10M25DAF256C8G vs 10M25DAF256I7G Comparación
Comparación detallada lado a lado de 10M25DAF256C8G por Intel y 10M25DAF256I7G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10M25DAF256C8G | 10M25DAF256I7G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $45,30 | $60,30 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 1,728 Kbits | 691,200 bits (1,638 Kbit) |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | 4 |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Encapsulado | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-FBGA (FineLine BGA) |
| Speed Grade | C8 | 7 |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V (with 2.5 V analog supply) |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| User I/Os | — | 178 |
| Process Technology | — | 55 nm |
| Temperatura de funcionamiento | — | -40 °C to +100 °C (Industrial) |
| Embedded Multipliers (18x18) | — | 45 |
| User Flash | — | 2,048 Kbit (2 KB per CFM block) |
| Integrated ADC | — | Yes, 12-bit SAR |
| Configuration Method | — | On-chip non-volatile flash (CFM) |
| Supply Configuration | — | Dual-supply (DAF sub-family) |