10AS032H2F34I2LG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA
MPN: 10AS032H2F34I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1500 | $750,000.00 |
| 1,000 | $1390 | $1,390,000.00 |
Drop-in alternatives for 10AS032H2F34I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS032H2F34I2LG Maximum Ratings & Electrical Characteristics
| Product Type | SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) |
| Family | Arria 10 SX |
| Logic Elements | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| Package | 1152-ball FC-FBGA, 35 x 35 mm |
| Package Code | F34 (Flip-Chip BGA, 1.0 mm pitch) |
| Terminal Form | Ball |
| Terminal Count | 1152 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Design Tool | Intel Quartus Prime |
| Transceiver Data Rate | Up to 17.4 Gbps (per family) |
10AS032H2F34I2LG f34 (flip-chip bga, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10AS032H2F34I2LG (f34 (flip-chip bga, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H2F34I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H2F34I2LG is suitable for 8 applications: Industrial Motor Control & Servo Drives, Software-Defined Radio Baseband, Machine Vision & Video Processing, Aerospace & Defense Signal Processing, High-Performance Embedded Computing (HPEC), Medical Imaging & Diagnostic Equipment, Industrial Networking & Protocol Bridging, Test & Measurement Instrumentation.
Industrial Motor Control & Servo Drives
The 10AS032H2F34I2LG is well-suited to industrial motor control because the dual ARM Cortex-A9 HPS executes field-oriented control (FOC) loops with deterministic latency at up to 1.5 GHz, while the 320K-LE FPGA fabric implements high-resolution PWM (up to 16-bit at 100 kHz switching), encoder interfaces (EnDat 2.2, BiSS-C, SSI), and fieldbus slaves (EtherCAT, PROFINET IRT). The 0.9 V core and 20 nm process reduce I2R losses across the 1152-ball BGA, and the industrial -40C to +100C temperature grade covers factory-floor enclosures. Compared with a discrete MCU-plus-FPGA partition, the integrated HPS-to-FPGA AXI bus removes external bus arbitration and shrinks PCB area in compact servo-drive form factors.
Recommended
Software-Defined Radio Baseband
The 10AS032H2F34I2LG supports software-defined radio (SDR) baseband processing by combining up to 17.4 Gbps transceivers (per the Arria 10 family) on the FPGA fabric with a Cortex-A9 HPS for protocol-stack control. The 320K logic elements, dedicated DSP blocks, and on-chip M20K memory implement wideband digital down-conversion (DDC), channelization, and modulation/demodulation in real time, while the HPS runs Linux for higher-layer packet processing. The 1.0 mm-pitch F34 FC-FBGA supports the matched-length differential routing that the transceiver channels require for sub-microsecond latency. This combination is well-suited to tactical radios, LTE small cells, and signal-intelligence platforms.
Recommended
Machine Vision & Video Processing
The 10AS032H2F34I2LG is used in machine vision preprocessing pipelines where the FPGA fabric performs pixel-level operations (debayering, gamma correction, color-space conversion, edge detection, optical-flow) at multi-megapixel frame rates, while the dual ARM Cortex-A9 HPS runs the OpenCV-based recognition stack and communicates with the host via GigE Vision or USB3 Vision. The 320K logic elements and embedded DSP blocks sustain 1080p60 or 4K30 throughput on common Sony/ON Semiconductor CMOS sensors, and the industrial -40C to +100C temperature range supports outdoor and factory deployments. The integrated HPS removes an external SoC, reducing bill of materials and inter-chip latency.
Recommended
Aerospace & Defense Signal Processing
The 10AS032H2F34I2LG serves aerospace and defense signal-processing applications such as radar front-end preprocessing, electronic-warfare (EW) channelization, and secure communications. Its 320K logic elements implement wideband FFTs, pulse compression, and digital beamforming in real time, while the hardened ARM Cortex-A9 HPS runs the mission-management software stack. The 20 nm TSMC process and industrial temperature grade provide the reliability headroom required for DO-254 and MIL-STD-810 environments, and the F34 FC-FBGA package supports the ruggedized PCB stacks common in avionics LRUs. Conduction-cooled variants can be specified via Intel's military screening program.
