10AX115U3F45E2SG - Arria 10 GX FPGA 1.15M LE FCBGA-1932 | Intel
MPN: 10AX115U3F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7250 | $7,250.00 |
| 10 | $6950 | $69,500.00 |
| 100 | $6480 | $648,000.00 |
| 500 | $6100 | $3,050,000.00 |
| 1,000 | $5800 | $5,800,000.00 |
Drop-in alternatives for 10AX115U3F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115U3F45E2LG
✅ Drop-In✓ In Stock
$8500 / Unit
View Datasheet →10AX115U2F45E2SG
✅ Drop-In✓ In Stock
$6920.66 / Unit
View Datasheet →10AX115U2F45E2LG
✅ Drop-In✓ In Stock
$7380 / Unit
View Datasheet →10AX115U2F45E1SG
✅ Drop-In✓ In Stock
$13900 / Unit
View Datasheet →10AX115S3F45E2SG
✅ Drop-In✓ In Stock
$6200 / Unit
View Datasheet →10AX115N3F45E2SG
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$3100 / Unit
View Datasheet →10AX115H2F34E2SG
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$5500 / Unit
View Datasheet →10AX115U3F45E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 (≈ 52.99 Mbit) |
| Maximum Transceiver Data Rate | 17.4 Gbps |
| DSP Blocks | Variable-precision, hardened floating-point |
| Hard Memory Controllers | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 IP Blocks | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| Package | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| Process Node | 20 nm Tri-Gate (Intel) |
| Speed Grade | -2 (E2 commercial/extended) |
| Operating Temperature | Industrial (junction -40 °C to +100 °C) – device grade U |
| Configuration Method | FPGA configuration via serial/parallel flash, JTAG |
| RoHS Compliance | Compliant |
10AX115U3F45E2SG 1932-ball fcbga (f45, 45×45 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 10AX115U3F45E2SG (1932-ball fcbga (f45, 45×45 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115U3F45E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115U3F45E2SG is suitable for 6 applications: 4K/8K Video Broadcast Infrastructure, 100G / 400G Line-Card Prototyping, Military Radar and Electronic-Warfare Systems, Medical Imaging Backplanes, High-Performance Test & Measurement Equipment, 5G Fronthaul / CPRI Aggregation.
4K/8K Video Broadcast Infrastructure
The 10AX115U3F45E2SG is well-suited to 4K/8K video broadcast routers, multi-viewers, and contribution encoders because its 96 × 17.4 Gbps transceivers aggregate multiple 12G-SDI, quad-link 3G-SDI, or 25G Ethernet streams into a single fabric without external PHY chips. With 1.15 M LE the device can implement up to 8 simultaneous 4Kp60 downscale/colorspace-conversion pipelines in parallel, while the 68.86 Mbit embedded memory acts as line buffers and frame stores to absorb 4K line-rate bursts. Hardened floating-point DSP slices deliver >1.5 TFLOPs for HDR tone-mapping and wavelet compression in real time. Designers typically place the device on a 12+ layer PCB with split PCIe Gen3 x8 lanes into a host CPU for control-plane ingest.
Recommended
100G / 400G Line-Card Prototyping
For 100G and early 400G Ethernet line-card prototyping, the 10AX115U3F45E2SG provides the SerDes, MAC, and PCS resources in a single chip. Its transceivers reach 17.4 Gbps per lane, allowing 4× lanes to build 40G and 10× lanes to build 100G using CAUI-10 / CAUI-4 optical interfaces. The two hard PCIe Gen3 x8 blocks connect to a host CPU or switch ASIC, while 427,200 ALMs implement 100G MAC/PCS/forwarding logic and RS-FEC. Two hard memory controllers drive external RLDRAM3 or DDR4 for packet-buffer memory. Power estimation at full load is approximately 35-40 W core, so a high-mass heatsink or forced-air cooling is required.
Recommended
Military Radar and Electronic-Warfare Systems
Radar and electronic-warfare subsystems benefit from the 10AX115U3F45E2SG’s hardened floating-point DSP, which delivers >1.5 TFLOPs of single-precision throughput for FFT-based pulse-Doppler processing, beamforming weight calculation, and digital-channelized receiver designs. The 96 × 17.4 Gbps transceivers aggregate multi-channel ADC data streams (such as the AD9164 and AD9680 families) at JESD204B/C rates, eliminating external PHY latency. Industrial operating temperature (-40 °C to +100 °C junction) supports rugged enclosures, while the F45 1932-ball FCBGA with controlled-impedance substrate accommodates long backplane traces. The 1.15 M LE additionally supports wide-bandwidth channelizer and FFT fabrics beyond 1 GHz of real-time bandwidth.
Recommended
Medical Imaging Backplanes
In medical imaging modalities such as CT, MRI ultrasound, and digital X-ray, the 10AX115U3F45E2SG acts as a high-throughput image-reconstruction engine. Its variable-precision DSP blocks accelerate back-projection, filtered back-projection (FBP), and iterative reconstruction algorithms, processing raw sensor data rates of 20+ Gbps from arrays of high-speed ADCs. The hard PCIe Gen3 blocks deliver reconstructed images to a workstation or storage array at line rate. The 68.86 Mbit embedded memory holds sinograms and intermediate matrices, while DDR4 controllers stream large volumetric datasets. Industrial temperature grade and high MTBF align with IEC 60601 reliability expectations for medical imaging equipment.
