10M08DAF484C8G vs 10M25DAF484C8G Comparison
Detailed side-by-side comparison of 10M08DAF484C8G by Intel and 10M25DAF484C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M08DAF484C8G | 10M25DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $27.65 | $50.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 8000 | — |
| Embedded Memory | 387,072 bits (378 Kbits) | — |
| User Flash | 1,540 Kbits | — |
| Maximum User I/O | 250 | — |
| ADC | 8-channel, 12-bit | Integrated 12-bit ADC (where enabled) |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| Process Technology | 55 nm | 55 nm CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage | 1.2 V to 3.3 V | — |
| Package | 484-ball FBGA (FineLine BGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Speed Grade | -C8 | -8 |
| Operating Junction Temperature | -40 C to +100 C (industrial) | — |
| Configuration | Internal flash, dual-configuration, RSU support | — |
| DSP Blocks | Yes | — |
| RoHS Status | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Mounting Type | — | Surface Mount |
| Operating Temperature | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| MSL Level | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |