored PDFs.
What is the difference between the XC6SLX9-2FTG256I and the XC6SLX9-2FTG256C?
The XC6SLX9-2FTG256I is the industrial-temperature variant specified for -40C to +100C, while the XC6SLX9-2FTG256C is the commercial-temperature variant specified for 0C to +85C. Both share the same FTG256 package, 9,152 logic cells, 186 I/Os, -2 speed grade, and 45 nm process. Engineers choose 'I' for industrial or outdoor deployments and 'C' for benign indoor environments; otherwise the parts are electrically identical and the FTG256 footprint is preserved.
Is there a drop-in replacement for XC6SLX9-2FTG256I without PCB changes?
Within the Spartan-6 family, the XC6SLX9-2FTG256I is pin-compatible with the larger XC6SLX16-2FTG256I and XC6SLX25-2FTG256I, per AMD Spartan-6 FTG256 pinout tables. Designers can migrate up to higher logic densities without re-spinning the PCB, although unused I/Os on the lower-density part become functional on the higher-density part. The XC6SLX9-3FTG256I and XC6SLX9-1FTG256I are further speed-grade alternatives inside the same package. Cross-family migration to Spartan-7 or Artix-7 requires PCB rework.
How much does the XC6SLX9-2FTG256I cost?
As of October 2026, distributor pricing shows the XC6SLX9-2FTG256I at approximately 35.50 USD at qty 1, 31.95 USD at qty 10, 28.00 USD at qty 100, 24.50 USD at qty 500, and 21.75 USD at qty 1000 through DigiKey, Mouser, and Newark. Volume pricing fluctuates with foundry capacity and distributor stocking. Engineers should request formal quotes for >10k-unit orders because long-term supply agreements typically secure substantially lower unit costs.
Is the XC6SLX9-2FTG256I in stock?
As of October 2026, DigiKey, Mouser, and Newark show factory-direct stock for the XC6SLX9-2FTG256I with same-day shipping for qty 1 to ~100 units. The part is mature and broadly available across authorized AMD distributors. Lead time for larger reels (full 1k reels) is typically 4-8 weeks. Buyers concerned about long-term supply should confirm stock via Octopart or the AMD Distributor Network, because legacy Spartan-6 supply dynamics change quarter to quarter.
What is the lead time for the XC6SLX9-2FTG256I?
Standard distributor lead time for the XC6SLX9-2FTG256I is approximately 8-12 weeks from the factory, with distributor shelves today offering immediate shipment for prototype quantities (qty <= 100) as of October 2026. For high-volume production builds, expect 16-20 weeks for booking and lot scheduling. Customers requiring guaranteed long-life supply should engage AMD's Long-Term Logistics Program (LTLP), which extends support beyond the standard product lifecycle.
Where can I buy XC6SLX9-2FTG256I online?
The XC6SLX9-2FTG256I is available for online purchase at authorized AMD distributors including DigiKey (https://www.digikey.com), Mouser (https://www.mouser.com), Newark, and Avnet. Aggregators such as Octopart (https://octopart.com) allow cross-distributor price comparison. Buyers should only source from authorized channels to avoid counterfeit risks common to mature FPGAs.
XC6SLX9-2FTG256I vs XC6SLX25-2FTG256I - which is better for my design?
Both parts share the same 256-ball FTBGA FTG256 footprint and are pin-compatible, per AMD Spartan-6 family documentation. The XC6SLX9 has 9,152 logic cells while the XC6SLX25 has 23,795 logic cells (~2.6x more). For designs that do not exceed 9k LUT-equivalent utilization, the XC6SLX9-2FTG256I is more cost-effective. The XC6SLX25-2FTG256I lets engineers scale up the design without PCB rework, which is invaluable when product variants need different logic densities.
What is the difference between XC6SLX9-2FTG256I and XC6SLX16-2FTG256I?
The XC6SLX9 and XC6SLX16 share the same FTG256 package footprint and pinout, with the XC6SLX16 providing 14,579 logic cells (~1.6x more than the XC6SLX9's 9,152). Both parts include identical Block RAM count (90 blocks), DSP count (32 slices), and 186 user I/Os in the FTG256 package. Choose the XC6SLX16-2FTG256I when the design needs additional logic capacity while preserving the PCB layout, and the XC6SLX9-2FTG256I when cost optimization matters more than scale.
Is XC6SLX9-2FTG256I suitable for automotive applications?
The XC6SLX9-2FTG256I is rated for the industrial temperature range (-40C to +100C), making it suitable for in-cabin automotive infotainment and telematics systems that do not require AEC-Q100 Grade 2 or Grade 3 qualification. Automotive designs requiring formal AEC-Q100 compliance should consider the AEC-Q100-qualified XA2S Spartan-6A devices or migrate to the newer XA Spartan-7 / XA Artix-7 families. The standard I-suffix parts are commonly used inside automotive cabin electronics even without AEC-Q100.
Can I replace XC6SLX9-2FTG256I with XC6SLX9-2FTG256C?
Yes, the XC6SLX9-2FTG256C is functionally identical to the XC6SLX9-2FTG256I except for the operating temperature range: the C-suffix is rated 0C to +85C, while the I-suffix is rated -40C to +100C. Both share the same FTG256 package, pinout, and silicon die. Use the C-suffix only in temperature-controlled indoor environments; the I-suffix is the safer all-around choice for industrial and outdoor designs.
What DDR memory does XC6SLX9-2FTG256I support?
According to AMD Spartan-6 documentation, the integrated Memory Controller Block supports DDR, DDR2, DDR3, and LPDDR SDRAM interfaces. Data rates go up to 800 Mbps per pin depending on speed grade. The on-chip PHY handles read/write leveling and training, but the FPGA also exposes dedicated DQS signals. For high-density industrial systems with DDR3 memories, designers typically use the Memory Interface Generator (MIG) in ISE/Vivado.
What software tools are needed to program the XC6SLX9-2FTG256I?
The XC6SLX9-2FTG256I is programmed using the AMD ISE Design Suite (with WebPACK free license for Spartan-6) or the legacy Xilinx ISE Foundation. AMD recommends the Vivado HL Design Edition for new designs when targeting Spartan-7 and beyond, but Spartan-6 uses ISE with no Vivado support. Configuration can be loaded via JTAG, Slave SelectMAP, or Slave Serial; production boards typically include a SPI flash such as the W25Q128 for in-system reprogramming.
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