Products (710+)

DP83TD510ERHBT - IEEE 802.3cg 10Base-T1L Ethernet PHY | TI
DP83TD510ERHBT

DP83TD510ERHBT - IEEE 802.3cg 10Base-T1L Ethernet PHY | TI

The Texas Instruments DP83TD510ERHBT is an ultra-low-power Ethernet physical layer (PHY) transceiver compliant with the IEEE 802.3cg 10Base-T1L specification, housed in a 32-pin VQFN (5x5 mm) package. It supports 10 Mbps full-duplex transmission over a single twisted-pair cable with reach up to 1 km, making it ideal for long-distance industrial Ethernet. The device operates from a single 3.3V supply and includes an integrated 25 MHz reference clock output to clock companion MCUs. A 10Base-T1L PHY is a physical-layer transceiver defined by the IEEE 802.3cg standard for single-pair Ethernet (SPE). It enables 10 Mbps full-duplex data on a single balanced twisted pair, dramatically reducing cabling cost and weight compared to traditional 100BASE-TX which requires two pairs. The DP83TD510E sits at the bottom of the OSI physical layer, translating MII/RGMII digital data from a host MAC into analog signaling on the single-pair cable, and supports cable reaches up to 1 km at 1.0 Vpp or 200 m+ at 2.4 Vpp, enabling Ethernet deployment in industrial process automation, building automation, and field-sensor networks where 100BASE-TX distances and four-wire harnesses are impractical. Key features include ultra-low power consumption (approximately 130 mW active per the product page), integrated cable diagnostics with built-in self-test and loopback modes, and MII/RGMII MAC interface compatibility. The device operates over the industrial temperature range of -40C to +125C and supports 1.0 Vpp or 2.4 Vpp transmit amplitude for compliance with both 10Base-T1L and longer-reach point-to-point links. The exposed thermal pad on the VQFN-32 package simplifies PCB thermal management in sealed industrial enclosures. Architecturally, the DP83TD510E integrates the analog front-end, PHY DSP, MAC interface logic, and clock generation into a single CMOS die, eliminating external magnetics in many configurations and reducing BOM cost. The device supports both 1.0 Vpp (10Base-T1L standard) and 2.4 Vpp (extended-reach) signaling modes selectable via strap or register configuration. Wake-on-LAN and cable-fault detection further enhance its suitability for always-on industrial field nodes. Typical applications include industrial process sensors, building automation controllers, remote I/O modules, and field instruments requiring Ethernet connectivity. The 1 km reach removes the need for repeaters in many factory-floor and process-plant topologies. Compared to RS-485, 10Base-T1L provides full-duplex operation, deterministic latency, and standardized Ethernet protocol stack interoperability. When designing with the DP83TD510ERHBT, route the single-pair differential traces as a 100-ohm differential transmission line with ground reference, place the decoupling capacitors within 2 mm of the supply pins, and follow the manufacturer reference layout for the MDI interface. The integrated 25 MHz reference clock output eliminates the need for an external crystal in many MCU designs, but a high-quality crystal or oscillator should still be used when low PPM accuracy is required for timing-sensitive applications. This page synthesizes distributor pricing, drop-in alternatives, application context, and practical design notes not found in the manufacturer datasheet alone.

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DS90LV019 - 3.3V/5V LVDS Driver Receiver | Texas Instruments
DS90LV019

DS90LV019 - 3.3V/5V LVDS Driver Receiver | Texas Instruments

The Texas Instruments DS90LV019 is a 3.3V or 5.0V LVDS driver and receiver designed for high-speed, low-power, point-to-point interconnect applications. The device includes one differential line driver and one receiver, with independent driver and receiver operation for bidirectional point-to-point links. Its TTL/CMOS-compatible logic interface provides separate D IN, DE, RE#, and R OUT lines, allowing the transmit and receive functions to be controlled independently. The DS90LV019 operates from a single 3.3V or 5.0V supply, making it suitable for systems that need a compact differential interface without a separate supply rail for each side of the link. The integrated driver and receiver simplify board-level LVDS connectivity between a controller, FPGA, serializer, or external equipment. The flow-through pin arrangement supports practical PCB routing, including short stubs between device pins and a connector. The electrical interface is intended for high-speed, low-power differential signaling rather than ordinary single-ended logic. The driver generates the differential output used to overcome noise and common-mode interference over a point-to-point cable or PCB trace, while the receiver converts the differential signal back into a TTL/CMOS-compatible output. The receiver enable input can place the output in a controlled state when the link is not active. The DS90LV019 is identified as a 14-pin SOIC narrow or 14-pin TSSOP device depending on the ordering variant. The device family is also associated with a military-qualified ordering option, DS90LV019-MIL, for applications requiring that specified product grade. Designers should confirm the exact package, supply requirement, and control-signal polarity in the manufacturer datasheet before layout release. Typical uses include industrial control links, test and measurement equipment, communication modules, video or imaging interfaces, and embedded systems that need reliable differential signaling over a short interconnect. The independent DE and RE# controls also make the device useful for half-duplex point-to-point links where transmit and receive states must be sequenced. Design emphasis should be placed on controlled-impedance routing of the differential pair, keeping the driver and receiver connections short, and placing decoupling close to the supply pins. Because the device combines a transmitter and receiver, unused logic inputs should be tied to defined levels rather than left floating. The exact pin assignment, recommended termination network, and maximum signal-rate values must be taken from the manufacturer datasheet for the selected package and grade.

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DW1000-I-TR13 - IEEE 802.15.4 UWB Transceiver IC | Qorvo
DW1000-I-TR13

DW1000-I-TR13 - IEEE 802.15.4 UWB Transceiver IC | Qorvo

The Qorvo DW1000-I-TR13 is a fully integrated IEEE 802.15.4-2011 IR-UWB (Impulse Radio Ultra-Wideband) low-power transceiver IC covering 3.5 GHz to 6.5 GHz, supporting data rates up to 6.8 Mbps with a receive sensitivity of -107 dBm, housed in a 48-pin VFQFN package with exposed pad. A UWB transceiver is a radio IC that communicates using extremely short nanosecond-scale pulses spread over very wide bandwidth (typically 500 MHz or more per channel), rather than a narrowband modulated carrier. In the power-management and connectivity hierarchy of an embedded system, the DW1000 sits in the RF & Wireless > RF Transceivers layer, feeding ranging and data results to a host MCU over SPI. Because UWB pulses have sharp time-domain edges, time-of-flight between two radios can be measured with sub-nanosecond resolution, which is what enables centimeter-level positioning that Bluetooth and Wi-Fi cannot achieve. Key features of the DW1000 include two-way ranging (TWR) and TDoA location capability with 10 cm position accuracy, six programmable channels across the 3.5-6.5 GHz UWB spectrum, four programmable preamble lengths and data rates up to 6.8 Mbps, and operation compliant with IEEE 802.15.4-2011 (originally 802.15.4a). The device integrates the analog front end, receiver and transmitter, needing only an external 38.4 MHz crystal and a few passive components to form a complete UWB radio. On the receive side the DW1000 uses a direct-conversion analog receiver with programmable gain control, while the transmit side is a digitally generated pulse-based transmitter; both are synchronized to the 38.4 MHz crystal reference. The IC is controlled through an SPI slave interface, and the Decawave (now Qorvo) driver stack supports TDoA tag/anchor frameworks, SS-TWR and DS-TWR ranging modes. Its low-power architecture supports tag duty-cycling for battery-powered asset tags. Typical applications include indoor real-time location systems (RTLS) with 10 cm accuracy, warehouse and factory asset tracking, robotics navigation and drone swarm relative positioning, and secure keyless entry. Design consideration: UWB antenna placement and crystal tolerance directly affect ranging bias; follow the Qorvo reference design (DWM1000 module and related EVB1000 board) layouts and calibration guidance to meet the 10 cm accuracy figure. This page synthesizes distributor pricing, drop-in packaging alternatives, and practical design notes not found in the manufacturer datasheet.

