PIC32MZ1024EFH100T-E/GJX - 200MHz FPU MCU 1MB Flash | Microchip
MPN: PIC32MZ1024EFH100T-E/GJX ✓ সক্রিয়PIC32MZ1024EFH100T-E/GJX সারাংশ
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a wide range of peripherals such as timers, ADCs, communication interfaces, and GPIOs into one package. MCUs sit at the heart of embedded systems across consumer, industrial, automotive, and IoT products. Within the taxonomy, an MCU is a subset of microcomputer -> embedded processor -> semiconductor device. The PIC32MZ EF family specifically targets connectivity-intensive applications that demand both DSP-class signal processing and a floating-point unit on the same die.
Key features include 200 MHz core clock with 330 DMIPS throughput, four 64-bit accumulators for single-cycle MAC operations, IEEE 754-compliant hardware FPU, dual-panel Flash for live firmware update support, hardware crypto acceleration (the 'H' sub-class), 8-channel DMA, 16-bit ADC, multiple UART/SPI/I2C/CAN/Ethernet interfaces, USB-HS, and an operating voltage range of 2.3V to 3.6V. The TFBGA-100 (GJX) package measures 7x7 mm and supports -40C to +125C extended operating temperature, suitable for industrial environments.
Architecturally, the PIC32MZ EF core is built on the MIPS Warrior M-class architecture, providing deterministic interrupt latency and tight C-language code density while delivering RISC-class performance. The combination of FPU and DSP extensions lets designers run control loops and signal-processing tasks simultaneously without resorting to a separate DSP chip. Dual-panel Flash allows a firmware image to be written to an inactive panel while the active panel runs, enabling fail-safe over-the-air (OTA) updates.
Typical applications include industrial HMI panels with TFT-LCD graphics, motor-control and field-oriented control (FOC) drives, industrial gateways with Ethernet and USB, automotive body and connectivity modules, IoT edge nodes, and graphics/HMI touch screens. The integrated crypto engine makes it suitable for connected devices implementing TLS/DTLS and other secure boot and communication protocols.
When designing with this part, plan for 2.3-3.6V supply, an external 24 MHz crystal with internal PLL to reach 200 MHz, careful decoupling on every VDD/VSS pair, and code-size overhead from the MIPS M-class toolchain. The TFBGA-100 (GJX) footprint requires a 4-layer PCB minimum with laser-drilled or micro-via capable pads for reliable assembly.
এর জন্য ড্রপ-ইন বিকল্প PIC32MZ1024EFH100T-E/GJX — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible PIC32MZ1024EFH100T-E/GJX (একই form factor এবং footprint) — পার্থক্য রয়েছে Operating Temperature, Package, FPU, Operating Voltage, Core Architecture.
PIC32MZ1024EFH100-E/GJX
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →PIC32MZ1024EFH100T-I/GJX
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
PIC32MZ1024EFG100T-I/GJX
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →PIC32MZ1024EFF100T-I/GJX
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →PIC32MZ1024EFE100T-E/GJX
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →PIC32MZ0512EFK100T-E/GJX
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →PIC32MZ1024EFH100T-E/GJX সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Manufacturer | Microchip Technology |
| Series | PIC32MZ EF |
| Core Architecture | MIPS Warrior M-class (MIPS32) |
| Core Width | 32-bit |
