10AX090N2F45E2LG vs 10AX090N3F45E2LG Vergleich
Detaillierter Direktvergleich von 10AX090N2F45E2LG von Intel und 10AX090N3F45E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090N2F45E2LG | 10AX090N3F45E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6.095,25 | $2.285,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | — |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 768 (variable-precision, with hardened FP) |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | 20 nm TSMC |
| Gehäuse | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | SRAM-based (requires external flash) |
| Montageart | Surface Mount | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Lebenszyklusstatus | Active | — |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Speed Grade | — | 3 (mid) |
| RoHS-Status | — | Compliant |
| Toolchain | — | Intel Quartus Prime Pro Edition |