Recommended
High-Performance Embedded Computing (HPEC)
The 10AS032H2F34I2LG is deployed in HPEC subsystems where it acts as a sensor-fusion node: the FPGA fabric aggregates data from radar, lidar, and IMU sensors over GPIO, SPI, or LVDS interfaces, while the ARM Cortex-A9 HPS executes the sensor-fusion and target-tracking algorithms. The 320K logic elements provide headroom for multi-sensor Kalman filters and convolutional neural network (CNN) inference accelerators, and the 1.5 GHz HPS delivers the throughput required for real-time situational awareness. The F34 FC-FBGA's high ball density supports the many high-speed serializer/deserializer (SerDes) channels needed for sensor interconnect.
Recommended
Medical Imaging & Diagnostic Equipment
The 10AS032H2F34I2LG fits medical imaging systems such as ultrasound front-ends, CT reconstruction accelerators, and patient-monitoring aggregation hubs. The FPGA fabric implements beamforming and matched-filter operations in ultrasound, or back-projection kernels in CT reconstruction, at speeds a general-purpose CPU cannot match. The ARM Cortex-A9 HPS runs the user interface, DICOM stack, and clinical workflow software. The 0.9 V core voltage and 20 nm process keep power dissipation low enough for fan-less or low-airflow medical enclosures, and the industrial -40C to +100C temperature grade covers operating-room environments.
Recommended
Industrial Networking & Protocol Bridging
The 10AS032H2F34I2LG is used in industrial gateways and protocol bridges where the FPGA fabric terminates fieldbus protocols (PROFINET, EtherCAT, EtherNet/IP, Modbus TCP) while the Cortex-A9 HPS provides firewall, routing, and OPC-UA publish/subscribe functions. The 17.4 Gbps transceivers support multi-port Gigabit Ethernet aggregation, and the 320K logic elements allow line-rate frame processing with sub-microsecond latency. The industrial -40C to +100C temperature range and 1.0 mm-pitch F34 FC-FBGA package suit DIN-rail and panel-mount industrial PCs. Compared with a discrete NIC-plus-router design, the integrated SoC reduces both BOM cost and PCB area.
Recommended
Test & Measurement Instrumentation
The 10AS032H2F34I2LG is used in test & measurement equipment such as oscilloscopes, protocol analyzers, and arbitrary waveform generators. The FPGA fabric implements real-time DSP (FFT, FIR/IIR filtering, modulation analysis) on multi-GS/s ADC inputs, while the ARM Cortex-A9 HPS handles the touchscreen GUI, SCPI command parser, and USB/LAN connectivity. The 320K logic elements and embedded M20K memory blocks sustain deep acquisition-memory buffering, and the 1.5 GHz HPS provides the compute headroom required for instrument calibration and self-test. The F34 FC-FBGA supports the matched-length high-speed ADC interface routing that high-bandwidth instruments require.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H2F34I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H2F34I1HG | 10AS032H2F34E2SG | 10AS032H2F34E2LG | 10AS032H1F34I1HG | 10AS032E4F29I3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34, 35x35 mm) | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 1152-FBGA (F34, 35x35 mm) - same | 780-FBGA (F29, 29x29 mm) - different package |
| Logic Elements | 320,000 | 320,000 (same) | 320,000 (same) | 320,000 (same) | 320,000 (same) | 320,000 (same) |
| Speed Grade | H2 (I2 industrial) | H2 (I1 industrial, slower) | H2 (E2 extended) | H2 (E2 extended) | H1 (I1 industrial, slowest) | E4 (I3 industrial) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C |
| HPS Maximum Clock | 1.5 GHz | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) | 1.5 GHz (same) |
| Process Technology | 20 nm | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) |
| Core Voltage | 0.9 V | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) |
| Approx Unit Price (qty-1) | $1,850 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Industrial-temperature I2 speed grade in F34 package (vs 10AS032H2F34I1HG)
- Industrial -40C to +100C vs extended -40C to +125C temperature grade (vs 10AS032H2F34E2SG)
- H2 speed grade vs H1 speed grade at same F34 footprint (vs 10AS032H1F34I1HG)
- F34 1152-ball package retains full I/O count vs F29 780-ball (vs 10AS032E4F29I3SG)
Design Notes
Estimated: The 1152-ball FC-FBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvias (laser-drilled, 0.1 mm via pad), sequential lamination, and via-in-pad plating for the inner-row balls. Use a 1 oz copper outer layer and 0.5 oz inner layers with a low-loss dielectric (Df <= 0.005 at 1 GHz) such as Isola FR408HR or Rogers RO4350B for high-speed transceiver channels. Matched-length routing within +/- 0.127 mm (5 mil) is required for transceiver pairs to meet the Arria 10 GX/SX transceiver skew specification. Reference the Intel Arria 10 GX/SX/GT PCB Design Guidelines for via pattern, antipad diameter, and reference-plane recommendations.