| সর্বোচ্চ ক্লক ফ্রিকোয়েন্সি | 200 MHz |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Program Memory Type | Dual-panel Flash (live update support) |
| RAM | 512 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| অপারেটিং তাপমাত্রা | -40 C to +125 C (Extended) |
| প্যাকেজ | 100-TFBGA, 7x7 mm (GJX) |
| মাউন্টিং টাইপ | Surface Mount |
| Connectivity | USB-HS, Ethernet (ENET), CAN, SQI, UART, SPI, I2C |
| Crypto Acceleration | Yes (hardware crypto engine) |
| RoHS স্ট্যাটাস | Compliant |
PIC32MZ1024EFH100T-E/GJX পিন কনফিগারেশন
| পিন A1 | VSS — Ground |
| পিন A2 | RD10/PMD10 — GPIO / Parallel Master Port data |
| পিন A3 | RD11/PMD11 — GPIO / Parallel Master Port data |
| পিন A4 | RD12/PMD12 — GPIO / Parallel Master Port data |
| পিন A5 | RD13/PMD13 — GPIO / Parallel Master Port data |
| পিন A6 | RD14/PMD14 — GPIO / Parallel Master Port data |
| পিন A7 | RD15/PMD15 — GPIO / Parallel Master Port data |
| পিন B1 | VDD — Core supply voltage |
| পিন B2 | RG6/SCK2 — GPIO / SPI2 clock |
| পিন B3 | RG7/SDO2 — GPIO / SPI2 data out |
| পিন B4 | RG8/SDI2 — GPIO / SPI2 data in |
| পিন B5 | RG9/SS2 — GPIO / SPI2 slave select |
| পিন B6 | RD0/PMD0 — GPIO / Parallel Master Port data |
| পিন B7 | RD1/PMD1 — GPIO / Parallel Master Port data |
| পিন C1 | VSS — Ground |
| পিন C2 | VDD — Core supply voltage |
| পিন C3 | OSC1/CLKI — External clock input / crystal |
| পিন C4 | OSC2/CLKO — Crystal output / clock output |
| পিন C5 | RD2/PMD2 — GPIO / Parallel Master Port data |
| পিন C6 | RD3/PMD3 — GPIO / Parallel Master Port data |
| পিন C7 | RD4/PMD4 — GPIO / Parallel Master Port data |
| পিন D1 | VSS — Ground |
| পিন D2 | RF4/PMA4 — GPIO / Parallel Master Port address |
| পিন D3 | RF5/PMA5 — GPIO / Parallel Master Port address |
| পিন D4 | RF6/PMA6 — GPIO / Parallel Master Port address |
| পিন D5 | RF7/PMA7 — GPIO / Parallel Master Port address |
| পিন D6 | RF8/PMA8 — GPIO / Parallel Master Port address |
| পিন D7 | RD5/PMD5 — GPIO / Parallel Master Port data |
| পিন E1 | VSS — Ground |
| পিন E2 | RA0/TMS — GPIO / JTAG test mode select |
| পিন E3 | RA1/TCK — GPIO / JTAG test clock |
| পিন E4 | RA2/TDI — GPIO / JTAG test data in |
| পিন E5 | RA3/TDO — GPIO / JTAG test data out |
| পিন E6 | RF9/PMA9 — GPIO / Parallel Master Port address |
| পিন E7 | RF10/PMA10 — GPIO / Parallel Master Port address |
| পিন F1 | VSS — Ground |
| পিন F2 | VREF+ — ADC positive reference |
| পিন F3 | AVDD — Analog supply voltage |
| পিন F4 | AVSS — Analog ground |
| পিন F5 | VBUS — USB bus voltage detect |
| পিন F6 | D+ — USB data plus |
| পিন F7 | D- — USB data minus |
| পিন G1 | VSS — Ground |
| পিন G2 | AN0 — Analog input / GPIO |
| পিন G3 | AN1 — Analog input / GPIO |
| পিন G4 | AN2 — Analog input / GPIO |
| পিন G5 | AN3 — Analog input / GPIO |
| পিন G6 | AN4 — Analog input / GPIO |
| পিন G7 | AN5 — Analog input / GPIO |
| পিন H1 | VSS — Ground |
| পিন H2 | VDD — Core supply voltage |
| পিন H3 | AN6 — Analog input / GPIO |
| পিন H4 | AN7 — Analog input / GPIO |
| পিন H5 | AN8 — Analog input / GPIO |
| পিন H6 | AN9 — Analog input / GPIO |
| পিন H7 | AN10 — Analog input / GPIO |
| পিন J1 | VSS — Ground |
| পিন J2 | AN11 — Analog input / GPIO |
| পিন J3 | AN12 — Analog input / GPIO |
| পিন J4 | AN13 — Analog input / GPIO |
| পিন J5 | AN14 — Analog input / GPIO |
| পিন J6 | AN15 — Analog input / GPIO |
| পিন J7 | EREF+ — Ethernet PHY reference clock |
| পিন K1 | VSS — Ground |
| পিন K2 | ETXD0 — Ethernet transmit data 0 |
| পিন K3 | ETXD1 — Ethernet transmit data 1 |
| পিন K4 | ERXD0 — Ethernet receive data 0 |
