10M25DAF256C8G vs 10M25DAF256I7G Comparison
Detailed side-by-side comparison of 10M25DAF256C8G by Intel and 10M25DAF256I7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF256C8G | 10M25DAF256I7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $45.30 | $60.30 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 1,728 Kbits | 691,200 bits (1,638 Kbit) |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Package | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Speed Grade | C8 | 7 |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V (with 2.5 V analog supply) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| User I/Os | — | 178 |
| Process Technology | — | 55 nm |
| Operating Temperature | — | -40 °C to +100 °C (Industrial) |
| Embedded Multipliers (18x18) | — | 45 |
| User Flash | — | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | — | Yes, 12-bit SAR |
| Configuration Method | — | On-chip non-volatile flash (CFM) |
| Supply Configuration | — | Dual-supply (DAF sub-family) |