DP83TD510ERHBT - IEEE 802.3cg 10Base-T1L Ethernet PHY | TI
MPN: DP83TD510ERHBT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.45 | $7.45 |
| 10 | $6.82 | $68.20 |
| 100 | $6.05 | $605.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.85 | $4,850.00 |
DP83TD510ERHBT Overview
A 10Base-T1L PHY is a physical-layer transceiver defined by the IEEE 802.3cg standard for single-pair Ethernet (SPE). It enables 10 Mbps full-duplex data on a single balanced twisted pair, dramatically reducing cabling cost and weight compared to traditional 100BASE-TX which requires two pairs. The DP83TD510E sits at the bottom of the OSI physical layer, translating MII/RGMII digital data from a host MAC into analog signaling on the single-pair cable, and supports cable reaches up to 1 km at 1.0 Vpp or 200 m+ at 2.4 Vpp, enabling Ethernet deployment in industrial process automation, building automation, and field-sensor networks where 100BASE-TX distances and four-wire harnesses are impractical.
Key features include ultra-low power consumption (approximately 130 mW active per the product page), integrated cable diagnostics with built-in self-test and loopback modes, and MII/RGMII MAC interface compatibility. The device operates over the industrial temperature range of -40C to +125C and supports 1.0 Vpp or 2.4 Vpp transmit amplitude for compliance with both 10Base-T1L and longer-reach point-to-point links. The exposed thermal pad on the VQFN-32 package simplifies PCB thermal management in sealed industrial enclosures.
Architecturally, the DP83TD510E integrates the analog front-end, PHY DSP, MAC interface logic, and clock generation into a single CMOS die, eliminating external magnetics in many configurations and reducing BOM cost. The device supports both 1.0 Vpp (10Base-T1L standard) and 2.4 Vpp (extended-reach) signaling modes selectable via strap or register configuration. Wake-on-LAN and cable-fault detection further enhance its suitability for always-on industrial field nodes.
Typical applications include industrial process sensors, building automation controllers, remote I/O modules, and field instruments requiring Ethernet connectivity. The 1 km reach removes the need for repeaters in many factory-floor and process-plant topologies. Compared to RS-485, 10Base-T1L provides full-duplex operation, deterministic latency, and standardized Ethernet protocol stack interoperability.
When designing with the DP83TD510ERHBT, route the single-pair differential traces as a 100-ohm differential transmission line with ground reference, place the decoupling capacitors within 2 mm of the supply pins, and follow the manufacturer reference layout for the MDI interface. The integrated 25 MHz reference clock output eliminates the need for an external crystal in many MCU designs, but a high-quality crystal or oscillator should still be used when low PPM accuracy is required for timing-sensitive applications.
This page synthesizes distributor pricing, drop-in alternatives, application context, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DP83TD510ERHBT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DP83TD510ERHBT (same form factor and footprint) — differing in Configuration, Operating Temperature, Package, Product Type.
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Request AlternativesDP83TD510ERHBT Specifications
| Product Type | Ethernet Physical Layer Transceiver (PHY) |
| Standard | IEEE 802.3cg 10Base-T1L |
| Data Rate | 10 Mbps |
| Configuration | Full / Half Duplex |
| Number of Transceivers | 1/1 |
| MAC Interface | MII / RGMII |
| Cable Reach | Up to 1 km (single twisted pair) |
| Transmit Amplitude | 1.0 Vpp or 2.4 Vpp selectable |
| Supply Voltage | 3.3 V single supply |
| Active Power Consumption | Approximately 130 mW |
| Reference Clock Output | 25 MHz |
| Operating Temperature | -40C to +125C |
| Package | 32-pin VQFN (5x5 mm) |
| Mounting Type | Surface Mount |
| MSL Level | 2 (1 year floor life at <30C/60% RH) |
| RoHS Status | Compliant |
DP83TD510ERHBT Pin Configuration
| Pin 1 | RESERVED — Reserved pin; leave floating or tie to ground per datasheet |
| Pin 2 | RX_D0 — MII/RGMII receive data bit 0 |