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DW1000SB - IEEE 802.15.4 UWB Transceiver IC 10cm | Qorvo
DW1000SB

DW1000SB - IEEE 802.15.4 UWB Transceiver IC 10cm | Qorvo

The Qorvo DW1000SB is a fully integrated single-chip Ultra Wideband (UWB) low-power low-cost transceiver IC compliant to IEEE 802.15.4-2011, capable of two-way ranging or TDoA location with a precision of 10 cm, housed in a 48-pin QFN package. An Ultra Wideband transceiver is a short-range, high-bandwidth radio device that transmits data using very short nanosecond-duration pulses spread across a wide spectrum (several GHz). Within the wireless communication hierarchy, UWB sits alongside narrowband technologies such as Bluetooth Low Energy, Zigbee, and Wi-Fi, but occupies its own niche: impulse-radio UWB enables centimeter-level time-of-flight measurement that narrowband radios cannot achieve, making it the physical layer of choice for indoor positioning, asset tracking, and secure ranging systems. Key features of the DW1000SB include full compliance with the IEEE 802.15.4-2011 UWB physical layer standard, two-way ranging (TWR) and time-difference-of-arrival (TDoA) location support to 10 cm accuracy, and high-rate data transfer for concurrent communication and ranging. The single-chip integration minimizes the external bill of materials, requiring only a few passives plus an antenna to form a complete UWB node. Architecturally, the DW1000 integrates the analog RF front end, pulse generator, digital baseband, and MAC-level hardware in one die. Its receiver captures extremely narrow pulses with high time-resolution, which is what underpins the precise timestamping that yields centimeter-accurate distance calculations. The IC communicates with a host microcontroller over a standard SPI interface. Typical applications include real-time location systems (RTLS) for warehouses and factories, asset tracking tags and anchors, autonomous robot and drone navigation in GPS-denied indoor environments, and secure keyless entry systems where distance bounding prevents relay attacks. Design consideration: accurate timestamping performance depends heavily on crystal oscillator quality and antenna delay calibration; budget for per-unit antenna delay calibration in production to preserve the 10 cm ranging precision. This page synthesizes distributor sourcing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a complete selection view in one place.

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DWM1000 - IEEE 802.15.4 UWB Transceiver Module | Qorvo
DWM1000

DWM1000 - IEEE 802.15.4 UWB Transceiver Module | Qorvo

The Qorvo DWM1000 is a fully integrated IEEE 802.15.4-2011 ultra-wideband (IR-UWB) transceiver module operating from 3.5 GHz to 6.5 GHz, delivering data rates up to 6.8 Mbps and two-way-ranging accuracy of 10 cm, housed in a compact surface-mount castellated module with integrated chip antenna. An ultra-wideband transceiver module is a self-contained RF subsystem that combines the radio IC, antenna, RF matching, power management, and clock circuitry into one package, eliminating the RF design work normally required for a discrete UWB chip. In the product hierarchy, the DWM1000 sits between the DW1000 transceiver IC (the silicon) and complete positioning systems such as two-way ranging (TWR) or TDOA location networks. Key features include a 500 MHz-wide UWB channel implementation compliant with IEEE 802.15.4-2011, data rates of 110 kbps, 850 kbps, and 6.8 Mbps, and an integrated chip antenna. Supply voltage is 2.8 V to 3.6 V with typical receive current of 64 mA. Because the antenna and all RF components are on-module, no RF layout expertise is needed - the DWM1000 connects to a host MCU over a standard SPI interface. Technically, the module is built around the DW1000 single-chip CMOS UWB transceiver, which supports timestamps with sufficient resolution for centimeter-level ranging. The onboard DW1000 temperature sensor can dynamically trim the crystal during runtime to hold the +/- 2 ppm frequency specification across the full -40C to +85C operating range, according to Qorvo documentation. Typical applications include indoor asset tracking with 10 cm precision, TDOA and TWR positioning anchors and tags, factory automation, warehouse logistics, smart-building occupancy sensing, and RTLS research using platforms such as Arduino or ESP32 hosts. A key design consideration is power: receive current of 64 mA dominates duty-cycled tag designs, so sleeping the DW1000 between frames and using the lowest data rate with preamble optimization for range, or the highest rate for battery life, is an important trade-off to model early. This page synthesizes distributor pricing (as of 2026-10-20), drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone.

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DWM1000SR - IEEE 802.15.4 UWB Transceiver Module | Qorvo
DWM1000SR

DWM1000SR - IEEE 802.15.4 UWB Transceiver Module | Qorvo

The Qorvo DWM1000SR is an IEEE 802.15.4-2011 ultra-wideband (UWB) transceiver module based on the Decawave DW1000 IC, operating across the 3.5 GHz to 6.5 GHz UWB spectrum with data rates up to 6.8 Mbps and 10 cm positioning accuracy, housed in a compact surface-mount module with an integrated ceramic antenna. An ultra-wideband transceiver module is a complete radio subsystem that packages an RF transceiver IC, antenna, crystal oscillator, power management, and clock circuitry into a single certified unit. Within the wireless connectivity hierarchy, UWB modules occupy the precision-ranging segment of short-range communications, complementing Bluetooth, Wi-Fi, and 802.15.4 Zigbee radios by delivering centimeter-level time-of-flight measurement that narrowband technologies cannot achieve. Key features include full IEEE 802.15.4a UWB compliance, integrated all-RF circuitry eliminating external matching components, on-chip voltage and temperature monitoring readable via SPI, and support for two-way ranging (TWR) and TDOA location topologies. The module supports six data-rate options up to 6.8 Mbps and programmable transmit power across its six supported UWB channels. The underlying DW1000 die implements a coherent receiver with accurate timestamping, enabling time-of-flight resolution far beyond conventional RSSI-based approaches. The integrated architecture minimizes BOM count and RF design risk, allowing OEMs to achieve regulatory-certified UWB performance without in-house RF layout expertise. Typical applications include indoor real-time location systems (RTLS) for asset tracking, autonomous navigation for robots and drones, geofencing and secure keyless entry, and precision positioning in warehouses and factories where 10 cm accuracy is required. Design considerations: the module requires a clean 2.8 V to 3.6 V supply and SPI host interface; follow the manufacturer recommended footprint and keep-out zone around the integrated antenna to preserve radiation pattern and ranging accuracy. This page synthesizes distributor availability, drop-in alternative analysis, and practical design guidance not consolidated in the manufacturer datasheet.

