10AX115U2F45E2SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
MPN: 10AX115U2F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9227.54 | $9,227.54 |
| 10 | $8854.41 | $88,544.10 |
| 25 | $8395.62 | $209,890.50 |
| 100 | $7611.47 | $761,147.00 |
| 500 | $6920.66 | $3,460,330.00 |
Drop-in alternatives for 10AX115U2F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115U3F45E2SG
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$5800 / Unit
View Datasheet →10AX115U2F45E3SG
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10AX115U2F45I1SG
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Contact for price
View Datasheet →10AX115U2F45E2LG
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$7380 / Unit
View Datasheet →10AX115U2F45E1SG
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$13900 / Unit
View Datasheet →10AX115U2F45E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,560 |
| Embedded Memory Blocks | 2,134 M20K blocks (approx.) |
| DSP Blocks | 1,518 (variable-precision, hardened FP) |
| User I/Os | 480 |
| Transceivers | Up to 24 (GX, 12.5 Gbps) |
| PCIe Hard IP | Gen3 x8 |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 |
| Process Node | 20 nm |
| Speed Grade | 2 |
| Temperature Grade | E2 (industrial) |
| Package | 1932-ball FCBGA (45 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (volatile, requires config device) |
10AX115U2F45E2SG 1932-ball fcbga (45 mm) Pin Configuration Guide
Complete pinout information for 10AX115U2F45E2SG (1932-ball fcbga (45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U2F45E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U2F45E2SG is suitable for 6 applications: 10G/25G Ethernet Network Interface Cards, Wireless Baseband / 4G LTE Small Cell Processing, High-Speed Serial Bridging and Protocol Conversion, Test & Measurement Instrumentation with Parallel DSP, Broadcast Video Processing and Format Conversion, Industrial High-Speed Imaging and Machine Vision.
10G/25G Ethernet Network Interface Cards
The 10AX115U2F45E2SG's up to 24 transceivers at 12.5 Gbps (oversampled to support 10.3125 Gbps line rates) plus hardened 10G Ethernet MAC make it a strong fit for 10G/25G Ethernet NICs. The 1.15M-LE capacity absorbs packet-classification, queuing, and protocol-offload logic without resorting to external co-processors. PCIe Gen3 x8 hard IP provides the host-side interface with up to 8 GT/s bandwidth. Compared with a discrete PHY + ASSP approach, this FPGA consolidates PHY management, MAC, and application logic into one chip, reducing BOM and PCB area.
Recommended
Wireless Baseband / 4G LTE Small Cell Processing
The 1,518 variable-precision DSP blocks in the 10AX115U2F45E2SG handle FFT, channel estimation, and turbo-decoding workloads common in LTE small-cell baseband. The E2 industrial temperature grade supports outdoor deployments at base-station sites. The combination of 480 user I/Os, multiple transceivers for CPRI/eCPRI fronthaul, and ample logic density lets a single FPGA implement the entire PHY plus light MAC. For higher-density 5G deployments, the 10AX115N2F45E2SG variant offers additional DSP resources while keeping the same package footprint.
Recommended
High-Speed Serial Bridging and Protocol Conversion
Engineers commonly deploy the 10AX115U2F45E2SG as a protocol bridge between incompatible serializer/deserializer chipsets - e.g., converting CPRI to 10G Ethernet or Interlaken to PCIe. The 24 transceivers enable multiple concurrent protocol streams while the 68.8 Mbits of embedded memory buffers packet bursts without external SRAM. The high logic count supports rich protocol-stack offload (CRC, encryption, framing). Compared with using two ASSPs plus glue logic, this FPGA unifies the design and reduces latency.
Recommended
Test & Measurement Instrumentation with Parallel DSP
Test equipment such as oscilloscopes, BERTs, and signal analyzers benefit from the 10AX115U2F45E2SG's massive parallel DSP capacity and high-I/O count. The device performs waveform decimation, FFT analysis, and trigger logic in real time across multiple channels. The 12.5 Gbps transceivers support fast data export to host PCs over standards like 10G Ethernet or PCIe. The 1932-ball FCBGA provides enough I/O to interface with multiple ADC/DAC channels simultaneously without external muxing.
