10M25DAF484A7G vs 10M25DAF484C8G Comparison
Detailed side-by-side comparison of 10M25DAF484A7G by Intel and 10M25DAF484C8G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M25DAF484A7G | 10M25DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.75 | $50.00 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Package | 484-ball BGA | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +125C (automotive) | 0 °C to 85 °C (Commercial) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip dual-configuration flash |
| PLLs | 8 | Yes (up to 4 analog PLLs per device) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | — |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Speed Grade | — | -8 |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| MSL Level | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |