10M16DCU324C8G - MAX 10 FPGA 16K LE 246 I/O 324-UBGA | Intel
MPN: 10M16DCU324C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.87 | $47.87 |
| 10 | $44.5 | $445.00 |
| 100 | $42.1 | $4,210.00 |
| 500 | $40.05 | $20,025.00 |
| 1,000 | $38.4 | $38,400.00 |
10M16DCU324C8G Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, configurable routing, and I/O cells that can be programmed to implement arbitrary digital functions after PCB assembly. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor), offering higher density and performance than CPLDs while remaining more flexible than ASICs. The MAX 10 family adds an on-die flash configuration memory, eliminating external boot PROMs and enabling single-chip instant-on designs.
Key features include integrated dual-configuration flash, on-chip ADC, 246 GPIO, embedded 18x18 multipliers, and DSP blocks supporting up to 45 GMACs. The 324-UBGA package provides a compact 15x15 mm footprint with 1.0 mm ball pitch suitable for moderate-density board designs, and is compatible with Intel Quartus Prime design software for synthesis, place-and-route, and timing closure.
The MAX 10 architecture pairs a LUT-based logic fabric with hard memory blocks (M9K), DSP blocks, and PLL/IO peripherals, giving a balanced trade-off between logic density, signal-processing throughput, and static power consumption. Compared with SRAM-based FPGAs, the 10M16DCU324C8G eliminates external boot memory and reduces BOM cost in low-to-mid volume products.
Typical applications include industrial motor control and I/O aggregation, video bridging and display controllers, automotive driver-assistance subsystems, portable test and measurement equipment, and factory automation controllers. Its instant-on capability also suits power-sequencer replacement for legacy CPLDs.
When designing with this device, ensure the PCB accommodates 1.0 mm BGA ball pitch and that the Intel Quartus Prime pin assignment files match the U324 pinout. Verify junction temperature against the application note thermal model when operating at maximum toggle rates and elevated ambient temperatures.
This page synthesizes distributor pricing, drop-in MAX 10 alternatives from Intel's own family, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference.
Drop-in alternatives for 10M16DCU324C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M16DCU324C8G (same form factor and footprint) — differing in Package, Configuration Memory, Speed Grade, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16DAU324C8G
✅ Drop-In✓ In Stock
$35.4 / Unit
View Datasheet →10M16DCU324C7G
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
10M16DCU324A7G
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$34.95 / Unit
View Datasheet →10M16DAU324I7P
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$51.2 / Unit
View Datasheet →10M16DCF484C8G
✅ Drop-In✓ In Stock
$35.8 / Unit
View Datasheet →10M16DCU324C8G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Logic Elements (LE) | 16,000 |
| User Flash Memory | 562,176 bits |
| Maximum User I/O | 246 |
| Package | 324-LFBGA / 324-UBGA (U324) 15x15 mm |
| Ball Pitch | 1.0 mm |
| Speed Grade | 8 |
| Temperature Grade | Commercial (0C to +85C) |
| Configuration Memory | Internal flash (non-volatile) |
| DSP Blocks | Yes (18x18 multipliers) |
| On-chip ADC | Yes (MAX 10 integrated) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10M16DCU324C8G 324-lfbga / 324-ubga (u324) 15x15 mm Pin Configuration Guide
Pin configuration for 10M16DCU324C8G (324-lfbga / 324-ubga (u324) 15x15 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCU324C8G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M16DCU324C8G is suitable for 6 applications: Industrial Motor Control, Video Bridging and Display Controllers, Automotive Driver-Assistance Subsystems, Portable Test and Measurement Equipment, Factory Automation Controllers, Legacy CPLD Replacement and Power Sequencing.
Industrial Motor Control
The 10M16DCU324C8G is well suited for industrial motor-control boards where 246 GPIO and DSP blocks drive PWM generation, encoder feedback capture, and current-loop computation. Its 16,000 logic elements comfortably host position/speed state machines plus Modbus or CANopen protocol stacks in parallel. The integrated ADC samples shunt currents directly without an external analog front end. The non-volatile flash configuration eliminates boot-PROM failure modes common in vibration-heavy factory environments, while the 1.0 mm BGA ball pitch survives industrial thermal-cycling profiles with proper PCB pad-finish selection.
Recommended
Video Bridging and Display Controllers
With 246 GPIO and 16K LE, the 10M16DCU324C8G bridges parallel RGB/MIPI/TTL display buses, performs color-space conversion, and generates timing controller (TCON) signals in mid-size LCD panels. The MAX 10 DSP blocks execute scaling and gamma correction in real time without external ASICs. The instant-on non-volatile configuration suits displays that must wake within milliseconds of power-up, eliminating visible boot delay. Quartus Prime IP libraries provide reference designs for HDMI-to-LVDS bridging that drop directly into this device's fabric and pin map.
