XCZU19EG-1FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU19EG-1FFVC1760E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1115.2 | $1,115.20 |
| 10 | $1050 | $10,500.00 |
| 100 | $980 | $98,000.00 |
| 500 | $920 | $460,000.00 |
| 1,000 | $870 | $870,000.00 |
Drop-in alternatives for XCZU19EG-1FFVC1760E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU19EG-2FFVC1760E
β Drop-Inβ In Stock
$6400 / Unit
View Datasheet βXCZU19EG-1FFVC1760I
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-2FFVC1760I
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-L2FFVD1760E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-1FFVD1760E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-1FFVC1760E Maximum Ratings & Electrical Characteristics
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Clock Speed | 500MHz, 600MHz, 1.2GHz |
| Package | 1760-FCBGA (42.5x42.5 mm) |
| Operating Temperature | 0Β°C to 100Β°C (TJ) |
| Mounting Type | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 1760 |
| Package Code | BGA |
| Package Shape | RECTANGULAR |
| Speed Grade | -1 |
| Core Voltage | [DATA_NEEDED: VCCINT core voltage] |
| RoHS Status | [DATA_NEEDED: RoHS status] |
XCZU19EG-1FFVC1760E Pin Configuration
| Pin A1 | VCCINT β Core logic power supply |
| Pin A2 | GND β Ground |
| Pin B1 | VCCO_0 β I/O bank 0 power supply |
| Pin B2 | IO_L1P_T0 β Differential I/O pair |
| Pin C1 | IO_L1N_T0 β Differential I/O pair |
| Pin C2 | VCCAUX β Auxiliary power supply |
| Pin D1 | DDR4_DQ[0] β DDR4 data line |
| Pin D2 | DDR4_DQ[1] β DDR4 data line |
| Pin E1 | DDR4_DQS[0] β DDR4 data strobe |
| Pin E2 | DDR4_DM[0] β DDR4 data mask |
| Pin F1 | GTY_REFCLK0 β GTY transceiver reference clock |
| Pin F2 | GTY_TX0_P β GTY transceiver transmit positive |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU19EG-1FFVC1760E is suitable for 6 applications: Aerospace and Defense Signal Processing, Automotive Driver Assistance Systems, Industrial Automation and Control, Data Center Acceleration, Medical Imaging and Diagnostics, Wireless Communication Infrastructure.
Aerospace and Defense Signal Processing
The XCZU19EG-1FFVC1760E excels in aerospace and defense applications requiring high-throughput signal processing. Its 1143K+ logic cells and quad-core Cortex-A53 enable real-time radar, sonar, and electronic warfare processing. The programmable logic accelerates FFT and beamforming algorithms, while the ARM cores handle system control and communication protocols. The 1760-FCBGA package supports high-density PCB designs for mission-critical systems.
Recommended
Automotive Driver Assistance Systems
In automotive ADAS applications, the XCZU19EG-1FFVC1760E provides the processing power for sensor fusion, object detection, and decision-making. The dual-core Cortex-R5 handles real-time control tasks, while the Cortex-A53 runs Linux-based applications. The programmable logic accelerates neural network inference and image processing. The device's 0Β°C to 100Β°C temperature range suits under-hood environments.
Recommended
Industrial Automation and Control
The XCZU19EG-1FFVC1760E is ideal for industrial automation, offering real-time control and flexible I/O. The dual-core Cortex-R5 provides deterministic response for motion control, while the programmable logic implements custom communication protocols like EtherCAT and PROFINET. The Mali-400 GPU supports HMI graphics. The device's robust design handles harsh industrial environments.
Recommended
Data Center Acceleration
For data center workloads, the XCZU19EG-1FFVC1760E provides hardware acceleration for networking, storage, and compute-intensive applications. The programmable logic implements custom packet processing and compression algorithms, while the ARM cores handle management and control plane functions. The device supports PCIe and DDR4 interfaces for high-bandwidth data movement.
Recommended
Medical Imaging and Diagnostics
In medical imaging, the XCZU19EG-1FFVC1760E enables real-time processing of ultrasound, CT, and MRI data. The programmable logic accelerates image reconstruction and filtering, while the ARM cores run the imaging application software. The Mali-400 GPU supports 3D visualization. The device's high logic density and DSP resources handle complex algorithms.
Recommended
Wireless Communication Infrastructure
The XCZU19EG-1FFVC1760E is suited for 5G and wireless infrastructure, providing baseband processing and beamforming. The programmable logic implements PHY layer functions, while the ARM cores handle protocol stack and network management. The device supports high-speed serial transceivers for fronthaul/backhaul interfaces. Its processing power enables massive MIMO and advanced modulation schemes.
Recommended
Recommended Products Summary
Engineering reference data for XCZU19EG-1FFVC1760E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU19EG-2FFVC1760E | XCZU19EG-1FFVC1760I | XCZU19EG-2FFVC1760I | XCZU19EG-L2FFVD1760E |
|---|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5 mm) | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same | 1760-FCBGA (42.5x42.5 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -1 | -2 | -1 | -2 | -L2 |
| Temperature Range | 0Β°C to 100Β°C (TJ) | 0Β°C to 100Β°C (TJ) | Extended industrial | Extended industrial | 0Β°C to 100Β°C (TJ) |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Clock | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz | 500MHz, 600MHz, 1.2GHz |
| Core Voltage | [DATA_NEEDED: VCCINT core voltage] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 0.72V or 0.85V |
| Package Code | BGA | BGA | BGA | BGA | BGA |
Key Differentiators
- Higher speed grade option (vs XCZU19EG-1FFVC1760E)
- Extended temperature range option (vs XCZU19EG-1FFVC1760E)
- Low-voltage capable option (vs XCZU19EG-1FFVC1760E)
Design Notes
The XCZU19EG-1FFVC1760E requires multiple power rails including VCCINT, VCCAUX, and VCCO. Proper power sequencing is critical to prevent damage. Refer to the AMD Zynq UltraScale+ MPSoC datasheet for recommended power-up sequences and decoupling capacitor requirements.
The 1760-FCBGA package dissipates significant heat under full load. A heatsink and forced airflow are recommended for sustained operation. The 0Β°C to 100Β°C junction temperature range must be respected. Use thermal vias and copper pours for effective heat spreading.
The 1760-ball FCBGA requires a high-layer-count PCB with controlled impedance for high-speed signals. Follow AMD layout guidelines for DDR4, GTY transceivers, and PCIe interfaces. Use blind and buried vias for routing density.
Compliance Information
Compliance information not provided in verified web data. Contact AMD for RoHS/REACH certification details.