| পিন K5 | ERXD1 — Ethernet receive data 1 |
| পিন K6 | ECRSDV — Ethernet carrier sense / data valid |
| পিন K7 | EREF- — Ethernet PHY reference clock return |
| পিন L1 | VSS — Ground |
| পিন L2 | VDD — Core supply voltage |
| পিন L3 | ETXEN — Ethernet transmit enable |
| পিন L4 | ERXERR — Ethernet receive error |
| পিন L5 | EMDC — Ethernet management data clock |
| পিন L6 | EMDIO — Ethernet management data I/O |
| পিন L7 | VBUSON — USB VBUS monitor |
| পিন M1 | VSS — Ground |
| পিন M2 | CAN1RX — CAN bus 1 receive |
| পিন M3 | CAN1TX — CAN bus 1 transmit |
| পিন M4 | SQICS0 — Serial Quad Interface chip select 0 |
| পিন M5 | SQID1 — Serial Quad Interface data 1 |
| পিন M6 | SQID2 — Serial Quad Interface data 2 |
| পিন M7 | SQID3 — Serial Quad Interface data 3 |
| পিন N1 | VSS — Ground |
| পিন N2 | RE0/PWM1 — GPIO / PWM output 1 |
| পিন N3 | RE1/PWM2 — GPIO / PWM output 2 |
| পিন N4 | RE2/PWM3 — GPIO / PWM output 3 |
| পিন N5 | RE3/PWM4 — GPIO / PWM output 4 |
| পিন N6 | RE4/PWM5 — GPIO / PWM output 5 |
| পিন N7 | RE5/PWM6 — GPIO / PWM output 6 |
| পিন P1 | VSS — Ground |
| পিন P2 | VDD — Core supply voltage |
| পিন P3 | RE6/PWM7 — GPIO / PWM output 7 |
| পিন P4 | RE7/PWM8 — GPIO / PWM output 8 |
| পিন P5 | RF0 — GPIO |
| পিন P6 | RF1 — GPIO |
| পিন P7 | RF2/PMA2 — GPIO / Parallel Master Port address |
সাধারণ ব্যবহার
PIC32MZ1024EFH100T-E/GJX এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial HMI / Touchscreen Controller, Motor Control / FOC Drive, Industrial Gateway / IoT Edge Node, Automotive Body / Connectivity Module, Medical Patient Monitoring Device, Graphics HMI with TFT Display.
Industrial HMI / Touchscreen Controller
The PIC32MZ1024EFH100T-E/GJX is well suited to drive industrial HMI panels with TFT-LCD displays up to WXGA resolution. Its 200 MHz MIPS core with hardware FPU and 512 KB SRAM can manage frame buffers for mid-sized displays, while the parallel PMP and SQI interfaces connect to TFT controllers and external flash memory simultaneously. The integrated DMA engine moves pixel data without CPU intervention, leaving MIPS headroom for touch processing, UI logic, and industrial protocols. The hardware crypto engine accelerates TLS for cloud-connected HMIs.
সুপারিশকৃত
Motor Control / FOC Drive
The PIC32MZ1024EFH100T-E/GJX executes field-oriented control of BLDC and PMSM motors within a single chip. Its 200 MHz MIPS core combined with hardware FPU and DSP extensions (four 64-bit accumulators, single-cycle MAC) achieves sub-microsecond control-loop times, well within the bandwidth needed for FOC at 20-50 kHz switching. On-chip peripherals include high-resolution PWM, fast 16-bit ADC with synchronized sampling, and QEI inputs for rotor position. The 512 KB SRAM holds controller state and observer data; the 1 MB dual-panel Flash supports live firmware updates for drive parameter tuning in the field.
সুপারিশকৃত
Industrial Gateway / IoT Edge Node
The PIC32MZ1024EFH100T-E/GJX powers industrial IoT gateways that aggregate sensor data over RS-485, CAN, Ethernet, and USB-HS while maintaining secure cloud connectivity. The Ethernet MAC and USB-HS peripheral share bandwidth with multiple UART/SPI/I2C ports, all manageable through the 8-channel DMA engine. The hardware crypto engine accelerates TLS/DTLS handshakes; the dual-panel Flash enables OTA firmware updates without service interruption. Extended temperature (-40C to +125C) operation supports outdoor cabinet and factory floor deployments.
