PIC32MZ1024EFH100T-E/GJX - 200MHz FPU MCU 1MB Flash | Microchip
Référence : PIC32MZ1024EFH100T-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.78 | $14,78 |
| 10 | $13.3 | $133,00 |
| 100 | $11.82 | $1 182,00 |
| 250 | $10.85 | $2 712,50 |
| 500 | $9.9 | $4 950,00 |
PIC32MZ1024EFH100T-E/GJX Présentation
An MCU (microcontroller) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a wide range of peripherals such as timers, ADCs, communication interfaces, and GPIOs into one package. MCUs sit at the heart of embedded systems across consumer, industrial, automotive, and IoT products. Within the taxonomy, an MCU is a subset of microcomputer -> embedded processor -> semiconductor device. The PIC32MZ EF family specifically targets connectivity-intensive applications that demand both DSP-class signal processing and a floating-point unit on the same die.
Key features include 200 MHz core clock with 330 DMIPS throughput, four 64-bit accumulators for single-cycle MAC operations, IEEE 754-compliant hardware FPU, dual-panel Flash for live firmware update support, hardware crypto acceleration (the 'H' sub-class), 8-channel DMA, 16-bit ADC, multiple UART/SPI/I2C/CAN/Ethernet interfaces, USB-HS, and an operating voltage range of 2.3V to 3.6V. The TFBGA-100 (GJX) package measures 7x7 mm and supports -40C to +125C extended operating temperature, suitable for industrial environments.
Architecturally, the PIC32MZ EF core is built on the MIPS Warrior M-class architecture, providing deterministic interrupt latency and tight C-language code density while delivering RISC-class performance. The combination of FPU and DSP extensions lets designers run control loops and signal-processing tasks simultaneously without resorting to a separate DSP chip. Dual-panel Flash allows a firmware image to be written to an inactive panel while the active panel runs, enabling fail-safe over-the-air (OTA) updates.
Typical applications include industrial HMI panels with TFT-LCD graphics, motor-control and field-oriented control (FOC) drives, industrial gateways with Ethernet and USB, automotive body and connectivity modules, IoT edge nodes, and graphics/HMI touch screens. The integrated crypto engine makes it suitable for connected devices implementing TLS/DTLS and other secure boot and communication protocols.
When designing with this part, plan for 2.3-3.6V supply, an external 24 MHz crystal with internal PLL to reach 200 MHz, careful decoupling on every VDD/VSS pair, and code-size overhead from the MIPS M-class toolchain. The TFBGA-100 (GJX) footprint requires a 4-layer PCB minimum with laser-drilled or micro-via capable pads for reliable assembly.
Alternatives de remplacement direct pour PIC32MZ1024EFH100T-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFH100T-E/GJX (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, FPU, Operating Voltage, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFH100-E/GJX
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG100T-I/GJX
✅ Remplacement direct✓ En stock
$8.45 / unité
Voir la fiche technique →PIC32MZ1024EFF100T-I/GJX
✅ Remplacement direct✓ En stock
$9.5 / unité
Voir la fiche technique →PIC32MZ1024EFE100T-E/GJX
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →PIC32MZ0512EFK100T-E/GJX
✅ Remplacement direct✓ En stock
$9.8 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-E/GJX Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Series | PIC32MZ EF |
| Core Architecture | MIPS Warrior M-class (MIPS32) |
| Core Width | 32-bit |