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DWM1001C - UWB Transceiver Module with nRF52832 | Qorvo
DWM1001C

DWM1001C - UWB Transceiver Module with nRF52832 | Qorvo

The Qorvo DWM1001C is a 6.5 GHz ultra-wideband (UWB) transceiver module with integrated BLE 4.0 (2.4 GHz), an ARM Cortex-M4 MCU and a motion sensor, in a surface-mount castellated module package. An ultra-wideband transceiver module is a complete wireless subsystem that integrates an RF transceiver IC, antenna, timing references and often a host microcontroller into a single certified package. Within the wireless hierarchy, it sits above bare transceiver ICs (such as the DW1000) and below finished IoT devices, providing IEEE 802.15.4a UWB communication with centimeter-class ranging for real-time location systems (RTLS). Key features include the DW1000 UWB transceiver IC implementing IEEE 802.15.4a on UWB Channel 5 (centered at 6.5 GHz), an integrated UWB antenna plus a Bluetooth antenna with all RF circuitry on-board, the Nordic Semiconductor nRF52832 SoC combining an ARM Cortex-M4 CPU with 512 kB flash and 64 kB RAM, and an integrated motion sensor. Production calibration is stored permanently in the DW1000 OTP memory, with the module calibrated to meet the regulatory power spectral density limit of -41.3 dBm/MHz. The architecture pairs the DW1000 UWB PHY with the nRF52832 2.4 GHz wireless SoC over an internal interface, so a single module handles both precise two-way-ranging UWB positioning and low-power BLE connectivity. The supplied PANS firmware stack provides a two-way-ranging RTLS implementation supporting anchor, tag and gateway roles out of the box, significantly shortening time to market. Typical applications include indoor asset tracking, RTLS anchors and tags, warehouse and logistics localization, and IoT sensor nodes that need both precise location and BLE backhaul. The certified module form factor (FCC compliant variant) removes the RF design and regulatory burden from the host PCB. Design consideration: because the module is factory calibrated in production, avoid reworking or reflowing the module more times than the datasheet profile allows, and route no high-speed signals directly beneath the integrated UWB antenna keep-out area. This page synthesizes distributor pricing, verified Qorvo module family comparisons and practical RTLS design guidance not found in a single manufacturer datasheet.

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DWM3000-ESSR - UWB Transceiver Module DW3110 | Qorvo
DWM3000-ESSR

DWM3000-ESSR - UWB Transceiver Module DW3110 | Qorvo

The Qorvo DWM3000-ESSR is an engineering-sample variant of the DWM3000, a fully integrated Ultra-Wideband (UWB) transceiver module based on the Qorvo DW3110 IC, delivering 10 cm ranging precision and data rates up to 6.8 Mbps in a surface-mount module that integrates the antenna, all RF circuitry, power management, and clock circuitry. A UWB (Ultra-Wideband) transceiver module is a type of short-range RF module that transmits nanosecond-scale pulses across several gigahertz of spectrum, enabling time-of-flight measurement far more precisely than conventional narrowband radios. Within the wireless-IC hierarchy, it sits above the transceiver IC (here the DW3110) and below complete RTLS systems, complementing Bluetooth, Wi-Fi, and GNSS in the position-and-awareness layer of a wireless stack. Key features include IEEE 802.15.4-2015 compliance, FiRa PHY and MAC specification compliance for interoperability with other FiRa devices, and demonstrated interoperability with the Apple U1 and U2 chips. Channel 5 operation is compatible with the older DWM1000, and the module is pin and size compatible with the DWM1000 footprint, allowing straightforward platform migration. The module integrates a ceramic UWB antenna, the DW3110 transceiver IC, a crystal, power management, and clock circuitry in a single shielded package, dramatically simplifying RF design. On-chip voltage and temperature monitors let the host read VDD1 pin voltage and internal die temperature from the DW3110, supporting system health checks. The DW3110 supports both 2-way ranging (TWR) and TDoA location architectures, and its data rate of up to 6.8 Mbps also accommodates payload exchange alongside ranging frames. Typical applications include real-time location systems (RTLS) for asset tracking to 10 cm precision, secure keyless entry for automotive and smartphone access, and indoor navigation in warehouses and factories where GNSS is unavailable. Design consideration: because the -ESSR suffix denotes an ENGINEERING SAMPLE, use it for prototype and evaluation only and plan production builds around the standard (non-ES) DWM3000 ordering code. This page adds distributor pricing context, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.

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DWM3000TR13 - UWB Transceiver Module 6.8Mbps | Qorvo
DWM3000TR13

DWM3000TR13 - UWB Transceiver Module 6.8Mbps | Qorvo

The Qorvo DWM3000TR13 is a fully integrated Ultra-Wideband (UWB) transceiver module based on the Qorvo DW3110 IC, supporting 6.25 GHz to 8.25 GHz operation, data rates up to 6.8 Mbps, and 10 cm precise asset location accuracy, in a compact surface-mount module with an integrated ceramic patch antenna. An Ultra-Wideband transceiver module is a complete radio subsystem that integrates the antenna, all RF circuitry, power management, and clock circuitry in a single shielded package. Within the wireless positioning hierarchy, UWB modules sit alongside 802.15.4/Zigbee and Bluetooth radios but deliver centimeter-level time-of-flight ranging that narrowband technologies cannot match, making them a cornerstone technology for indoor asset tracking and secure keyless entry. Key features of the DWM3000TR13 include support for two-way ranging (TWR) and TDoA (Time Difference of Arrival) location systems, IEEE 802.15.4z compliance, and interoperability with the Apple U1 and U2 chips. The module is designed to be compliant with the FiRa PHY and MAC specifications, enabling interoperability with other FiRa-compliant devices across ecosystems. The DW3110 baseband and RF architecture integrates the complete UWB signal chain, simplifying host integration to a simple SPI interface and power connections. Because all RF matching, crystal, and antenna tuning are completed inside the module, designers avoid the most difficult aspects of UWB RF design, and 6.25 GHz to 8.25 GHz coverage supports UWB channels in the 6.5 GHz and 8 GHz bands including channel 5 compatibility with the earlier DWM1000. Typical applications include indoor asset tracking, smart-door keyless entry systems, RTLS (real-time location systems) in factories and warehouses, and secure automotive hands-free access where 10 cm positioning precision enables true user-intent detection. Design consideration: the module is pin and size compatible with the Qorvo DWM1000, which eases migration, but designers should verify antenna keep-out areas and host supply sequencing per the manufacturer datasheet. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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DWM3001CTR13 - 6.5/8GHz UWB Module with BLE SoC | Qorvo
DWM3001CTR13