| Pin 3 | RX_D1 — MII/RGMII receive data bit 1 |
| Pin 4 | RX_D2 — MII/RGMII receive data bit 2 |
| Pin 5 | RX_D3 — MII/RGMII receive data bit 3 |
| Pin 6 | RX_CLK |
| Pin 7 | RX_DV — MII receive data valid / RGMII RX control |
| Pin 8 | RX_ER — MII receive error (optional in RGMII) |
| Pin 9 | MDIO — Management data I/O |
| Pin 10 | MDC — Management data clock |
| Pin 11 | INT — Interrupt output (active low, open-drain) |
| Pin 12 | RESET — Hardware reset input (active low) |
| Pin 13 | VDDIO — Digital I/O supply (3.3V) |
| Pin 14 | TX_CLK — MII transmit clock input |
| Pin 15 | TX_D0 — MII/RGMII transmit data bit 0 |
| Pin 16 | TX_D1 — MII/RGMII transmit data bit 1 |
| Pin 17 | TX_D2 — MII/RGMII transmit data bit 2 |
| Pin 18 | TX_D3 — MII/RGMII transmit data bit 3 |
| Pin 19 | TX_EN — MII transmit enable / RGMII TX control |
| Pin 20 | TX_ER — MII transmit error (optional in RGMII) |
| Pin 21 | GPIO0 — General-purpose I/O / strap configuration |
| Pin 22 | GPIO1 — General-purpose I/O / strap configuration |
| Pin 23 | CLK_OUT — 25 MHz reference clock output for host |
| Pin 24 | XI — 25 MHz crystal input or external clock input |
| Pin 25 | XO — 25 MHz crystal output (leave floating if XI driven externally) |
| Pin 26 | VDD — Analog/digital core supply (3.3V) |
| Pin 27 | GND — Ground |
| Pin 28 | MDI_P — Differential media-dependent interface positive |
| Pin 29 | MDI_N — Differential media-dependent interface negative |
| Pin 30 | AVDD — Analog supply (3.3V, filtered) |
| Pin 31 | LED0 — Link/activity LED driver output |
| Pin 32 | LED1 — Link/activity LED driver output |
Typical Applications
DP83TD510ERHBT is suitable for 6 applications: Industrial Process Sensors, Building Automation Controllers, Remote I/O Modules, Field Instrumentation and Transmitters, Automotive Edge Sensors, Solar and Renewable Energy Monitoring.
Industrial Process Sensors
The DP83TD510ERHBT's 1 km single-pair reach and IEEE 802.3cg 10Base-T1L compliance make it ideal for connecting remote process sensors in oil and gas, chemical, and water-treatment plants. Its 3.3V single-supply operation and approximately 130 mW active consumption keep thermal dissipation low inside sealed field enclosures. The integrated 25 MHz reference clock output eliminates an external oscillator for many MCU pairings. Compared with RS-485, this PHY adds standardized Ethernet protocol stack support, enabling unified SCADA and cloud telemetry without protocol translation gateways.
Recommended
Building Automation Controllers
Building automation systems benefit from the DP83TD510ERHBT's single-pair cabling that reduces conduit fill and installation cost versus traditional four-pair Ethernet. The -40C to +125C industrial temperature rating supports rooftop and mechanical-room deployments without active cooling. The PHY's built-in cable diagnostics and self-test features speed commissioning by pinpointing wiring faults from the controller's management interface. The 10Base-T1L protocol stacks cleanly onto BACnet/IP and Modbus TCP for HVAC and lighting controllers.
Recommended
Remote I/O Modules
Distributed I/O modules in factory-automation cells use the DP83TD510ERHBT to deliver deterministic Ethernet over a single twisted pair, slashing wiring harness weight and cost. The MII/RGMII interface attaches directly to industrial MCU MACs without an FPGA bridge. The selectable 1.0 Vpp or 2.4 Vpp transmit amplitude lets the same hardware serve 200 m implementations achieve 1 km links. Built-in loopback and self-test modes support remote diagnostics from the PLC without physical truck-rolls.
Recommended
Field Instrumentation and Transmitters
Smart field instruments such as pressure, flow, and temperature transmitters integrate the DP83TD510ERHBT to deliver process data over a single intrinsically-safe pair. The PHY's low power (130 mW) helps meet the strict energy budget of loop-powered or PoDL-fed field devices. The 10Base-T1L standard supports both 1.0 Vpp standard mode and 2.4 Vpp long-reach mode, allowing the same PCB to ship in short-hop and long-haul variants. Built-in cable-fault detection reduces maintenance trips to remote wells and tanks.