Recommended
Broadcast Video Processing and Format Conversion
Broadcast studios and contribution encoders use the 10AX115U2F45E2SG for SDI/HD-SDI/3G-SDI routing, format conversion, and color-space transcoding. The 480 user I/Os handle many parallel SDI streams plus ancillary data, while the embedded memory acts as line/frame buffers. Hardened PCIe Gen3 enables ingest to/from host CPUs at line rate. Compared with ASSP video processors, this FPGA offers customizable pipeline depth and supports emerging formats without silicon re-spin.
Recommended
Industrial High-Speed Imaging and Machine Vision
Factory automation vision systems leverage the 10AX115U2F45E2SG's combination of high I/O count, fast transceivers for CoaXPress or 10G Vision, and DSP blocks for real-time image processing. The E2 industrial temperature grade handles factory-floor thermal swings. The FPGA pre-processes images (defect detection, alignment, optical flow) before forwarding to a host CPU, reducing system-level latency. The 1932-ball FCBGA package supports high-density board layouts typical in line-scan camera systems.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U2F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U3F45E2SG | 10AX115U2F45E3SG | 10AX115U2F45I1SG | 10AX115U2F45E2LG | 10AX115U2F45E1SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | 2 (mid) | 3 (fastest) | 2 | 1 (slowest) | 2 | 2 |
| Temperature Grade | E2 (industrial) | E2 | E3 (extended) | I1 (industrial) | E2 | E1 (commercial) |
| User I/Os | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceivers | Up to 24 (12.5 Gbps) | Up to 24 | Up to 24 | Up to 24 | Up to 24 | Up to 24 |
| Embedded Memory | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits | 68,857,560 bits |
| RoHS / Lead-free | RoHS / Yes | RoHS / Yes | RoHS / Yes | RoHS / Yes | RoHS / Yes (lead-free) | RoHS / Yes |
Key Differentiators
- Speed grade 2 offers better cost-to-performance than grade 3 for designs that close timing (vs 10AX115U3F45E2SG)
- E2 industrial temperature grade supports -40C to +100C junction (vs 10AX115U2F45E1SG)
- Arria 10 GX variant provides hardened PCIe Gen3 x8 + 10G Ethernet MAC (vs Arria 10 SX SoC variant)
Design Notes
Estimated: At typical utilization (~70% logic, 50% transceivers, 20% DSP), the 10AX115U2F45E2SG can dissipate 15-25 W, well above what a bare FCBGA can shed without active cooling. The 1932-ball FCBGA package is an exposed-die top-side design, so engineers must use a thermal interface material (TIM) between the die surface and a heatsink or cold plate. Forced airflow of at least 200 LFM is recommended for sustained workloads. Reference Intel's Arria 10 Thermal Design Guide for detailed thermal models. Failure to provide adequate cooling will trigger thermal throttling or device shutdown at junction temperatures above 100C for the E2 industrial grade.
The 1932-ball FCBGA requires a high-layer-count PCB (typically 12+ layers) with impedance-controlled striplines for the 12.5 Gbps transceivers. Use a 100-ohm differential pair stackup with reference planes on adjacent layers for every transceiver lane. Route length matching within 0.127 mm (5 mil) for lanes within a transceiver bank. Decoupling: place 0402-sized 0.1 uF and 0.001 uF capacitors immediately adjacent to each power pin, plus bulk capacitors on every power rail. Pinout data for the F45 package is in the Intel Arria 10 Family Pin Connection Guidelines document.
Common pitfalls include: (1) forgetting the external configuration memory - the 10AX115U2F45E2SG is SRAM-based, so a configuration flash or EPCQ device is mandatory for standalone boot; (2) underestimating power-rail sequencing - the FPGA has multiple supply rails (VCC, VCCP, VCCPT, VCCIO_x, etc.) with strict turn-on/turn-off sequencing requirements; (3) failing to provide JTAG access - even production designs need a JTAG header for debug and field updates; (4) ignoring pinout variation across package options - the F45 package pinout differs from F34 or F40 packages, so swapping between packages requires a full PCB re-layout.
Compliance Information
RoHS and lead-free per Intel Arria 10 product family compliance documentation. Not AEC-Q100 qualified - FPGAs are not typically AEC-Q100 screened as bare ICs; for automotive, the part must be qualified at the system level. REACH compliance via Intel Product Material Declaration database.
