10M08DAF484C8G vs 10M25DAF484C8G 对比

详细并排对比 10M08DAF484C8G 出自 Intel 和 10M25DAF484C8G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10M08DAF484C8G 10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G - MAX 10 FPGA, 8K LEs, 484-FBGA | Intel

10M08DAF484C8G ✓ 量产中

规格对比

参数 10M08DAF484C8G 10M25DAF484C8G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $27.65 $50.00
Family MAX 10 MAX 10
Logic Elements (LE) 8000 —
Embedded Memory 387,072 bits (378 Kbits) —
User Flash 1,540 Kbits —
Maximum User I/O 250 —
ADC 8-channel, 12-bit Integrated 12-bit ADC (where enabled)
PLLs 2 Yes (up to 4 analog PLLs per device)
Process Technology 55 nm 55 nm CMOS
Core Voltage 1.2 V —
I/O Bank Voltage 1.2 V to 3.3 V —
封装 484-ball FBGA (FineLine BGA) 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch
Speed Grade -C8 -8
工作结温 -40 C to +100 C (industrial) —
Configuration Internal flash, dual-configuration, RSU support —
DSP Blocks Yes —
RoHS 状态 Compliant Compliant
Logic Elements — 25,000
Embedded Memory (Kbits) — 1638
User I/O Count — 360
Core Supply Voltage (VCCINT) — 1.2 V (1.15 V min / 1.25 V max)
安装类型 — Surface Mount
工作温度 — 0 °C to 85 °C (Commercial)
Configuration Memory — On-chip dual-configuration flash
MSL 等级 — MSL3
Number of I/O Banks — 8 (per F484 pinout)

数据手册与资源

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