DWM3001CTR13 - 6.5/8GHz UWB Module with BLE SoC | Qorvo

The Qorvo DWM3001CTR13 is a fully integrated 6.5 GHz and 8.0 GHz ultra-wideband (UWB) transceiver module in a 48-pad LCC surface-mount package with an integrated planar UWB antenna. It combines the Qorvo DW3110 UWB transceiver IC, a Nordic nRF52833 BLE SoC with ARM Cortex-M4F MCU, an accelerometer, power management circuitry, and a crystal in a single validated module. Ultra-wideband is a short-range radio technology that transmits nanosecond-scale pulses across several gigahertz of spectrum, enabling centimeter-level ranging accuracy that Bluetooth and Wi-Fi cannot achieve. Within the positioning ecosystem, a UWB module sits at the device level of the hierarchy: UWB radio -> RF transceiver module -> real-time location system (RTLS) -> IEEE 802.15.4-based personal area network. Key features include a 6.25 GHz to 8.25 GHz integrated RF front end, support for 6.5 and 8.0 GHz UWB channels, a 6.8 Mbps RF data rate, AES-128/256 hardware encryption on the UWB link, and full integration of the DW3110 IC, nRF52833 BLE SoC, planar UWB antenna, accelerometer, power management, and crystal. Because the RF design is fully validated, tested, and calibrated at the factory, no RF expertise is required to deploy the module. Architecturally, the DW3110 handles UWB physical-layer ranging per IEEE 802.15.4z while the nRF52833 manages BLE 5.4 connectivity, application firmware, and the accelerometer-based motion sensing. Low power consumption allows powering from a coin-cell or Li-ion battery for long periods, making the module cost-effective for battery-operated UWB nodes. Typical applications include smartphone-to-IoT precision ranging (UWB access keys and device pairing), asset tracking tags and anchors, secure keyless entry systems, and indoor real-time location systems (RTLS) in industrial and healthcare facilities. When designing with this module, keep RF trace requirements minimal thanks to the integrated antenna, and budget for the UWB pulse repetition duty cycle to optimize battery life. A in the data indicates pricing from $41.7621 at LCSC as of 2026-10-20. This page synthesizes distributor pricing, same-family module alternatives, and practical deployment guidance not found in the manufacturer datasheet.

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E18-MS1-IPX - 2.4GHz CC2530 ZigBee SMD Module | EBYTE
E18-MS1-IPX

E18-MS1-IPX - 2.4GHz CC2530 ZigBee SMD Module | EBYTE

The Chengdu Ebyte E18-MS1-IPX is a compact 2.4 GHz SMD ZigBee wireless module based on the Texas Instruments CC2530 SoC, integrating an 8051 microcontroller core with an IEEE 802.15.4 radio transceiver. The module ships in a 20.8 x 14.1 mm surface-mount package, is supplied with an integrated IPEX/U.FL antenna connector for flexible external antenna placement, and is rated for 4 dBm typical RF output and -97 dBm receive sensitivity. It targets low-power mesh networking designs operating from 2.0 V to 3.6 V over the 2.405 GHz to 2.480 GHz ISM band. A ZigBee module is a pre-certified radio sub-assembly that bundles the RF transceiver, matching network, and crystal into a single shielded PCB so that the host product only needs a UART/SPI command interface and an antenna. Within the broader hierarchy, the E18-MS1-IPX belongs to the IEEE 802.15.4 / ZigBee family of low-power wireless personal area networks (WPANs), which sit beneath Bluetooth and Wi-Fi in the 2.4 GHz connectivity stack and are optimized for low data-rate, battery-powered mesh nodes such as smart-home sensors, lighting controllers, and industrial telemetry. The E18-MS1-IPX supports the ZigBee 3.0 and IEEE 802.15.4 protocols, exposes a 2.4 GHz operating frequency band, and provides four typical RF power steps up to 4 dBm. The pin pitch is 1.27 mm across the SMD land pattern, allowing reflow soldering on standard SMT lines. Built-in shielding plus the IPEX antenna port let designers iterate on antenna choice without re-tuning the module, which is a useful differentiator versus the E18-MS1-PCB variant that ships with a trace antenna. Typical applications include smart-home bridges and lighting nodes, ZigBee-based wireless sensor networks, industrial telemetry and HVAC controllers, and consumer IoT hubs that need a compact, certified radio front end. The combination of the CC2530 firmware ecosystem (Z-Stack, Z-Stack Home) and a stable, off-the-shelf 2.4 GHz radio shortens time-to-market for products that must interoperate with existing ZigBee coordinators. When designing with this module, place it on a keep-out zone free of ground copper directly under the IPEX antenna footprint, observe the 1.27 mm pin pitch with a reflow profile compatible with lead-free SAC305 paste, and provide a clean 3.3 V regulated rail with adequate decoupling. Compared with designing an in-house CC2530 layout, the E18-MS1-IPX removes PCB antenna tuning and regulatory RF pre-compliance work. This page synthesizes distributor pricing, verified pin/package data, drop-in Ebyte sibling modules, and design notes that go beyond the manufacturer datasheet, helping engineers evaluate the E18-MS1-IPX against alternative 2.4 GHz modules in a single view.

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E180-2G4Z20SX-TB - EFR32MG21 ZigBee 3.0 Test Kit | EBYTE
E180-2G4Z20SX-TB

E180-2G4Z20SX-TB - EFR32MG21 ZigBee 3.0 Test Kit | EBYTE

The Chengdu Ebyte E180-2G4Z20SX-TB is a development test board based on the E180-2G4Z20SX wireless module, integrating the Silicon Labs EFR32MG21 ZigBee 3.0 SoC with an integrated power amplifier in a compact 28.5 x 24.6 mm USB-stick form factor pre-soldered to the carrier PCB. A ZigBee module is a pre-certified, surface-mount radio module that integrates an RF transceiver, microcontroller, antenna interface, and matching networks into a single shielded package. ZigBee modules belong to the broader hierarchy of wireless connectivity modules -> short-range IoT radios -> 2.4 GHz ISM-band transceivers -> IEEE 802.15.4-based mesh networking devices, designed to reduce RF design complexity for OEMs building mesh-enabled smart products. Key features of the E180-2G4Z20SX-TB test kit include: the host module operates in the 2.4 GHz ISM band with maximum transmit power of 20 dBm, supports ZigBee 3.0 self-organizing mesh networking, and provides USB power and serial port access via a 2.0 mm pitch pin header. The carrier PCB is pre-soldered to the E180-2G4Z20SX module so developers can plug the kit directly into a breadboard or USB host. Product weight is 3.5 g +/- 0.1 g. The E180-2G4Z20SX-TB is purpose-built for engineers evaluating the E180-2G4Z20SX module: it exposes the module's UART, GPIO, and power pins through standard 2.54 mm headers, removes RF layout risk during firmware bring-up, and ships with reference firmware for rapid ZigBee 3.0 stack validation. The internal PA delivers the 20 dBm TX power needed for long-range mesh nodes. Typical applications include ZigBee 3.0 smart-home device prototyping, industrial sensor mesh networking, smart metering pilots, building automation gateways, and wireless HVAC/lighting control development. The test kit is also used as a reference design for designers integrating the bare E180-2G4Z20SX module into their own carrier PCB. When designing with this test kit, note that the kit is a development-only assembly - it is not intended for deployment in the final product. For production designs, use the host E180-2G4Z20SX module directly on a custom carrier PCB and obtain modular transmitter / certification requirements before shipping. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single source for E180-2G4Z20SX-TB selection, sourcing, and integration guidance.