| Fréquence d'horloge maximale | 200 MHz |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant hardware FPU |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Program Memory Type | Dual-panel Flash (live update support) |
| RAM | 512 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (Extended) |
| Boîtier | 100-TFBGA, 7x7 mm (GJX) |
| Type de montage | Surface Mount |
| Connectivity | USB-HS, Ethernet (ENET), CAN, SQI, UART, SPI, I2C |
| Crypto Acceleration | Yes (hardware crypto engine) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFH100T-E/GJX
| Broche A1 | VSS — Ground |
| Broche A2 | RD10/PMD10 — GPIO / Parallel Master Port data |
| Broche A3 | RD11/PMD11 — GPIO / Parallel Master Port data |
| Broche A4 | RD12/PMD12 — GPIO / Parallel Master Port data |
| Broche A5 | RD13/PMD13 — GPIO / Parallel Master Port data |
| Broche A6 | RD14/PMD14 — GPIO / Parallel Master Port data |
| Broche A7 | RD15/PMD15 — GPIO / Parallel Master Port data |
| Broche B1 | VDD — Core supply voltage |
| Broche B2 | RG6/SCK2 — GPIO / SPI2 clock |
| Broche B3 | RG7/SDO2 — GPIO / SPI2 data out |
| Broche B4 | RG8/SDI2 — GPIO / SPI2 data in |
| Broche B5 | RG9/SS2 — GPIO / SPI2 slave select |
| Broche B6 | RD0/PMD0 — GPIO / Parallel Master Port data |
| Broche B7 | RD1/PMD1 — GPIO / Parallel Master Port data |
| Broche C1 | VSS — Ground |
| Broche C2 | VDD — Core supply voltage |
| Broche C3 | OSC1/CLKI — External clock input / crystal |
| Broche C4 | OSC2/CLKO — Crystal output / clock output |
| Broche C5 | RD2/PMD2 — GPIO / Parallel Master Port data |
| Broche C6 | RD3/PMD3 — GPIO / Parallel Master Port data |
| Broche C7 | RD4/PMD4 — GPIO / Parallel Master Port data |
| Broche D1 | VSS — Ground |
| Broche D2 | RF4/PMA4 — GPIO / Parallel Master Port address |
| Broche D3 | RF5/PMA5 — GPIO / Parallel Master Port address |
| Broche D4 | RF6/PMA6 — GPIO / Parallel Master Port address |
| Broche D5 | RF7/PMA7 — GPIO / Parallel Master Port address |
| Broche D6 | RF8/PMA8 — GPIO / Parallel Master Port address |
| Broche D7 | RD5/PMD5 — GPIO / Parallel Master Port data |
| Broche E1 | VSS — Ground |
| Broche E2 | RA0/TMS — GPIO / JTAG test mode select |
| Broche E3 | RA1/TCK — GPIO / JTAG test clock |
| Broche E4 | RA2/TDI — GPIO / JTAG test data in |
| Broche E5 | RA3/TDO — GPIO / JTAG test data out |
| Broche E6 | RF9/PMA9 — GPIO / Parallel Master Port address |
| Broche E7 | RF10/PMA10 — GPIO / Parallel Master Port address |
| Broche F1 | VSS — Ground |
| Broche F2 | VREF+ — ADC positive reference |
| Broche F3 | AVDD — Analog supply voltage |
| Broche F4 | AVSS — Analog ground |
| Broche F5 | VBUS — USB bus voltage detect |
| Broche F6 | D+ — USB data plus |
| Broche F7 | D- — USB data minus |
| Broche G1 | VSS — Ground |
| Broche G2 | AN0 — Analog input / GPIO |
| Broche G3 | AN1 — Analog input / GPIO |
| Broche G4 | AN2 — Analog input / GPIO |
| Broche G5 | AN3 — Analog input / GPIO |
| Broche G6 | AN4 — Analog input / GPIO |
| Broche G7 | AN5 — Analog input / GPIO |
| Broche H1 | VSS — Ground |
| Broche H2 | VDD — Core supply voltage |
| Broche H3 | AN6 — Analog input / GPIO |
| Broche H4 | AN7 — Analog input / GPIO |
| Broche H5 | AN8 — Analog input / GPIO |
| Broche H6 | AN9 — Analog input / GPIO |
| Broche H7 | AN10 — Analog input / GPIO |
| Broche J1 | VSS — Ground |
| Broche J2 | AN11 — Analog input / GPIO |
| Broche J3 | AN12 — Analog input / GPIO |
| Broche J4 | AN13 — Analog input / GPIO |
| Broche J5 | AN14 — Analog input / GPIO |
| Broche J6 | AN15 — Analog input / GPIO |
| Broche J7 | EREF+ — Ethernet PHY reference clock |
| Broche K1 | VSS — Ground |
| Broche K2 | ETXD0 — Ethernet transmit data 0 |
| Broche K3 | ETXD1 — Ethernet transmit data 1 |
