10AX090N2F45E2LG vs 10AX090N3F40E2LG Comparison
Detailed side-by-side comparison of 10AX090N2F45E2LG by Intel and 10AX090N3F40E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX090N2F45E2LG | 10AX090N3F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6,095.25 | $2,280.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| User I/O Pins | 768 | 600 |
| Core Voltage | 0.9 V | 0.9 V typical |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Up to 24 full-duplex channels |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | TSMC 20nm |
| Package | 1932-ball FCBGA (FBGA) | 1517-ball FCBGA, 40 mm |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | — |
| Mounting Type | Surface Mount | — |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Lifecycle Status | Active | — |
| Embedded Memory | — | 59,234,304 bits |
| Transceiver Data Rate | — | Up to 14.4 Gbps |
| Hard Memory Controllers | — | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) |
| Maximum DDR4 Rate | — | 2666 Mbps |
| PCIe Hard IP | — | PCIe Gen3 x8 (root port or endpoint) |
| Operating Temperature | — | -40C to +100C (extended industrial) |
| Configuration Encryption | — | AES-256 bitstream encryption |
| Partial Reconfiguration | — | Supported |
| RoHS Status | — | Compliant |