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E180-Z6907A - 2.4GHz ZigBee 3.0 SoC Module, 7dBm, TLSR8269
E180-Z6907A

E180-Z6907A - 2.4GHz ZigBee 3.0 SoC Module, 7dBm, TLSR8269

Chengdu Ebyte E180-Z6907A is a surface-mount 2.4 GHz ZigBee 3.0 wireless SoC module built around the Telink TLSR8269 chip, delivering 7 dBm transmit power with -40C to +85C industrial operating range in an 11.5 x 22 mm SMD package with on-board PCB antenna. A ZigBee module is a pre-certified, RF-tested sub-system that integrates the radio transceiver, microcontroller, antenna, and matching network into a single drop-in component, allowing designers to add mesh networking capability without performing RF layout, impedance matching, or radio regulatory compliance from scratch. Within the broader taxonomy, the E180-Z6907A sits inside RF & Wireless > RF Modules, and the underlying TLSR8269 belongs to the IEEE 802.15.4 / ZigBee family of low-power, low-data-rate mesh protocols used for short-range IoT connectivity. This background matters because antenna integration, regional RF certification (FCC, CE, SRRC), and firmware stack licensing are typically the largest engineering risks in any wireless product, and integrating a certified module eliminates most of them. Key specifications include 7 dBm typical transmit power, a stated link range of approximately 130 m line-of-sight at low data rate, and a supply voltage of 3.3 V with peak TX current near 65 mA and RX/TX-idle current near 40 mA. The module exposes GPIO for host interfacing, supports on-chip battery telemetry for battery-powered devices, and includes an RF diagnostic function for production testing and link debugging. The integrated PCB antenna eliminates the need for an external antenna trace. Architecturally, the TLSR8269 combines a 32-bit MCU core with an IEEE 802.15.4 / Bluetooth Low Energy / RF 6E capable 2.4 GHz radio, allowing the same module to participate in ZigBee 3.0 mesh networks or proprietary point-to-point links depending on firmware. Ebyte ships the module with a ZigBee 3.0 stack pre-loaded; engineers who need BLE or proprietary protocols can reflash using Telink's TLSR8269 SDK and the Ebyte hardware programming pins. Typical applications include smart-home lighting, door/window sensors, occupancy and environmental sensors, smart plugs, and ZigBee coordinators or routers for mesh networks. The small SMD footprint suits space-constrained designs such as in-wall switches and battery-powered sensor nodes. Design consideration: this module is SMD reflow-only (220C peak per JEDEC J-STD-020), and the antenna keep-out zone on the host board must remain clear of copper, traces, and grounded metal within roughly 5 mm of the PCB antenna edge to preserve radiated performance. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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E180-ZG120A - 2.4GHz ZigBee 3.0 Module, 20dBm, EFR32MG1B | EBYTE
E180-ZG120A

E180-ZG120A - 2.4GHz ZigBee 3.0 Module, 20dBm, EFR32MG1B | EBYTE

The EBYTE E180-ZG120A is a compact, surface-mount 2.4 GHz ZigBee 3.0 wireless module built on the EFR32MG1B "Mighty Gecko" SoC from Silicon Labs, housed in a 17.5 x 28.7 mm SMD package and certified to CE/FCC/RoHS standards. It delivers +20 dBm (100 mW) transmit output power with an integrated high-efficiency PA and LNA chain, enabling a line-of-sight range of approximately 1 km and high sensitivity reception in noisy RF environments. A ZigBee module is a pre-certified, application-ready radio subsystem that integrates the RF transceiver, microcontroller, antenna matching network, and regulatory shielding into a single reflow-compatible component. It belongs to the product taxonomy: ZigBee module -> 802.15.4 wireless module -> short-range IoT radio module -> RF & Wireless module -> electronic component. By embedding an ARM Cortex-M4 core with up to 256 kB flash and 32 kB RAM, the E180-ZG120A removes the design complexity of impedance-controlled RF layout from the integrator's responsibility, dramatically shortening time-to-market for IEEE 802.15.4 products. Key features include full ZigBee 3.0 protocol stack support, GPIO exposure through castellated edge pads, an integrated PCB antenna with optional external antenna variants, low standby current for battery-powered nodes, and an operating temperature range suited to industrial IoT deployments. Compared with bare-chip CC2530 designs, the PA+LNA chain on the EFR32MG1B platform delivers substantially better link margin in industrial environments. Technically, the module exposes the Silicon Labs EFR32MG1B232F256GM48 die with hardware-accelerated AES-128/256, true random number generation, and rich peripheral set including ADC, timers, USART, and I2C. Developers can program the module directly via Silicon Labs' Simplicity Studio toolchain and EmberZNet (ZigBee 3.0) or OpenThread/Zigbee R22 SDK, with reference designs for coordinator, router, and end-device roles available from the manufacturer. Typical applications include ZigBee 3.0 smart home hubs, wireless lighting control, building automation sensor meshes, industrial telemetry, and battery-powered end devices such as window/door sensors and HVAC thermostats. The integrated antenna footprint and pre-loaded EmberZNet image make it ideal for low-volume OEM products that need a fast regulatory path. When designing with this module, follow the manufacturer's PCB keep-out region around the integrated antenna, observe reflow profile of 245 C peak, and verify that the host product's enclosure material does not deshalve more than 3 dB of radiated power. Stack-up and supply decoupling should follow Silicon Labs' AN1018 reference for best RF performance. This page consolidates distributor pricing, pin-compatible module swaps, and reference-design workflows beyond the manufacturer datasheet to support fast BOM decisions for ZigBee 3.0 product teams.

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E180-ZG120B - 2.4GHz ZigBee 3.0 SMD Module | EBYTE
E180-ZG120B

E180-ZG120B - 2.4GHz ZigBee 3.0 SMD Module | EBYTE

The EBYTE E180-ZG120B is a small, low-power, high-reliability 2.4 GHz ZigBee SMD wireless module based on the Silicon Labs EFR32MG1B SoC, integrating a high-performance 32-bit ARM Cortex-M4 core with an integrated power amplifier delivering up to 19 dBm (20 dBm typical chip-side) transmit output. The module measures 18 x 11.5 mm in surface-mount form factor, runs on a 3.3 V supply, and includes an IPEX/U.FL antenna connector for flexible RF chain design. A ZigBee module is a pre-certified surface-mount radio block that combines an RF transceiver, microcontroller, crystal oscillator, and matching network into a single shield-ready component. Within the broader wireless taxonomy, ZigBee (IEEE 802.15.4) sits alongside BLE, Thread, and proprietary sub-GHz protocols as a low-power mesh networking standard for IoT. The E180-ZG120B specifically supports ZigBee 3.0, enabling interoperability with the ZigBee Home Automation, Light Link, and Green Power profiles for unified mesh device ecosystems. Key features include 19 dBm (135 mA peak) maximum RF output, 10 mA average receive current, SMD package with castellated edge contacts, UART host interface, and an operating temperature range of -40 C to +85 C. The module exposes GPIO pins and supports AT command-mode as well as transparent serial-port operation, simplifying integration into legacy and new MCU designs. The EFR32MG1B SoC core delivers Cortex-M4 processing with built-in hardware crypto, hardware AES, and integrated balun, eliminating the need for external RF components. The internal PA bypass network and SAW filter on the module PCB provide 1.3 km line-of-sight range per the manufacturer's benchmark, while sleep current in low-power modes enables multi-year battery operation. Pre-loaded ZigBee 3.0 stack reduces firmware development time. Typical applications include smart home lighting and switch control, ZigBee 3.0 coordinator and router nodes, industrial sensor telemetry, wireless meter reading, and remote control scenarios where mesh networking and AES-128 security are required. The module's compact SMD footprint suits dense PCB designs and reflow-compatible assembly. For best performance, place the module at the PCB edge away from metal enclosures, route the IPEX antenna path clear of ground pours, and provide a stable 3.3 V LDO with at least 200 mA headroom to handle the 135 mA transmit peak. The UART baud rate, GPIO mapping, and AT command set are configured through the host MCU. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the official E180-ZG120A/B user manual v1.0 from Chengdu Ebyte Electronic Technology.