Recommended
Automotive Edge Sensors
Although not AEC-Q100 qualified, the DP83TD510ERHBT's industrial temperature range supports non-safety automotive edge nodes such as body electronics and aftermarket telematics. The single-pair Ethernet reduces wiring harness weight versus four-pair 100BASE-TX, which matters for EV range optimization. The integrated reference clock output eliminates external oscillator cost in space-constrained ECU enclosures. The PHY's deterministic 10 Mbps latency suits sensor-fusion and over-the-air diagnostic uplinks.
Recommended
Solar and Renewable Energy Monitoring
Solar inverter and battery-management systems use the DP83TD510ERHBT to backhaul per-panel telemetry over a single twisted pair daisy-chain, avoiding the cost of running dedicated Ethernet to every panel. The PHY's 1 km reach covers large commercial-array footprints without repeaters, while its industrial -40C to +125C rating tolerates outdoor cabinet temperatures. Built-in cable diagnostics simplify commissioning in newly installed arrays. The standardized 10Base-T1L stack integrates directly with Modbus TCP and Sunspec models used in solar SCADA systems.
Recommended
Recommended Products Summary
Engineering reference data for DP83TD510ERHBT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DP83TD510ERHBR | DP83TD510ERHBTG4 | ADIN1100CCPZ | ADIN1110CCPZ | DP83TC812ERHBR |
|---|---|---|---|---|---|---|
| Package | VQFN-32 (RHB) 5x5 mm | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (RHB) 5x5 mm - same | VQFN-32 (CCP) 5x5 mm - same footprint | VQFN-32 (CCP) 5x5 mm - same footprint | VQFN-32 (RHB) 5x5 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Analog Devices | Analog Devices | Texas Instruments |
| Standard | IEEE 802.3cg 10Base-T1L | IEEE 802.3cg 10Base-T1L | IEEE 802.3cg 10Base-T1L | IEEE 802.3cg 10Base-T1L | IEEE 802.3cg 10Base-T1L (with MAC) | IEEE 802.3bw 100Base-T1 |
| Data Rate | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps | 10 Mbps | 100 Mbps (10x faster) |
| Cable Reach | Up to 1 km | Up to 1 km | Up to 1 km | Up to 1.7 km | Up to 1.7 km | Up to 50 m (100Base-T1 typical) |
| MAC Interface | MII / RGMII | MII / RGMII | MII / RGMII | MII / RGMII | SPI (integrated MAC) | MII / RGMII |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Industrial Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- TI ecosystem integration with reference designs (vs ADIN1100CCPZ)
- Integrated 25 MHz reference clock output (vs ADIN1110CCPZ)
- Same-package drop-in compatibility with DP83TD510ERHBR (vs DP83TD510ERHBR)
Design Notes
Route the MDI_P and MDI_N differential pair as a 100-ohm differential transmission line with a continuous ground reference plane underneath. Keep the pair length-matched to within 2 mm and avoid right-angle bends. Place the PHY within 25 mm of the RJ45 or single-pair connector to keep the unshielded portion short. TI reference design TIDA-010077 provides a validated layout and stack-up that engineers can copy directly.
Place a 0.1 uF X7R decoupling capacitor within 2 mm of each VDD, VDDIO, and AVDD pin, plus a 10 uF bulk capacitor at the package's exposed thermal pad. Use a ferrite bead between AVDD and VDD rails to isolate analog and digital supply noise, since AVDD powers the sensitive PLL and MDI analog front-end. Estimated: at 3.3V supply and 130 mW active, the average current is about 39 mA, so a 100 mA LDO such as TPS7A0233 is sufficient with margin.
Do not omit the 25 MHz crystal or external reference clock; the DP83TD510E requires a stable reference within +/-50 ppm for proper 10Base-T1L signaling. When the host MCU needs the PHY's CLK_OUT, route it as a short, guarded trace to avoid coupling noise into the MDI pair. Avoid running the MDI pair parallel to switching power converter traces for more than 5 mm to prevent common-mode noise injection that can degrade link margin.
The VQFN-32 RHB package's exposed thermal pad must be soldered to a ground copper pour of at least 25 mm^2 on the top layer, plus thermal vias to inner ground planes. Although the 130 mW active dissipation is modest, sealed industrial enclosures with no airflow rely on the PCB copper pour to keep junction temperature below +125C. Estimated: at 130 mW dissipation and a typical theta_JA of 35 C/W on a 2-layer JEDEC board, junction rise above ambient is only 4.5C, well within margin.
Compliance Information
RoHS and REACH compliant per TI product page. Industrial temperature grade -40C to +125C; not AEC-Q100 qualified for automotive safety applications. Lead-free VQFN package per TI packaging specifications.