| Broche K4 | ERXD0 — Ethernet receive data 0 |
| Broche K5 | ERXD1 — Ethernet receive data 1 |
| Broche K6 | ECRSDV — Ethernet carrier sense / data valid |
| Broche K7 | EREF- — Ethernet PHY reference clock return |
| Broche L1 | VSS — Ground |
| Broche L2 | VDD — Core supply voltage |
| Broche L3 | ETXEN — Ethernet transmit enable |
| Broche L4 | ERXERR — Ethernet receive error |
| Broche L5 | EMDC — Ethernet management data clock |
| Broche L6 | EMDIO — Ethernet management data I/O |
| Broche L7 | VBUSON — USB VBUS monitor |
| Broche M1 | VSS — Ground |
| Broche M2 | CAN1RX — CAN bus 1 receive |
| Broche M3 | CAN1TX — CAN bus 1 transmit |
| Broche M4 | SQICS0 — Serial Quad Interface chip select 0 |
| Broche M5 | SQID1 — Serial Quad Interface data 1 |
| Broche M6 | SQID2 — Serial Quad Interface data 2 |
| Broche M7 | SQID3 — Serial Quad Interface data 3 |
| Broche N1 | VSS — Ground |
| Broche N2 | RE0/PWM1 — GPIO / PWM output 1 |
| Broche N3 | RE1/PWM2 — GPIO / PWM output 2 |
| Broche N4 | RE2/PWM3 — GPIO / PWM output 3 |
| Broche N5 | RE3/PWM4 — GPIO / PWM output 4 |
| Broche N6 | RE4/PWM5 — GPIO / PWM output 5 |
| Broche N7 | RE5/PWM6 — GPIO / PWM output 6 |
| Broche P1 | VSS — Ground |
| Broche P2 | VDD — Core supply voltage |
| Broche P3 | RE6/PWM7 — GPIO / PWM output 7 |
| Broche P4 | RE7/PWM8 — GPIO / PWM output 8 |
| Broche P5 | RF0 — GPIO |
| Broche P6 | RF1 — GPIO |
| Broche P7 | RF2/PMA2 — GPIO / Parallel Master Port address |
Applications typiques
PIC32MZ1024EFH100T-E/GJX convient pour 6 applications: Industrial HMI / Touchscreen Controller, Motor Control / FOC Drive, Industrial Gateway / IoT Edge Node, Automotive Body / Connectivity Module, Medical Patient Monitoring Device, Graphics HMI with TFT Display.
Industrial HMI / Touchscreen Controller
The PIC32MZ1024EFH100T-E/GJX is well suited to drive industrial HMI panels with TFT-LCD displays up to WXGA resolution. Its 200 MHz MIPS core with hardware FPU and 512 KB SRAM can manage frame buffers for mid-sized displays, while the parallel PMP and SQI interfaces connect to TFT controllers and external flash memory simultaneously. The integrated DMA engine moves pixel data without CPU intervention, leaving MIPS headroom for touch processing, UI logic, and industrial protocols. The hardware crypto engine accelerates TLS for cloud-connected HMIs.
Recommandé
Motor Control / FOC Drive
The PIC32MZ1024EFH100T-E/GJX executes field-oriented control of BLDC and PMSM motors within a single chip. Its 200 MHz MIPS core combined with hardware FPU and DSP extensions (four 64-bit accumulators, single-cycle MAC) achieves sub-microsecond control-loop times, well within the bandwidth needed for FOC at 20-50 kHz switching. On-chip peripherals include high-resolution PWM, fast 16-bit ADC with synchronized sampling, and QEI inputs for rotor position. The 512 KB SRAM holds controller state and observer data; the 1 MB dual-panel Flash supports live firmware updates for drive parameter tuning in the field.
Recommandé
Industrial Gateway / IoT Edge Node
The PIC32MZ1024EFH100T-E/GJX powers industrial IoT gateways that aggregate sensor data over RS-485, CAN, Ethernet, and USB-HS while maintaining secure cloud connectivity. The Ethernet MAC and USB-HS peripheral share bandwidth with multiple UART/SPI/I2C ports, all manageable through the 8-channel DMA engine. The hardware crypto engine accelerates TLS/DTLS handshakes; the dual-panel Flash enables OTA firmware updates without service interruption. Extended temperature (-40C to +125C) operation supports outdoor cabinet and factory floor deployments.