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E22-400M22S - SX1268 LoRa 22dBm 7km 410-493MHz Module | EBYTE
E22-400M22S

E22-400M22S - SX1268 LoRa 22dBm 7km 410-493MHz Module | EBYTE

The EBYTE E22-400M22S is an industrial-grade, surface-mount LoRa RF transceiver module built around the Semtech SX1268 chip, delivering up to 22.3 dBm (170 mW) of transmit output power and a stated line-of-sight range of 7 km over the 410-493 MHz ISM band, packaged in a compact 20 x 14 mm SMD-22 stamp-hole footprint with both on-board chip antenna and U.FL (IPEX) external antenna connector options. What is a LoRa transceiver module? A LoRa (Long Range) transceiver module is a complete sub-system that combines a Semtech LoRa-modulation radio IC, an RF front-end (PA, LNA, filtering, antenna switch), a TCXO or crystal reference, and an SPI host interface on a single PCB. It belongs to the broader family of wireless modules -> sub-GHz transceivers -> RF modules -> RF & wireless modules. Designers use LoRa modules instead of bare LoRa ICs to skip RF layout certification and pass radio regulations in target regions more easily. Key features of the E22-400M22S include a -147 dBm receive sensitivity that enables long-range links, a wide 1.8 V to 3.7 V supply window that is friendly to Li-ion and 2xAA battery rails, programmable output power from a few mW up to 22.3 dBm, support for both LoRa spread-spectrum modulation and traditional GFSK, and a 32 MHz high-precision TCXO that improves frequency stability under temperature swing. The SX1268 inside also offers an integrated DC-DC converter option for improved transmit efficiency. The module architecture is built on Semtech's SX1268, the 410-810 MHz variant of the SX126x family, paired with an external power amplifier path to reach the 22 dBm level, an SAW band filter for out-of-band rejection, and an SPI bus for register access from the host MCU. Compatibility with the older SX1276/SX1277/SX1278 commands simplifies migration for existing LoRa designs, while the SX1268 offers lower receive current and higher bit-rate flexibility. Typical applications include remote metering and automatic meter reading (AMR), agricultural soil and irrigation sensors, industrial wireless telemetry over 433/470 MHz license-free bands, smart home and building automation backhaul, asset tracking in outdoor yards, and long-range drone or robotics telemetry links where a 7 km class range is required. A key design consideration is antenna selection: at 433/470 MHz a correctly tuned external antenna on the U.FL connector delivers far better range than the on-board chip antenna, and a 50 ohm controlled-impedance feed must be maintained. Designers should also budget for the 100 mA peak supply current during +22 dBm transmit bursts and decouple the supply rail close to the module pins. This page synthesizes distributor pricing, SX1268 versus SX1278 migration notes, drop-in same-footprint alternatives, and practical antenna and power-rail design guidance not found in the EBYTE datasheet alone, giving engineers a single decision-grade reference for selecting and implementing the E22-400M22S.

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E22-400MM22S - SX1268 LoRa 433/470MHz Module | Ebyte
E22-400MM22S

E22-400MM22S - SX1268 LoRa 433/470MHz Module | Ebyte

The Chengdu Ebyte E22-400MM22S is an ultra-small SMD LoRa wireless transceiver module operating over a continuous 410-493 MHz frequency range (covering the 433 MHz and 470 MHz ISM bands), with 22.3 dBm maximum transmit power and -147 dBm receive sensitivity in a 10 x 10 mm castellated (stamp-hole) SMD package with IPEX antenna interface option. A LoRa module is a sub-GHz radio transceiver subsystem that implements Semtech's LoRa spread-spectrum (chirp spread spectrum) and traditional GFSK modulation to deliver long-range, low-power wireless links. Within the system hierarchy it sits above the bare RF chip (here the Semtech SX1268) and below full application nodes, providing the RF front end, matching network, and host interface that an MCU controls over SPI. Key features include a very low receive current of 6.5 mA (with DC-DC power configuration), wide 1.8 V to 3.7 V supply range, transmit current of 100 mA, and a communication range of up to 7 km in open field. The SX1268 core supports multiple modulation schemes, enabling both long-range LoRa links and higher-throughput GFSK links on the same hardware. The SX1268 generation adds improved link budget and configurable power-amplifier and LDO/DC-DC supply modes; selecting the high-efficiency buck converter mode substantially lowers receive current for battery-powered nodes. Sensitivity of -147 dBm at low data rates allows deep penetration and multi-kilometer range, making the module well suited to dense deployments with infrequent small-payload transmissions. Typical applications include smart agriculture sensor nodes, industrial telemetry and metering, smart-city infrastructure, and asset tracking in the 433/470 MHz regional ISM bands. Design consideration: at 22.3 dBm output the module requires a good ground plane and an efficient antenna (IPEX whip or matched PCB antenna); always verify duty-cycle and EIRP limits for your regional 433/470 MHz regulations before deployment. This page synthesizes distributor pricing from LCSC, JLCPCB, and Chipmall, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.

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EC21AFA-512-STD - LTE Cat 1 M2M Module | Quectel
EC21AFA-512-STD

EC21AFA-512-STD - LTE Cat 1 M2M Module | Quectel

The Quectel EC21AFA-512-STD is an LTE Cat 1 cellular module for M2M and IoT applications, delivering maximum downlink data rates up to 10 Mbps with LTE and WCDMA (3G) fallback support, in a surface-mount card-edge (LCC) package without an integrated antenna. The AFA suffix designates the North America variant, targeting carriers across the US and Canada. An LTE Cat 1 module is a category of LTE UE device class defined for low-cost, low-power machine-type communication. Within the wireless connectivity hierarchy (cellular module -> RF transceiver module -> wireless communication device), Cat 1 sits above Cat M1/NB-IoT in throughput but below Cat 4 and higher, making it the traditional choice for 2G/3G sunset migrations where a full-speed LTE fallback to WCDMA is required without the cost of higher LTE categories. Key features include cost-effective LTE Cat 1 connectivity with downlink speeds up to 10 Mbps, integrated WCDMA fallback for coverage resilience, and on-module memory comprising 4 Gbit ROM and 2 Gbit RAM, which supports embedded applications and firmware headroom. Because the antenna is external, designers retain full flexibility in antenna selection and placement for optimal RF performance in enclosures. The EC21 series architecture integrates the cellular modem, baseband, RF transceiver, and memory into a single LCC-style castellated package designed for reflow soldering onto the host PCB, a pattern common across Quectel's EC2x family, which simplifies layout reuse across family members. Typical applications include telematics and fleet tracking units, smart metering and utility gateways, industrial routers and DTUs, security and alarm panels, and POS terminals - all scenarios where reliable mid-rate cellular data and long product lifecycles matter more than peak throughput. A key design consideration is thermal and RF layout: the module must be placed with adequate ground plane and the external antenna matched per the carrier band plan for the North America variant; power supply sequencing and a stable 3.3-4.2 V rail with sufficient burst current are critical for LTE transmit bursts. This page synthesizes distributor availability from DigiKey, Mouser, Arrow, Avnet and Octopart, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Pricing shown requires quotation; verify current stock and lead time before ordering.

