10AX090N2F45E2LG vs 10AX090N3F45E2LG Comparison
Detailed side-by-side comparison of 10AX090N2F45E2LG by Intel and 10AX090N3F45E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX090N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6,095.25 | $2,285.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (variable-precision, with hardened FP) |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | 20 nm TSMC |
| Package | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | SRAM-based (requires external flash) |
| Mounting Type | Surface Mount | — |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Lifecycle Status | Active | — |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Speed Grade | — | 3 (mid) |
| RoHS Status | — | Compliant |
| Toolchain | — | Intel Quartus Prime Pro Edition |