10AS057K2F35E1HG vs 10AS057K1F35I1HG Vergleich
Detaillierter Direktvergleich von 10AS057K2F35E1HG von Intel und 10AS057K1F35I1HG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AS057K2F35E1HG | 10AS057K1F35I1HG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.995,00 | $5.210,00 |
| Family | Arria 10 SX | Arria 10 SX |
| Logic Elements | 570,000 | 570 K |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 29.4 Mbits (M20K + MLAB) | — |
| DSP Blocks (18x19 Multipliers) | 1,566 | — |
| Maximum User I/O Pins | [DATA_NEEDED: max user I/O] | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | — |
| Transceivers | 24 (up to 17.4 Gbps) | — |
| PCIe Hard IP | Gen2/Gen3 x8 | — |
| Memory Interfaces (FPGA side) | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 | — |
| Memory Interfaces (HPS side) | DDR4, DDR3, LPDDR3 | — |
| Gehäuse | 1152-ball FC-BGA (F35), 35x35 mm | 1152-FBGA, FC (35x35 mm) |
| Process Technology | 20 nm TSMC | — |
| Operating Temperature Grade | Industrial | — |
| RoHS-Status | Compliant | Compliant |
| Supply Voltage (Core) | [DATA_NEEDED: Vcore] | — |
| Core Processor | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Architecture | — | MCU, FPGA |
| Max Core Frequency | — | 1.5 GHz |
| User I/O Count | — | 396 |
| On-chip RAM | — | 256 KB |
| Montageart | — | Surface Mount (BGA) |
| Betriebstemperatur | — | -40C to +100C (TJ) |
| Supplier Device Package | — | 1152-FBGA, FCBGA |
| Peripherals | — | DMA, POR, WDT |
| Connectivity | — | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART |
| Process Node | — | 20 nm |
| Lead-Free | — | Yes |