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EC800G (EC800G-CN) - LTE Cat 1 IoT Module with GPS | Quectel
EC800G

EC800G (EC800G-CN) - LTE Cat 1 IoT Module with GPS | Quectel

The Quectel EC800G-CN is a cost-effective LTE Cat 1 (Cat 1 bis) wireless communication module optimized for M2M and IoT applications, delivering maximum data rates of 10 Mbps downlink and 5 Mbps uplink in a compact LCC surface-mount package with GNSS/GPS positioning support on region variants such as the EC800G-CN-GA. An LTE Cat 1 module is a cellular IoT transceiver that provides 4G LTE connectivity at reduced RF complexity and cost compared with Cat 4 modules. In the product hierarchy, it sits within the wireless communication module family (cellular module -> LTE module -> LTE Cat 1 bis module) and serves as the low-power wide-area link between a host MCU and the operator network via standard AT commands over UART. Key features include LTE Cat 1 data rates up to 10 Mbps DL / 5 Mbps UL, a compact and unified LCC form factor, and integration of GNSS positioning on variants such as the EC800G-CN-GA, which suits asset tracking and telematics. The EC800G-CN family is RoHS-compliant and offered in industrial-grade temperature options, making it appropriate for long-lifetime deployments. According to the Quectel EC800G-CN Reference Design V1.1, the design covers power supply, UART, USB and SIM interfaces, allowing a straightforward single-antenna LTE Cat 1 bis implementation. The LCC castellated package supports both reflow soldering for volume production and hand soldering for prototyping. Typical applications include smart metering, asset management and tracking, POS/smart payment terminals, telematics units, and general IoT M2M gateways where Cat 1 bis data rates are sufficient and 2G/3G networks are being sunset. Design consideration: verify power supply sequencing and the UART/USB interface termination against the official reference design, and confirm regional certification variant (CN, GA, etc.) matches your target market's operator bands. This page synthesizes distributor pricing, pin-compatible same-family alternatives, and practical design guidance not found in the manufacturer datasheet alone. Prices as of 2026-10-20.

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EG25-G - LTE Cat 4 Module 150Mbps | Quectel
EG25-G

EG25-G - LTE Cat 4 Module 150Mbps | Quectel

The Quectel EG25-G is an LTE Cat 4 IoT/M2M wireless module in a 29.0 mm x 32.0 mm x 2.4 mm LGA (land grid array) form factor, delivering maximum data rates of 150 Mbps downlink and 50 Mbps uplink while meeting the 3GPP Release 11 standard. An LTE Cat 4 module is a cellular communication device that provides fourth-generation mobile broadband connectivity for machine-to-machine systems. In the product hierarchy it sits as: cellular module -> LTE modem -> wireless transceiver module -> IoT connectivity component. LTE Cat 4 defines a UE capability class with 150 Mbps peak downlink and 50 Mbps peak uplink, sufficient for most IoT gateways, routers, and telematics units that do not require Cat 6 carrier aggregation speeds. Key features include the 150 Mbps/50 Mbps Cat 4 data rates, a unified LGA footprint compatible with the Quectel EC2x series (EC25, EC21, EC20 R2.1), the EG21-G LTE module, and the UC200T UMTS/HSPA+ series, and a rich set of industry-standard interfaces including USB with drivers for Windows, Linux, and Android. Technically, EG25-G adopts 3GPP Release 11 LTE technology and supports a broad set of Internet protocols, making integration with host processors straightforward. Firmware and regional variant management (for example -G global, -GL, -GGB, -GGC, -GGD suffixes) allows one PCB design to serve multiple regional certification requirements. Typical applications include industrial LTE routers and gateways, in-vehicle telematics units, IoT trackers and smart meters, and embedded systems such as the Pine64 PinePhone, which ships with the EG25-G as its cellular modem. Design consideration: the module is compatible with the EC2x unified footprint, but data rates, band support, and fallback (2G/3G) behavior differ between LTE-only EG25-G and multi-mode EC25 variants - verify regional variant suffix before release. USB_VBUS should be powered from a 5 V system for USB detection per the Quectel reference design. This page synthesizes verified manufacturer data, drop-in footprint-compatible alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet.

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EG25-G 4G LTE Cat 4 Module - 150Mbps IoT M2M | Quectel
EG25-G-4G-LTE

EG25-G 4G LTE Cat 4 Module - 150Mbps IoT M2M | Quectel

The Quectel EG25-G is an LTE Cat 4 IoT/M2M cellular module delivering up to 150 Mbps downlink and 50 Mbps uplink data rates in an LGA form factor measuring 29.0 mm x 32.0 mm x 2.4 mm, compliant with the 3GPP Release 11 standard. An LTE Cat 4 module is a type of cellular wireless transceiver that provides fourth-generation (4G) broadband connectivity for machine-to-machine (M2M) and Internet of Things (IoT) devices. Within the connectivity hierarchy, it sits as a cellular module -> wireless communication device -> network access layer component, and it typically replaces 2G/3G modems in industrial designs migrating to LTE-only networks. Key features include global band coverage on up to 30 LTE bands from a single SKU, an optional GNSS receiver supporting GPS, GLONASS, BeiDou, Galileo and QZSS (Qualcomm IZat Gen8C Lite in the -GL variant), and backward compatibility with EDGE and GSM/GPRS networks so devices remain connected in areas lacking 4G or 3G coverage. Peak data rates of 150/50 Mbps suit bandwidth-hungry IoT applications such as video gateways and industrial routers. Technically, the EG25-G adopts 3GPP Rel. 11 LTE technology and shares the compact unified LGA form factor of Quectel's EC2x series (EC25, EC21, EC20, EC20 R2.0/R2.1) and UC20/UC200T UMTS/HSPA+ modules, allowing drop-in migration between product generations without PCB redesign. A rich set of internet protocols and USB drivers for Windows XP/Vista/7/8/8.1/10, Linux and Android simplifies host integration via AT commands. Typical applications include industrial routers and gateways, vending machines and payment terminals, digital signage and LED screen controllers, and asset trackers requiring GNSS positioning. Design consideration: use the unified EC2x pinout to future-proof the PCB, and verify antenna matching on the ANT_MAIN and ANT_DIV pads per the Quectel EG25-G Hardware Design guide for optimal RF performance. This page synthesizes distributor pricing, drop-in alternatives within the Quectel LTE Standard family, and practical design notes not found in the manufacturer datasheet.