Recommandé
Automotive Body / Connectivity Module
Automotive body and connectivity modules can use the PIC32MZ1024EFH100T-E/GJX where extended temperature operation is acceptable. The device integrates CAN, Ethernet, and USB-HS peripherals essential for body controllers and telematic units. Its hardware FPU accelerates ADAS sensor-fusion math; the DSP engine runs audio codecs for hands-free calling. Note that this part is not AEC-Q100 qualified; for AEC-Q100 automotive applications, pair it with an external automotive MCU in a two-chip architecture.
Recommandé
Medical Patient Monitoring Device
Patient monitoring devices such as bedside multi-parameter monitors and ambulatory ECGs use the PIC32MZ1024EFH100T-E/GJX for real-time ECG processing, SpO2 calculation, and alarm management. The DSP extensions accelerate the digital filtering required for 12-lead ECG (bandpass, notch, baseline wander); the FPU runs trend analysis and threshold algorithms. Dual-panel Flash supports firmware update validation critical for medical devices. The 100-TFBGA package fits compact portable form factors, and the hardware crypto engine secures patient data at rest and in transit.
Recommandé
Graphics HMI with TFT Display
Graphics HMI applications such as appliance control panels, building automation touchscreens, and instrument clusters run on the PIC32MZ1024EFH100T-E/GJX. The Parallel Master Port (PMP) and Graphics interface connect to WQVGA / WXGA TFT-LCD displays at up to 30 fps with software-rendered UI. The 512 KB SRAM holds compressed graphics assets and frame buffers; the SQI interface attaches external QSPI flash for asset storage. The dual-panel Flash supports safe UI asset updates without bricking the panel during deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFH100T-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFH100T-I/GJX | PIC32MZ1024EFG100T-I/GJX | PIC32MZ1024EFF100T-I/GJX | PIC32MZ1024EFE100T-E/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX | 100-TFBGA (7x7) GJX |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Hardware Crypto | Yes (AES/DES/SHA/RNG) | Yes (AES/DES/SHA/RNG) | Yes (AES/DES/SHA/RNG) | No (G sub-class) | No (F sub-class) | No (E sub-class) |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
Principaux différenciateurs
- Hardware crypto acceleration on a 32-bit MCU core (vs PIC32MZ1024EFG100T-I/GJX)
- Extended temperature range for harsh environments (vs PIC32MZ1024EFH100T-I/GJX)
- Full 1 MB Flash with dual-panel live update support (vs PIC32MZ0512EFK100T-E/GJX)
Notes de conception
Estimated: at 200 MHz full-load operation with VDD = 3.3 V, the PIC32MZ1024EFH100T-E/GJX draws approximately 110-140 mA. Place a 10 uF bulk capacitor plus a 100 nF high-frequency ceramic on each VDD/VSS pair, with vias stitching the BGA ground balls to a continuous ground plane. Use a ferrite bead on the analog AVDD pin to isolate noisy digital rails from the sensitive ADC reference. The internal LDO requires an external 1 uF bypass on its output pin per the datasheet.
The 100-TFBGA (7x7) package has 0.5 mm ball pitch and requires PCB fabrication with micro-vias or laser-drilled vias for breakout. Use a 4-layer minimum stack-up with a dedicated ground plane beneath the package and routed signal layers on top. Match-length differential pairs for Ethernet (RMII/RGMII) to within 50 mil tolerance; keep USB-HS D+/D- traces 90 ohm differential and as short as possible, with no stubs.
Do not omit the external 24 MHz crystal load capacitors; the PLL multiplier to 200 MHz assumes a stable reference. Failure to bypass the VREF+ pin with a low-ESR ceramic causes ADC noise on the analog inputs. Be aware that the 'E' suffix in PIC32MZ1024EFH100T-E/GJX denotes Extended temperature grade (-40C to +125C) versus the 'I' industrial grade (-40C to +85C) - do not select the wrong thermal grade for outdoor deployments. The dual-panel Flash boot-mode pins must be pulled correctly at reset, otherwise the device may boot from the wrong panel after an interrupted firmware update.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for AEC-Q100 automotive applications, an external automotive MCU companion is required. Lead-free and halogen-free packaging standard.
