10M25DAF256C8G vs 10M25DAF256I7G Vergleich
Detaillierter Direktvergleich von 10M25DAF256C8G von Intel und 10M25DAF256I7G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10M25DAF256C8G | 10M25DAF256I7G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $45,30 | $60,30 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 1,728 Kbits | 691,200 bits (1,638 Kbit) |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Gehäuse | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Speed Grade | C8 | 7 |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V (with 2.5 V analog supply) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| User I/Os | — | 178 |
| Process Technology | — | 55 nm |
| Betriebstemperatur | — | -40 °C to +100 °C (Industrial) |
| Embedded Multipliers (18x18) | — | 45 |
| User Flash | — | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | — | Yes, 12-bit SAR |
| Configuration Method | — | On-chip non-volatile flash (CFM) |
| Supply Configuration | — | Dual-supply (DAF sub-family) |