Recommended
Automotive Driver-Assistance Subsystems
Within ADAS sensor-fusion pre-processors, the 10M16DCU324C8G aggregates data from ultrasonic, camera, and radar interfaces into a unified high-speed link to the main SoC. The 246 GPIO comfortably route multiple LVDS pairs plus parallel sensor buses. Dual-configuration flash supports fail-safe firmware rollback for functional-safety workflows. The MAX 10 ADC monitors supply rails and temperature zones in real time. Engineers should pair this FPGA with the -I (industrial) or -A (automotive) temperature grades for under-hood or cabin deployments; the commercial-grade C8G part is restricted to cabin or test fixtures.
Recommended
Portable Test and Measurement Equipment
Handheld oscilloscopes, logic analyzers, and protocol testers leverage the 10M16DCU324C8G's 16K LE for real-time sample buffering and protocol-decode engines. The 246 GPIO support multi-channel parallel acquisition with FPGA-side trigger logic. The on-chip ADC eliminates a separate analog front-end IC, reducing BOM and PCB area critical for portable form factors. Instant-on boot from internal flash matches the rapid power-up expectation of field engineers, and the U324 package offers sufficient thermal headroom for sustained full-speed acquisition at room temperature.
Recommended
Factory Automation Controllers
Distributed I/O modules and PLC sub-systems rely on the 10M16DCU324C8G to consolidate 24V industrial bus interfaces, including digital inputs, relay outputs, and isolated serial links into a single programmable device. The 246 GPIO allow direct connection to multiple 16-point I/O cards without expansion muxes. Embedded DSP blocks execute PID loops and motion-control math in firmware-reconfigurable logic, enabling field upgrades without board respins. The non-volatile boot ensures deterministic cold-start behavior essential for IEC 61131-3 PLC runtime predictability, and the commercial temperature grade suits control-cabinet environments.
Recommended
Legacy CPLD Replacement and Power Sequencing
The 10M16DCU324C8G serves as a feature-rich upgrade path for legacy CPLD-based power sequencers in networking and server hardware, where it adds instant-on boot, embedded flash storage of sequencing tables, and on-die ADC for voltage rail monitoring. The 16K LE support complex multi-rail sequencing with adaptive timing and fault logging, exceeding typical CPLD densities. Migration preserves the existing U324 PCB footprint, eliminating board respins. Quartus Prime's compatibility mode imports legacy CPLD designs and remaps them into MAX 10 primitives with minimal code changes.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCU324C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16DAU324C8G | 10M16DCU324C7G | 10M16DCU324A7G | 10M16DAU324I7P |
|---|---|---|---|---|---|
| Package | 324-LFBGA (U324) 15x15 mm | 324-LFBGA (U324) 15x15 mm - same | 324-LFBGA (U324) 15x15 mm - same | 324-LFBGA (U324) 15x15 mm - same | 324-LFBGA (U324) 15x15 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Series | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| User I/O | 246 | 246 | 246 | 246 | 246 |
| Speed Grade | 8 | 8 | 7 | 7 | 7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Industrial | Industrial |
| Configuration Flash Type | Dual (D) | Analog (A) | Dual (D) | Dual (D) | Analog (A) |
Key Differentiators
- Dual-configuration flash for fail-safe boot (vs 10M16DAU324C8G)
- Highest speed grade -8 in MAX 10 16K LE family (vs 10M16DCU324C7G)
- Commercial temperature grade with 246 GPIO in U324 (vs 10M16DAU324I7P)
Design Notes
The 324-UBGA package uses 1.0 mm ball pitch and requires a 4-layer or 6-layer PCB stack-up with microvia or via-in-pad technology for reliable assembly. Use NSMD (non-solder-mask-defined) land pads with ENIG or OSP surface finish. Maintain a 0.5 mm clearance between BGA balls and inner-plane antipads. Refer to Intel AN 484 (MAX 10 Hardware Design Guide) for stack-up and routing recommendations.
Estimated: at maximum toggle rate (16 LE per GPIO, 246 GPIO) the device can dissipate 1.5-2.0 W. The U324 package theta_JA is approximately 25 C/W (with 4-layer JEDEC test board), yielding a junction-to-ambient rise of 38-50 C. Commercial-grade parts must keep Tj below 100 C - no heatsink required for typical designs, but ensure the PCB copper pour covers at least 500 mm^2 of inner ground plane beneath the BGA.
Do not confuse the MAX 10 'D' (Dual-configuration) variant with the 'A' (Analog) variant - they share the same package but differ in flash size and ADC configuration. The Quartus Prime pin assignment file (.qsf) is package-specific but device-specific; switching between D and A variants requires regenerating the .qsf. Also note that the 'C' suffix in C8G/C7G denotes Commercial temperature grade, while 'I' denotes Industrial - confirm ambient requirements before substitution.
Compliance Information
RoHS and lead-free per Intel product page. Not AEC-Q100 qualified; commercial temperature grade only. Reach and conflict-minerals status inferred from Intel's published compliance statements.