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EG912Y - LTE Cat 1 M2M/IoT Module, 10 Mbps DL, 5 Mbps UL | Quectel
EG912Y

EG912Y - LTE Cat 1 M2M/IoT Module, 10 Mbps DL, 5 Mbps UL | Quectel

The Quectel EG912Y is a series of LTE Cat 1 cellular modules optimized specifically for M2M and IoT applications, delivering maximum data rates of 10 Mbps downlink and 5 Mbps uplink. Adopting the 3GPP Release 9 technology, the EG912Y is offered in regional variants (EG912Y-EU, EG912Y-CN and others) and is housed in a compact surface-mount LGA-126 package measuring approximately 29.0 mm × 25.0 mm × 2.3 mm with 1.0 mm pitch and 1.10 mm maximum height. An LTE Cat 1 module (also called LTE Category 1 or Cat 1) is a 4G LTE user-equipment category defined by 3GPP that provides single-antenna downlink MIMO with peak rates of 10 Mbps DL / 5 Mbps UL. Within the cellular module hierarchy, Cat 1 sits below Cat 4 (150/50 Mbps) but above Cat M1 and NB-IoT, making it the standard choice for mid-bandwidth IoT applications that require voice or video capability beyond low-power LPWA. Cellular modules like the EG912Y belong to the broader power management and RF/transceiver family of industrial modules, integrating baseband, RF transceiver, power management IC (PMIC) and connectivity firmware into a single shielded module that the host MCU/MPU communicates with via UART/USB. Key features of the EG912Y include multi-band LTE, UMTS/HSPA+ and GSM/GPRS/EDGE fallback on supported regional variants, embedded GNSS on selected SKU codes, AT-command firmware compatibility with the broader Quectel EG9x family, and an integrated TCP/IP stack. The module supports both Windows and Linux USB drivers, eSIM (selected variants), and FOTA (firmware-over-the-air) updates. The EG912Y uses Quectel's unified form-factor LGA package that is footprint-compatible with the BG95 series, BG96, EG91 series and EG915U series modules, allowing customers to migrate between LTE Cat 1, Cat M1/Cat NB1 and Cat 1 bis variants without PCB redesign. The 126-pad LGA exposes UART, USB 2.0, PCM digital audio, I2C, ADC and GPIO interfaces to the host processor. Typical applications include asset tracking and fleet management, smart metering (electricity/gas/water), industrial gateways, telematics, POS terminals, and healthcare remote monitoring. The 10/5 Mbps throughput is well suited to video telemetry and periodic firmware updates while maintaining low power consumption versus higher-category LTE modules. Designers should note that the Powerfleet knowledge-base article in this page's sources mentions that the EG912Y-EU variant has been discontinued and replaced in one product family by an EG915N-EA modem, so lifecycle verification is critical before new design-in. Plan PCB pad layout using Quectel's reference land pattern, provide a stable 3.8 V typical VBAT supply, and include a USB type-A or micro-USB footprint for firmware update convenience. This page consolidates distributor pricing, drop-in module alternatives and engineering notes beyond the manufacturer specification document.

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EM4200 - 128-bit 125kHz Read-Only RFID IC | EM Microelectronic
EM4200

EM4200 - 128-bit 125kHz Read-Only RFID IC | EM Microelectronic

The EM Microelectronic EM4200 is a 128-bit read-only CMOS low-frequency contactless identification IC designed to operate at 125 kHz carrier frequency for electronic Read Only RF transponders. Per the EM Microelectronic datasheet, the part integrates a 128-bit laser-programmed ROM memory, an on-chip resonance capacitor, and supports ISO 11785-compliant modulation with Manchester encoding. The die is supplied as a bare chip for inlay/coin/card embedding or in the EM4200A6DF2C-001+ 2-VDFN package variant. An RFID (Radio Frequency Identification) transponder IC is a passive silicon device that harvests energy from an incident electromagnetic field, stores a unique identification code in non-volatile memory, and transmits that code back to an interrogator via load modulation. Within the RFID taxonomy, the EM4200 is a low-frequency (LF, 30-300 kHz) passive read-only tag IC; within the LF tier it belongs to the 125 kHz proximity-ID family used for contactless cards, animal tagging, and access control. LF read-only tags sit below HF (13.56 MHz) and UHF (860-960 MHz) passive ICs in the RFID hierarchy, but offer superior performance near metal and water. Key features include: 128 bits of factory-locked memory (vs. 64 bits in EM4100/4102), supporting up to 100 billion unique identification codes; direct drop-in compatibility with EM4100/4102 and EM4005/4105 readers because the RF protocol, modulation, and 32-bit unique-ID framing are preserved; ISO 11785 animal-ID compliance; an operating frequency range of 100 kHz to 150 kHz; and typical read ranges of a few centimeters at 5 V antenna drive. The on-chip resonance capacitor eliminates the need for an external tuning capacitor in standard transponder layouts. Architecturally, the EM4200 uses a CMOS rectifier front-end, a bandgap-derived voltage reference, and a clock-recovery block synchronized to the 125 kHz carrier. The data path is hard-wired to the laser-programmed ROM array; there is no EEPROM, no write channel, and no anti-collision logic. This single-purpose silicon floor plan gives the EM4200 a cost advantage over the rewritable T5577/EM4305 family but limits it to read-only applications. Typical applications include 125 kHz proximity access cards, animal identification ear tags, industrial key fobs, parking transponders, and time-attendance badges. The EM4200 is the modern replacement for the discontinued EM4100/EM4102; an existing EM4100 reader decodes an EM4200-programmed credential identically. Designers should confirm antenna inductance (typically 1.0-7.5 mH) matches the on-chip resonance capacitor for the target reader field strength. When selecting an RFID transponder IC, decide whether read-only is sufficient - if credential reprogramming is needed, choose a writable chip such as T5577 or EM4305 instead. For pure read-only credentials where EM4100 protocol compliance is required, the EM4200 (original EM Microelectronic die) and TK4100 (Chinese second-source) are the dominant choices. This page synthesizes the EM Microelectronic datasheet, distributor stock data, protocol-level cross-reference information, and direct drop-in alternatives (TK4100, EM4100, EM4102) into a single engineering reference not available from any single distributor page.

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EMB-LR1276S/UL - 868/915MHz LoRaWAN Module | Embit
EMB-LR1276S/UL

EMB-LR1276S/UL - 868/915MHz LoRaWAN Module | Embit

The Embit EMB-LR1276S/UL is an ultra-low-power 868/915 MHz LoRa/LoRaWAN OEM wireless module with up to +18 dBm output power (US) or +14 dBm (EU), receiver sensitivity down to -136 dBm, and less than 1 uA sleep-mode current, housed in an ultra-compact 11.5 x 11.5 x 2 mm castellated LGA package. A LoRaWAN module is an LPWAN (Low Power Wide Area Network) radio module that implements the LoRaWAN protocol stack on top of Semtech's LoRa chirp spread spectrum modulation, sitting within the broader hierarchy of wireless connectivity: RF module -> LPWAN transceiver -> wireless communication subsystem -> IoT device. LoRaWAN enables multi-kilometer range links at very low energy budgets, making it the dominant technology for battery-powered wide-area telemetry. Key features of the EMB-LR1276S include an embedded LoRa/LoRaWAN protocol stack developed by Microchip, compliant with the latest LoRaWAN specifications including Class A and Class C device operation; high interference immunity inherent to LoRa spread-spectrum modulation; and extremely reduced power consumption of less than 1 uA in sleep mode, enabling years of battery life in fielded devices. The module integrates a Microchip SAM R34-class host-friendly interface set and communicates through a wide range of serial interfaces: UART, I2C, SPI, Full-Speed USB 2.0, plus digital and analog I/O ports. The AT-command-accessible LoRaWAN stack lets system integrators add long-range connectivity without developing RF firmware, shortening certification and time-to-market cycles. Typical applications include smart utility metering, agricultural sensor networks, smart-city infrastructure, asset tracking, and industrial telemetry - scenarios that demand kilometer-scale range, weak-signal robustness, and multi-year battery autonomy. Design consideration: the +14 dBm EU / +18 dBm US output power split means firmware and antenna design must respect the regional regulatory limit of the destination market; the 11.5 x 11.5 mm footprint requires a well-defined 50-ohm antenna match for maximum link budget. This page synthesizes verified distributor data, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.

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