The 10AS032H2F34I2LG requires multiple sequenced power rails: 0.9 V VCC (FPGA core), 1.8 V VCCIO (HPS I/O), 1.2 V VCC_HPS, 1.5 V/2.5 V/3.3 V user I/O, and dedicated transceiver supplies (1.0 V VCCH_GXB and 1.5 V/1.8 V VCCA_GXB). Per the Intel Arria 10 Power Management User Guide, the HPS core, FPGA core, and transceiver supplies must ramp in a specific order to avoid in-rush latch-up; use a multi-rail power controller such as the Intel EM11x or Texas Instruments UCD90xxx with the proper sequence file. Decoupling: place 0402 0.1 uF MLCCs within 1 mm of every power pin, plus 22 uF bulk capacitors on each rail. Total decoupling budget is on the order of 200-300 capacitors for the full BGA — reference the device pin connection guidelines.
Estimated: At maximum utilization (320K LE at ~80% utilization, HPS at 1.5 GHz, transceivers active), the 10AS032H2F34I2LG can dissipate 15-25 W depending on toggle rate. The 35x35 mm FC-FBGA exposes a thermal pad on the top side; design a heat sink or thermal-interface-material (TIM) pad with thermal resistance <= 0.1 C/W. For fan-less enclosures, use a 4-6 mm copper coin under the package and aluminum heat spreader. Use the Intel PowerPlay Early Power Estimator (EPE) worksheet at design entry to size the cooling solution before committing to a PCB stack-up. Junction temperature must stay below 100C for industrial grade.
Differential transceiver pairs on the Arria 10 SX require 100-ohm differential impedance with intra-pair length matching within 0.127 mm (5 mil). Use AC-coupled 0402 capacitors (100 nF X7R) on the transmit side near the FPGA ball, with the receiver side AC-coupling per protocol requirements. Reference the Arria 10 GXB Transceiver User Guide for pre-emphasis, equalization, and VOD settings per data rate. Memory interfaces (DDR3/DDR4 to HPS) require matched-length fly-by topology with proper write-leveling calibration in the Quartus Prime HPS preloader. SI simulation with the Intel-provided IBIS-AMI models is strongly recommended before tape-out.
Common pitfalls with the 10AS032H2F34I2LG include: (1) using the wrong speed grade in the Quartus Prime project — speed-grade selection must match the OPN suffix exactly; (2) failing to generate the HPS preloader and U-Boot for the specific boot source (QSPI flash, SD card, NAND) before Quartus Prime programming file generation; (3) confusing the F34 package (1152-ball, 35x35 mm) with the F29 (780-ball, 29x29 mm) or F35 (1152-ball, different pinout) — pin assignments in the Quartus QSF file must be regenerated when changing package; (4) omitting the JTAG header or AS mode jumper for in-system programming; (5) under-sizing the HPS DDR3 controller fly-by routing — fly-by stubs longer than 25 mm require write-leveling calibration adjustments.
Compliance Information
RoHS compliance confirmed by Intel product page; industrial temperature grade (-40C to +100C) is not AEC-Q100 qualified (AEC-Q100 is for automotive-grade ICs). REACH, halogen-free, and conflict-minerals status were not stated in the verified web data and are marked 'unknown'. For full REACH/SVHC disclosure request the Intel product-content declaration.
