10AX115U3F45E2SG vs 10AX115U3F45E2LG Comparison

Detailed side-by-side comparison of 10AX115U3F45E2SG by Intel and 10AX115U3F45E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AX115U3F45E2SG 10AX115U3F45E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $5,800.00 $8,500.00
Family Arria 10 GX Arria 10
Logic Elements (LE) 1,150,000 —
Adaptive Logic Modules (ALM) 427,200 —
Embedded Memory Bits 68,857,856 (≈ 52.99 Mbit) 68,857,856
Number of Transceivers [DATA_NEEDED: per-die transceiver count, F45 package variant] —
Maximum Transceiver Data Rate 17.4 Gbps —
DSP Blocks Variable-precision, hardened floating-point Variable-precision, 1.5 TFLOPs FP32
Hard Memory Controllers 2 (DDR4/DDR3/QDRII+/RLDRAM3) —
Hard PCIe Gen3 IP Blocks 2 × PCIe Gen3 (x8/x4/x2/x1) —
Package 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) —
Process Node 20 nm Tri-Gate (Intel) —
Speed Grade -2 (E2 commercial/extended) U3 (medium-performance, transceiver-focused)
Operating Temperature Industrial (junction -40 °C to +100 °C) – device grade U 0C to +100C (Industrial, E2 grade)
Supply Voltage Core [DATA_NEEDED: VCC/VCCP core voltage] —
Configuration Method FPGA configuration via serial/parallel flash, JTAG SRAM-based, loaded via JTAG / AS / PS
RoHS Compliance Compliant —
MSL Level [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Series — Arria 10 GX
Logic Elements — 1,150,000
User I/O Count — 480
Package Code — F45 (45 × 45 mm FCBGA)
Package Type — 1932-ball FCBGA (Flip-Chip BGA)
Process Technology — 20 nm TSMC
Transceiver Data Rate — Up to 28.05 Gbps
PCIe Hard IP — Gen3 x8/x16
Memory Interfaces — DDR4, DDR3, QDR IV, RLDRAM 3
Mounting Type — Surface Mount (BGA)
RoHS Status — Compliant
Lead-Free / Halogen-Free — Yes / Yes

Datasheets & Resources

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