Recommended
High-Performance Test & Measurement Equipment
Test-and-measurement instruments such as high-end oscilloscopes, BERTs, and protocol analyzers rely on the 10AX115U3F45E2SG to process multi-Gbps serial data streams in real time. Its 17.4 Gbps transceivers support PCIe Gen3, USB 3.1 Gen2, SATA, and 10GbE backhaul lanes, while 1.15 M LE implement trigger logic, pattern generators, and protocol decoders. The 68.86 Mbit embedded memory provides deep acquisition memory between trigger events, and PCIe Gen3 hard IP connects to a host PC for waveform upload. Estimated dynamic power at full SerDes utilization is 25-30 W; the F45 FCBGA package requires a thermal-management strategy such as a 1+ sq-in copper pour plus a low-profile heatsink.
Recommended
5G Fronthaul / CPRI Aggregation
For 4G/5G fronthaul aggregation equipment, the 10AX115U3F45E2SG aggregates multiple CPRI / eCPRI links from remote radio heads (RRH) into baseband units (BBU). Its 17.4 Gbps transceivers run CPRI line rates up to option 9 (12.165 Gbps) or eCPRI 10G/25G Ethernet, while 1.15 M LE implement IQ data compression, packet timing alignment, and network synchronization. The two hard memory controllers buffer fronthaul traffic at line rate, and the industrial temperature range supports outdoor base-station enclosures. Multiple 10AX115U3F45E2SG parts can be stacked in a single shelf with the host CPU connected over PCIe Gen3 x8 for control-plane traffic.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115U3F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115U3F45E2LG | 10AX115U2F45E2SG | 10AX115S3F45E2SG | 10AX115U2F45E1SG |
|---|---|---|---|---|---|
| Package | FCBGA-1932 (F45, 45×45 mm) | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same | FCBGA-1932 (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68.86 Mbit | 68.86 Mbit | 68.86 Mbit | ≈65 Mbit (HPS reduces) | 68.86 Mbit |
| Maximum Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps |
| Die Variant | U3 (max transceivers) | U3 | U2 (fewer transceivers) | S3 (SoC with HPS) | U2 |
| Speed Grade | -2 (E2) | -2 (E2) | -2 (E2) | -2 (E2) | -1 (E1, slower) |
| Hardened HPS (ARM) | No | No | No | Yes (dual ARM Cortex-A9) | No |
| Hard PCIe Gen3 Blocks | 2 | 2 | 2 | 2 | 2 |
Key Differentiators
- Highest transceiver count in F45 FCBGA-1932 footprint (vs 10AX115U2F45E2SG)
- Industrial temperature grade vs commercial-only Stratix 10 (vs Stratix 10 SX)
- Drop-in F45 pin compatibility with SoC variant (vs 10AX115S3F45E2SG)
Design Notes
Estimated: The 10AX115U3F45E2SG core power at 100% transceiver utilization in a 100G line card reaches 35-40 W. The FCBGA-1932 F45 package requires a high-mass heatsink plus ≥ 4 sq-in of 2 oz copper pour on the top-side PCB land array. Without active airflow the junction temperature will exceed 100 °C in industrial enclosures; a 200-400 LFM heatsink or cold-plate is recommended. Use Quartus Prime PowerPlay early power estimator to model your specific workload.
Use a 14+ layer PCB with 1-oz copper on signal layers and 2-oz copper on core/power layers. Matched-impedance routing (100 Ω differential for transceivers, 50 Ω SE for general-purpose I/O) is mandatory; Intel provides Pin-Out Files and High-Speed Terps trade-off tool in Quartus Prime. Stitching vias on every transceiver ground ball reduce return-path inductance. Reference designators should leave at least 5 mm clearance around the FCBGA for BGA reballing and X-ray inspection.
The 10AX115U3F45E2SG requires multiple power rails: VCC (core), VCCP (PLL/periphery), VCCERAM (M20K), VCCPT (programmable core voltage), and per-bank VCCIO with separate VREF supplies. Power-on sequencing is critical - VCCPT and VCCAUX must precede or track VCC within 100 ms to avoid latch-up. Use a TI LM3881 or LTM4644 sequencer; failure to sequence will permanently damage the device. Bulk decoupling of 4× 470 µF polymer + 22 µF ceramic per rail is recommended.
Route transceiver channels on the top layer between the BGA breakout fan-out and the AC-coupling capacitors; length-match within 0.127 mm (5 mil) intra-pair and 5 mm inter-pair to keep skew within the eye budget. Use the Arria 10 EMIF Toolkit to validate DDR4 fly-by topology, with VTT termination at the end of each address/command byte lane. Keep configuration JTAG, MSEL, and POR traces short and isolated from high-speed SERDES lanes.
Common pitfalls include: (1) using incorrect BGA land pattern (use IPC-7351 nominal for F45, NOT the F34 smaller variant), (2) omitting dedicated JTAG pull-up/down resistors on TCK/TMS/TDO/TDI, (3) attempting to bitstream configuration from a non-Qualified Vendor List (QVL) flash - use only Micron/ISSI/Spansion parts in the Arria 10 Configuration User Guide, and (4) ignoring the device-Grade S/I temperature range in the MPN suffix - 'U' here indicates industrial-grade, NOT extended-grade 'E'.
Compliance Information
RoHS and REACH compliance declared on Intel/Altera product page material-attributes section. AEC-Q100 not applicable for high-complexity FPGA. Conflict-minerals (3TG) reporting compliant under the Dodd-Frank Act.
