10CL010YM164C8G vs 10CL010ZM164I8G Comparison

Detailed side-by-side comparison of 10CL010YM164C8G by Intel and 10CL010ZM164I8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10CL010YM164C8G 10CL010ZM164I8G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $12.10 $23.10
Family Cyclone 10 LP Cyclone 10 LP
Logic Elements 10,320 10,320
Embedded Memory 414 Kbit (M9K blocks) 423,936 bits (414 Kbits)
Embedded 18x18 Multipliers 56 46
PLLs 4 4 (per device, exact count [DATA_NEEDED: PLL count])
Maximum User I/Os 224 —
Process Node TSMC 60 nm low-power —
Core Voltage 1.0 V nominal (range 1.0 V to 1.1 V) 1.0 V (typical), 1.2 V I/O banks
Speed Grade -8C (commercial, 8 speed grade) —
Package 164-ball MBGA (Micro BGA, 8x8 mm) 164-ball MBGA (FineLine BGA, M164)
Operating Junction Temperature 0 C to +85 C (commercial) —
Configuration Method SRAM-based, JTAG/AS/AP/PS —
Transceivers None (general-purpose FPGA, no high-speed SERDES) —
Hard PCIe Controller 1x PCIe Gen1 (x1/x2 root port or endpoint) —
Mounting Type Surface Mount (BGA) —
RoHS Status Compliant Compliant
MSL Level 3 (per JEDEC J-STD-020) —
Lead-Free Yes —
Maximum User I/O — 101
Operating Temperature — -40C to +100C (Industrial)
Process Technology — 60 nm low-power CMOS
Configuration Modes — PS, FPP, JTAG
I/O Standards — LVTTL, LVCMOS, LVDS, SSTL, HSTL
External Memory Support — DDR2, DDR3, LPDDR2 (via soft IP)
Packaging — Tray (I8G suffix)

Datasheets & Resources

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