সুপারিশকৃত
Automotive Body / Connectivity Module
Automotive body and connectivity modules can use the PIC32MZ1024EFH100T-E/GJX where extended temperature operation is acceptable. The device integrates CAN, Ethernet, and USB-HS peripherals essential for body controllers and telematic units. Its hardware FPU accelerates ADAS sensor-fusion math; the DSP engine runs audio codecs for hands-free calling. Note that this part is not AEC-Q100 qualified; for AEC-Q100 automotive applications, pair it with an external automotive MCU in a two-chip architecture.
সুপারিশকৃত
Medical Patient Monitoring Device
Patient monitoring devices such as bedside multi-parameter monitors and ambulatory ECGs use the PIC32MZ1024EFH100T-E/GJX for real-time ECG processing, SpO2 calculation, and alarm management. The DSP extensions accelerate the digital filtering required for 12-lead ECG (bandpass, notch, baseline wander); the FPU runs trend analysis and threshold algorithms. Dual-panel Flash supports firmware update validation critical for medical devices. The 100-TFBGA package fits compact portable form factors, and the hardware crypto engine secures patient data at rest and in transit.
সুপারিশকৃত
Graphics HMI with TFT Display
Graphics HMI applications such as appliance control panels, building automation touchscreens, and instrument clusters run on the PIC32MZ1024EFH100T-E/GJX. The Parallel Master Port (PMP) and Graphics interface connect to WQVGA / WXGA TFT-LCD displays at up to 30 fps with software-rendered UI. The 512 KB SRAM holds compressed graphics assets and frame buffers; the SQI interface attaches external QSPI flash for asset storage. The dual-panel Flash supports safe UI asset updates without bricking the panel during deployment.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা PIC32MZ1024EFH100T-E/GJX — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFH100T-I/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100T-I/GJX | PIC32MZ1024EFE100T-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Hardware Crypto | Yes (AES/DES/SHA/RNG) | Yes (AES/DES/SHA/RNG) | Yes (AES/DES/SHA/RNG) | No (G sub-class) | No (F sub-class) | No (E sub-class) |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
মূল পার্থক্যসমূহ
- Hardware crypto acceleration on a 32-bit MCU core (বনামPIC32MZ1024EFG100T-I/GJX)
- Extended temperature range for harsh environments (বনামPIC32MZ1024EFH100T-I/GJX)
- Full 1 MB Flash with dual-panel live update support (বনামPIC32MZ0512EFK100T-E/GJX)
ডিজাইন নোট
Estimated: at 200 MHz full-load operation with VDD = 3.3 V, the PIC32MZ1024EFH100T-E/GJX draws approximately 110-140 mA. Place a 10 uF bulk capacitor plus a 100 nF high-frequency ceramic on each VDD/VSS pair, with vias stitching the BGA ground balls to a continuous ground plane. Use a ferrite bead on the analog AVDD pin to isolate noisy digital rails from the sensitive ADC reference. The internal LDO requires an external 1 uF bypass on its output pin per the datasheet.
The 100-TFBGA (7x7) package has 0.5 mm ball pitch and requires PCB fabrication with micro-vias or laser-drilled vias for breakout. Use a 4-layer minimum stack-up with a dedicated ground plane beneath the package and routed signal layers on top. Match-length differential pairs for Ethernet (RMII/RGMII) to within 50 mil tolerance; keep USB-HS D+/D- traces 90 ohm differential and as short as possible, with no stubs.
Do not omit the external 24 MHz crystal load capacitors; the PLL multiplier to 200 MHz assumes a stable reference. Failure to bypass the VREF+ pin with a low-ESR ceramic causes ADC noise on the analog inputs. Be aware that the 'E' suffix in PIC32MZ1024EFH100T-E/GJX denotes Extended temperature grade (-40C to +125C) versus the 'I' industrial grade (-40C to +85C) - do not select the wrong thermal grade for outdoor deployments. The dual-panel Flash boot-mode pins must be pulled correctly at reset, otherwise the device may boot from the wrong panel after an interrupted firmware update.
কমপ্লায়েন্স তথ্য
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for AEC-Q100 automotive applications, an external automotive MCU companion is required. Lead-free and halogen-free packaging standard.
