10AS057K2F35E1HG vs 10AS057K1F35I1HG Comparison
Detailed side-by-side comparison of 10AS057K2F35E1HG by Intel and 10AS057K1F35I1HG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AS057K2F35E1HG | 10AS057K1F35I1HG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,995.00 | $5,210.00 |
| Family | Arria 10 SX | Arria 10 SX |
| Logic Elements | 570,000 | 570 K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | — |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | — |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Package | 1152-ball FC-BGA (F35), 35x35 mm | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| RoHS Status | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Core Processor | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Architecture | — | MCU, FPGA |
| Max Core Frequency | — | 1.5 GHz |
| User I/O Count | — | 396 |
| On-chip RAM | — | 256 KB |
| Mounting Type | — | Surface Mount (BGA) |
| Operating Temperature | — | -40C to +100C (TJ) |
| Supplier Device Package | — | 1152-FBGA, FCBGA |
| Peripherals | — | DMA, POR, WDT |
| Connectivity | — | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART |
| Process Node | — | 20 nm |
| Lead-Free | — | Yes |