XCZU19EG-2FFVC1760E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU19EG-2FFVC1760E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8495 | $8,495.00 |
| 10 | $7890 | $78,900.00 |
| 100 | $7200 | $720,000.00 |
| 500 | $6800 | $3,400,000.00 |
| 1,000 | $6400 | $6,400,000.00 |
Drop-in alternatives for XCZU19EG-2FFVC1760E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU19EG-2FFVC1760I
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-1FFVC1760E
β Drop-Inβ In Stock
$870 / Unit
View Datasheet βXCZU19EG-2FFVD1760E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-L2FFVC1760E
β Drop-Inπ Reference alternative (not in catalog)
XCZU19EG-2FFVC1760E
β Drop-Inβ In Stock
$6400 / Unit
View Datasheet βXCZU19EG-2FFVC1760E Maximum Ratings & Electrical Characteristics
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 1143K+ |
| Processor Speed | 533 MHz, 600 MHz, 1.3 GHz |
| Package | 1760-FCBGA (42.5x42.5 mm) |
| User I/O | 512 |
| Series | Zynq UltraScale+ MPSoC EG |
| Core Voltage | 0.85V (standard) |
| Operating Temperature | 0C to +100C (E grade) |
| Mounting Type | Surface Mount |
| Number of Pins | 1760 |
| RoHS Status | Compliant |
| FPGA Architecture | UltraScale+ |
| Process Technology | 16nm FinFET |
| Primary Application | Embedded Computing, SDR, Medical Imaging |
| Speed Grade | -2 |
XCZU19EG-2FFVC1760E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCINT β Core logic power supply (0.85V) |
| Pin A3 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A4 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCAUX β Auxiliary power supply (1.8V) |
| Pin B2 | GND β Ground |
| Pin B3 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin B4 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin C1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin C2 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin C3 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin C4 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU19EG-2FFVC1760E is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, Data Center Acceleration, High-End Embedded Computing, Video Processing and Surveillance.
Software-Defined Radio
The XCZU19EG-2FFVC1760E is ideal for software-defined radio (SDR) systems. Its 1,143K+ logic cells can implement complex DSP chains for signal processing, while the quad-core Cortex-A53 at 1.3 GHz runs protocol stacks and control software. The high-speed transceivers support wideband RF interfaces, enabling flexible and reconfigurable radio platforms. The Mali-400 GPU can handle waveform visualization and user interfaces. This SoC provides the processing power and flexibility needed for advanced SDR applications.
Recommended
Medical Imaging
In medical imaging systems like ultrasound and CT scanners, the XCZU19EG-2FFVC1760E provides the high-performance computing needed for real-time image processing. The FPGA fabric can implement custom image processing pipelines, while the Cortex-A53 cores handle system control and communication. The 512 user I/O pins enable high-bandwidth interfaces to image sensors and displays. The device's reliability and long-term availability make it suitable for medical equipment.
Recommended
Aerospace and Defense
The XCZU19EG-2FFVC1760E is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its combination of a powerful processing system and large FPGA fabric enables the implementation of complex signal processing and encryption algorithms. The industrial temperature grade option (XCZU19EG-2FFVC1760I) supports operation in harsh environments. The device's high reliability and security features make it a trusted choice for defense systems.
Recommended
Data Center Acceleration
For data center applications, the XCZU19EG-2FFVC1760E can accelerate workloads such as network processing, storage, and AI inference. The FPGA fabric can implement custom accelerators that offload tasks from CPUs, improving performance and efficiency. The integrated PCIe and Ethernet controllers provide high-speed connectivity to host systems. The device's large logic capacity and high-speed transceivers make it a powerful platform for data center acceleration.
Recommended
High-End Embedded Computing
The XCZU19EG-2FFVC1760E is a powerful platform for high-end embedded computing applications such as industrial automation, robotics, and advanced driver-assistance systems (ADAS). The quad-core Cortex-A53 can run Linux or other operating systems, while the FPGA fabric provides deterministic, low-latency processing for real-time control. The Mali-400 GPU supports graphical user interfaces. This SoC offers a flexible and scalable solution for complex embedded systems.
Recommended
Video Processing and Surveillance
The XCZU19EG-2FFVC1760E is well-suited for video processing and surveillance systems. The FPGA fabric can implement video codecs, image enhancement, and object detection algorithms, while the Cortex-A53 cores handle video analytics and network streaming. The Mali-400 GPU can accelerate video processing tasks. The device's high-bandwidth I/O supports multiple camera inputs and high-resolution displays, making it a robust platform for advanced surveillance systems.
Recommended
Engineering reference data for XCZU19EG-2FFVC1760E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU19EG-2FFVC1760I | XCZU19EG-1FFVC1760E | XCZU19EG-2FFVD1760E |
|---|---|---|---|---|
| Package | 1760-FCBGA (42.5x42.5) | 1760-FCBGA (42.5x42.5) - same | 1760-FCBGA (42.5x42.5) - same | 1760-FCBGA (42.5x42.5) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 1143K+ | 1143K+ | 1143K+ | 1143K+ |
| Processor Speed | 533 MHz, 600 MHz, 1.3 GHz | 533 MHz, 600 MHz, 1.3 GHz | 400 MHz, 500 MHz, 1.2 GHz | 533 MHz, 600 MHz, 1.3 GHz |
| Temperature Grade | Extended (0C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V |
| User I/O | 512 | 512 | 512 | 512 |
| Speed Grade | -2 | -2 | -1 | -2 |
Key Differentiators
- Industrial temperature grade option (vs XCZU19EG-2FFVC1760E)
- Higher speed grade (vs XCZU19EG-1FFVC1760E)
- Low-voltage capable option (vs XCZU19EG-2FFVC1760E)
Design Notes
The XCZU19EG-2FFVC1760E requires multiple power rails with specific voltage levels and sequencing. The core voltage (VCCINT) is 0.85V, and the auxiliary voltage (VCCAUX) is 1.8V. Power supply sequencing is critical to prevent damage. Use a dedicated power management IC (PMIC) that supports the required sequencing order. Ensure adequate decoupling capacitors are placed close to the power pins.
The XCZU19EG-2FFVC1760E can dissipate significant power, especially when the FPGA fabric is fully utilized. A heatsink and active cooling (fan) are typically required. The thermal resistance of the 1760-FCBGA package is [DATA_NEEDED: thermal resistance]. Ensure adequate airflow and consider the ambient temperature in your design. Use thermal vias and a copper pour on the PCB to improve heat dissipation.
High-speed signals, such as DDR4 memory interfaces and high-speed transceivers, require careful PCB layout. Maintain controlled impedance for all high-speed traces. Use ground planes to provide a return path and minimize noise. Keep high-speed traces as short as possible and avoid vias where feasible. Follow AMD's PCB design guidelines for the Zynq UltraScale+ family.
Compliance Information
RoHS compliance is indicated by distributor data. Other compliance information is not explicitly stated in the provided data.
